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公开(公告)号：JP2001313362A
公开(公告)日：2001-11-09
申请号：JP2000130529
申请日：2000-04-28
Applicant: MITSUI HIGH TEC
Inventor： FUKUI ATSUSHI , TSUJIMOTO KEIICHI , MICHIYOSHI YUICHI
Abstract: PROBLEM TO BE SOLVED: To obtain a chip-size semiconductor device, employing a highly reliable lead frame in which the outer connection terminals have high positional accuracy and bonding work to a semiconductor chip is carried out with high workability, without causing deformation of the lead at the time of die bonding. SOLUTION: In a semiconductor device, where a semiconductor chip and leads are connected electrically and resin sealed and the bottom face of the lead, is exposed from the resin seal, the semiconductor chip 1 and the leads 2 are connected via bumps 7, the lead 2 is formed thin 4 on the outside part in the resin seal 3 and the thick inside part 6 thereof has a bottom face exposed from the resin seal to constitute an outer connection terminal.
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公开(公告)号：JP2001308357A
公开(公告)日：2001-11-02
申请号：JP2000121921
申请日：2000-04-24
Applicant: MITSUI HIGH TEC
Inventor： FUKUI ATSUSHI , KIMOTO KEISUKE
IPC: H01L31/04
Abstract: PROBLEM TO BE SOLVED: To provide a solar cell of high quality and high efficiency, capable of solving an electric short-circuit problem completely in the assembly process and produced at high yield. SOLUTION: A plurality of spherical diodes 10a are half buried and fixed in a thermoplastic resin 13 and exposed portions of the spherical diodes 10a, are etched to expose the first conductivity diffusion layer regions 11 inside the spherical diodes 10a. A metal film 14 having good wettability to a conductive paste 15 is selectively formed on the whole or the exposed portions of the first conductivity diffusion layer regions 11. The spherical diodes 10a are released from the fixed state and are placed on a conductive substrate 16 coated with the conductive paste 15. The conductive substrate 16 with the spherical diodes 10a placed thereon is bented to melt the conductive paste 15. The spherical diodes 10a are collected and an insulting layer 18 is formed on the spherical diodes 10a. A transparent conductive film 17 is deposited on the spherical diodes 10a so as to cover the second conductivity diffusion layer region 12 and the insulating layer 18.
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公开(公告)号：JP2001177132A
公开(公告)日：2001-06-29
申请号：JP35818099
申请日：1999-12-16
Applicant: MITSUI HIGH TEC
Inventor： FUKUI ATSUSHI , KIMOTO KEISUKE , ISHIDA KEN
IPC: H01L31/04
Abstract: PROBLEM TO BE SOLVED: To provide a solar battery which has a high reliability and can be reduced in size and can be easily formed with contacts and has a little variation in characteristics by precisely and efficiently cutting globular bodies. SOLUTION: A method of manufacturing the solar battery includes a process of spreading globular bodies in a row all over a tray, a process of filling the tray with resin and then hardening the resin together with the spread globular bodies to fasten these globular bodies into one unit, a process of positioning the globular bodies while they are fastened with the resin and then cutting the globular bodies so that a cutting face may pass through the center of each globular body, a process of pasting a tape onto the cutting face, and a process of removing the resin while the globular bodies are fixed with the tape to form semi-globular bodies.
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公开(公告)号：JP2001177121A
公开(公告)日：2001-06-29
申请号：JP35817999
申请日：1999-12-16
Applicant: MITSUI HIGH TEC
Inventor： FUKUI ATSUSHI , KIMOTO KEISUKE , ISHIDA KEN
Abstract: PROBLEM TO BE SOLVED: To enable a solar cell to be enhanced in photoelectromotive force per unit area so as to provide the solar cell which is small in size and high in efficiency. SOLUTION: A cell is composed of a first conductivity semiconductor spherical substrate 11, a second conductivity semiconductor layer 12 possessed of a pn junction and formed on the spherical substrate 11, and an outer electrode 13 of transparent conductive film which is formed on the semiconductor layer 12. A large number of cells are prepared, the cells are spread in a tray, and an adhesive tape 20 is fixed on the top surfaces of the cells. The cells pasted on the adhesive tape 20 are taken out of the tray and arranged in a horizontal position to make the cells located above the tape 20, and solder powder 39 is dusted over the cells. The cells are heated to fix the cells to the adhesive tape 20 with solder 3 in a fixing process, the adhesive tape 20 is removed off, and solder is etched. An outer electrode and a second conductivity semiconductor layer are selectively removed from an adhesive tape pasted side using solder as a mask, a first conductivity semiconductor layer is exposed, and an inner electrode is formed coming into contact with the first conductivity semiconductor layer.
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公开(公告)号：JP2000038665A
公开(公告)日：2000-02-08
申请号：JP20653898
申请日：1998-07-22
Applicant: MITSUI HIGH TEC
Inventor： FUKUI ATSUSHI , SHIMAZU HIROSHI , KUBO KIMIHIKO
Abstract: PROBLEM TO BE SOLVED: To provide an electrode forming device improving the adhesion of an electrode and moreover effective for reducing the production cost and to provide an electrode forming method. SOLUTION: An electrode is formed by sputtering, and, by arranging a mask 108 having an opening part 110 in accordance with the shape of the electrode on the space between a target 106 and a substrate 100, the formation of the electrode is made possible. An anode at the lower part of a chamber is mounted with the substrate 100, a mask 108 is arranged in the upper direction of the substrate 100, the target 106 is fixed to a cathode provided on the upper part of the chamber, and AC voltage is applied to the space between the anode and the cathode to generate plasma. Then, target atoms are beaten out by the generated plasma, and the electrode is formed on a wiring pattern exposed from the opening part 110.
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Patent Agency Ranking
公开(公告)号：JP2000031337A
公开(公告)日：2000-01-28
申请号：JP21187498
申请日：1998-07-10
Applicant: MITSUI HIGH TEC
Inventor： FUKUI ATSUSHI , FUKUDA KENICHI , UMEDA KAZUHIKO , MATSUNAGA KIYOSHI
Abstract: PROBLEM TO BE SOLVED: To obtain a substrate which does not produce fiber burrs, has a good plating property and a light weight, can be manufactured at a low cost, and can be disposed easily as an industrial waste by coating the front and rear surfaces of a thin heat-resistant synthetic resin plate material mixed with a fine nonconductive powder filler with metallic foil. SOLUTION: A substrate 10 is composed of a sheet material 11 and copper foil 12 and 13 and the material 11 is prepared by mixing a filler 15 composed of fine SiO2 power which is one kind of fine nonconductor powder in a polyethylene resin 14 which is one of heat-resistant synthetic resin materials. The filler 15 has an average particle diameter of 0.5-3 μm and the mixing ratio of the filler 15 is adjusted to 10-90 pts.vol. against 100 pts.vol. material 11. Therefore, no fibrous burrs are produced on the substrate 10 and through holes can be formed easily through the substrate 10 by punching, etc. In addition, the substrate 10 has a light weight and can be manufactured at a low cost. Moreover, the substrate 10 can be disposed relatively easily as an industrial waste, since the substrate does not contain any glass cloth.
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公开(公告)号：JPH10270581A
公开(公告)日：1998-10-09
申请号：JP9296697
申请日：1997-03-26
Applicant: MITSUI HIGH TEC
Inventor： MATSUBARA TOSHIYA , FUKUI ATSUSHI
IPC: H01L23/00
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device on which the letter on the surface of a semiconductor element can be seen easily, and the damage such as cracks, etc., on the semiconductor element can be prevented. SOLUTION: This semiconductor device is provided with a semiconductor element 11 with an insulated circuit, an interposer 12, which forms an electric continuity circuit by connecting to the electrode pads 12b of the semiconductor element 11, and solder balls 13 arranged on each connection terminal of the interposer 12. A coated film layer 14, consisting of colored synthetic resin, is formed at least on the printed region of the exposed semiconductor element 11.
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公开(公告)号：JP2552943B2
公开(公告)日：1996-11-13
申请号：JP16927590
申请日：1990-06-27
Applicant: MITSUI HIGH TEC
Inventor： FUKUI ATSUSHI , NOZUMI ATSUO , DAIMARU HIROFUMI , SHIBATA MUNEYA
IPC: H01L23/50
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公开(公告)号：JPH08139228A
公开(公告)日：1996-05-31
申请号：JP30307594
申请日：1994-11-11
Applicant: MITSUI HIGH TEC
Inventor： FUKUI ATSUSHI , TAKAI KEIJI , NAKAJIMA TAKASHI , TATEISHI KOJI
Abstract: PURPOSE: To improve productivity and reliability and allow the use of conventional molding equipment by performing resin sealing by using a molding die without using potting resin. CONSTITUTION: A prescribed integrated circuit element 12 is bonded with conductive adhesive 30 on the element mounting part at the center of an integrated circuit mounting board 11, and the pad part on the integrated circuit element 12 is bonded with each wire bonding part 19 which is opened by a wiring hole 20 on a lead pattern 18 by bonding wire 31. Resin sealing is performed by putting the resin sealing part in the prescribed molding die. Then, ball solder 13 is formed at a ball solder forming part which is exposed at the bottom in lattice-shape. Thus, sealing resin body 14 is uniformly formed and a plurality of semiconductor device are manufactured at one time.
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公开(公告)号：JPH0828457B2
公开(公告)日：1996-03-21
申请号：JP28622890
申请日：1990-10-24
Applicant: MITSUI HIGH TEC
Inventor： FUKUI ATSUSHI
IPC: H01L23/50
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