Abstract:
PROBLEM TO BE SOLVED: To provide a compound substrate which is affixed with a piezoelectric substrate and a support substrate to each other via an organic adhesive layer, and a formation method which allows the formation of a desired metal pattern with high accuracy by using lift-off processing. SOLUTION: A composite substrate 10 is obtained, by bonding the piezoelectric substrate 11 transparent to light used for photolithography and the supporting substrate 12 for supporting the piezoelectric substrate 11 via the organic adhesive layer 13. At least one among the support substrate 12 and the organic adhesive layer 13 of the composite substrate 10 can absorb light which is used for photolithography. This allows, in the compound substrate 10, a desired metal pattern to be formed on a surface of the piezoelectric substrate by lift-off processing using photolithography. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To suppress chipping of an edge part of a piezoelectric substrate of a compound substrate formed by sticking the piezoelectric substrate and a support substrate together when a surface of the piezoelectric substrate is processed with polishing abrasive grains. SOLUTION: A silicon substrate 12 is prepared, and also an LT substrate is prepared which has an external diameter taking of a margin corresponding to a position shift made in sticking into consideration for a length obtained by subtracting a beveled part from the external diameter of the silicon substrate 12 (Fig.5(a)). Then the LT substrate 10 has its backsides coated with an organic adhesive 13 and is stuck on the silicon substrate 12 to form a stuck substrate 16 (Fig.5(b)). Further, slurry containing polishing abrasive grains is supplied to between a surface of the LT substrate 10 and a polishing surface plate and the surface of the LT substrate 10 is polished by the polishing surface plate to polish the surface into a mirror plane while reducing the thickness of the LT substrate 10 (Fig.5(c)). COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To attain a stable receiver sensitivity by suppressing level fluctuation of a demultiplexed light beam even in the occurrence of change in the refractive index of component members and change in temperature. SOLUTION: A first optical device 10A has an optical fiber mount 12 with an optical fiber 26 disposed thereon, and an optical demultiplexer 14 for demultiplexing a portion of an optical signal beam 34 transmitted through the optical fiber 26, and guiding the demultiplexed optical signal beam 38 out of the optical fiber 26. The optical fiber 26 has a first tapered surface 70 for emitting the demultiplexed optical signal beam 38 therethrough. The first tapered surface 70 is inclined at an angle θ1 of at least 1° to an optical axis of the optical fiber 26. The distance h between the optical axis of the optical fiber 26 and the first tapered surface 70 is progressively greater along the direction in which the optical signal beam 34 travels through the optical fiber 26. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To promote small size various optical communication equipment etc., mounted with an optical device by reducing the size and thickness of the optical device. SOLUTION: The optical device 10 has a base 12, an optical component 14 which is mounted on the base 12 and has at least one element, and a transparent gap member 16 which is fixed onto the base 12 to cover the optical component 14 and is a single body and transparent. Then the angle θ between the bottom 22a and side wall 22b of a recessed portion 22 is ≤90° and and the boundary 22c between the bottom 22a and side wall 22b of the recessed portion 22 is curved. Further, the depth (h) of the recessed portion 22 is ≤1.0 mm. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide optical parts which have a small coupling loss, a long life, and a high reliability by reducing a gap generated between an end face of an optical fiber block and an end face of an optical element block as much as possible and to provide a method of manufacturing the same. SOLUTION: Optical parts 10 are constituted of an optical fiber block 12 and an optical element block 14. The optical fiber block 12 is constituted of a substrate 16, V grooves 18 formed in the substrate 16, an optical fiber array 22 of optical fibers 20 stored in the V grooves 18 respectively, and a retaining member 24 for holding the optical fiber array 22 together with the substrate 16. The optical element block 14 is constituted of a substrate 30, a ceramic substrate 32 formed on the substrate 30, and an optical element array 36 of optical elements 34 formed on the ceramic substrate 32. The substrate 16 and the substrate 30 are stuck at spot welding points 42 formed by YAG laser. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To make it possible for two 4-channel transceivers having a transmission diode string and a reception diode string installed separately to use a single 8-fiber ribbon. SOLUTION: An optical head has an optical head main body 40 having a proximal surface and a distal surface, and eight optical fiber segments 48 are extended via the main body 40. The respective segments 48 have fiber end parts at respective proximal surface and distal surface. The fiber end parts at the proximal surfaces are grouped into two fiber end part strings consisting of four fiber end parts which are equally separated from each other to be positioned respectively optically by a transmission chip 26 and a reception chip 28. The fiber end pars at the distal surface consist of a single string of the eight fiber end parts equally separated from each other.
Abstract:
PROBLEM TO BE SOLVED: To excellently drive each light emitting element of a parallel optical link. SOLUTION: While a laser diode array 41 is driven, a thermistor 121 positioned near the array 41 measures the temperature at its vicinity, and inputs the obtained temperature information A to a temperature control circuit 122. The circuit 122 generates a current control signal B which controls the current generated from an LD driver 42 in accordance with the information A. Upon receiving the signal B, the driver 42 controls the driving current C of the array 41 in accordance with the signal B.
Abstract:
A composite substrate for a semiconductor includes a handle substrate 11 and a donor substrate bonded to a surface of the handle substrate 11 directly or through a bonding layer. The handle substrate 11 is composed of an insulating polycrystalline material, a surface 15 of the handle substrate 11 has a microscopic central line average surface roughness Ra of 5 nm or smaller, and recesses 6 are formed on the surface of the handle substrate.