Composite substrate and method for forming metal pattern
    51.
    发明专利
    Composite substrate and method for forming metal pattern 有权
    复合基材和形成金属图案的方法

    公开(公告)号:JP2010171392A

    公开(公告)日:2010-08-05

    申请号:JP2009282894

    申请日:2009-12-14

    Abstract: PROBLEM TO BE SOLVED: To provide a compound substrate which is affixed with a piezoelectric substrate and a support substrate to each other via an organic adhesive layer, and a formation method which allows the formation of a desired metal pattern with high accuracy by using lift-off processing. SOLUTION: A composite substrate 10 is obtained, by bonding the piezoelectric substrate 11 transparent to light used for photolithography and the supporting substrate 12 for supporting the piezoelectric substrate 11 via the organic adhesive layer 13. At least one among the support substrate 12 and the organic adhesive layer 13 of the composite substrate 10 can absorb light which is used for photolithography. This allows, in the compound substrate 10, a desired metal pattern to be formed on a surface of the piezoelectric substrate by lift-off processing using photolithography. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:通过有机粘合剂层提供固定有压电基板和支撑基板的复合基板,以及允许通过以下方式形成所需金属图案的形成方法:通过 使用剥离处理。 解决方案:通过将压电基板11透明地粘合到用于光刻的光和通过有机粘合层13支撑压电基板11的支撑基板12,获得复合基板10.至少一个支撑基板12 并且复合基板10的有机粘合层13能够吸收用于光刻的光。 这在复合基板10中允许通过使用光刻的剥离处理在压电基板的表面上形成期望的金属图案。 版权所有(C)2010,JPO&INPIT

    Method of manufacturing compound substrate, and compound substrate
    52.
    发明专利
    Method of manufacturing compound substrate, and compound substrate 有权
    制造复合基材的方法和化合物基材

    公开(公告)号:JP2010153961A

    公开(公告)日:2010-07-08

    申请号:JP2008326879

    申请日:2008-12-24

    Abstract: PROBLEM TO BE SOLVED: To suppress chipping of an edge part of a piezoelectric substrate of a compound substrate formed by sticking the piezoelectric substrate and a support substrate together when a surface of the piezoelectric substrate is processed with polishing abrasive grains.
    SOLUTION: A silicon substrate 12 is prepared, and also an LT substrate is prepared which has an external diameter taking of a margin corresponding to a position shift made in sticking into consideration for a length obtained by subtracting a beveled part from the external diameter of the silicon substrate 12 (Fig.5(a)). Then the LT substrate 10 has its backsides coated with an organic adhesive 13 and is stuck on the silicon substrate 12 to form a stuck substrate 16 (Fig.5(b)). Further, slurry containing polishing abrasive grains is supplied to between a surface of the LT substrate 10 and a polishing surface plate and the surface of the LT substrate 10 is polished by the polishing surface plate to polish the surface into a mirror plane while reducing the thickness of the LT substrate 10 (Fig.5(c)).
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 解决的问题:为了抑制当用抛光磨粒加工压电基片的表面时,通过将压电基片和支撑基板粘在一起而形成的复合基板的压电基板的边缘部分的碎裂。 解决方案:制备硅衬底12,并且还制备LT衬底,其具有对应于在考虑到通过从外部减去斜面部分而获得的长度时所产生的位置偏移的边缘的外径 硅衬底12的直径(图5(a))。 然后,LT基板10的背面涂有有机粘合剂13,并粘贴在硅基板12上,形成粘贴的基板16(图5(b))。 此外,将含有抛光磨粒的浆料供给到LT基板10的表面和研磨面板之间,并且通过研磨面板抛光LT基板10的表面,将表面研磨成镜面,同时减小厚度 的LT基板10(图5(c))。 版权所有(C)2010,JPO&INPIT

    Optical device
    53.
    发明专利
    Optical device 有权
    光学装置

    公开(公告)号:JP2007233341A

    公开(公告)日:2007-09-13

    申请号:JP2006342852

    申请日:2006-12-20

    CPC classification number: G02B6/29368 G02B6/2938 G02B6/4214 G02B6/4246

    Abstract: PROBLEM TO BE SOLVED: To attain a stable receiver sensitivity by suppressing level fluctuation of a demultiplexed light beam even in the occurrence of change in the refractive index of component members and change in temperature. SOLUTION: A first optical device 10A has an optical fiber mount 12 with an optical fiber 26 disposed thereon, and an optical demultiplexer 14 for demultiplexing a portion of an optical signal beam 34 transmitted through the optical fiber 26, and guiding the demultiplexed optical signal beam 38 out of the optical fiber 26. The optical fiber 26 has a first tapered surface 70 for emitting the demultiplexed optical signal beam 38 therethrough. The first tapered surface 70 is inclined at an angle θ1 of at least 1° to an optical axis of the optical fiber 26. The distance h between the optical axis of the optical fiber 26 and the first tapered surface 70 is progressively greater along the direction in which the optical signal beam 34 travels through the optical fiber 26. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:即使在组件的折射率变化和温度变化的发生中,通过抑制解复用光束的电平波动来获得稳定的接收灵敏度。 解决方案:第一光学装置10A具有设置有光纤26的光纤支架12和用于对通过光纤26透射的光信号光束34的一部分进行解复用的光解复用器14,并且引导解复用 光纤26中的光信号光束38.光纤26具有用于发射经过解复用的光信号光束38的第一锥形表面70。 第一锥形表面70以与光纤26的光轴成至少1°的角度θ1倾斜。光纤26的光轴与第一锥形表面70之间的距离h沿着方向 其中光信号光束34穿过光纤26。版权所有(C)2007,JPO&INPIT

    Optical device and device for optical monitoring
    54.
    发明专利
    Optical device and device for optical monitoring 审中-公开
    光学装置和用于光学监测的装置

    公开(公告)号:JP2006267154A

    公开(公告)日:2006-10-05

    申请号:JP2005081074

    申请日:2005-03-22

    Abstract: PROBLEM TO BE SOLVED: To promote small size various optical communication equipment etc., mounted with an optical device by reducing the size and thickness of the optical device. SOLUTION: The optical device 10 has a base 12, an optical component 14 which is mounted on the base 12 and has at least one element, and a transparent gap member 16 which is fixed onto the base 12 to cover the optical component 14 and is a single body and transparent. Then the angle θ between the bottom 22a and side wall 22b of a recessed portion 22 is ≤90° and and the boundary 22c between the bottom 22a and side wall 22b of the recessed portion 22 is curved. Further, the depth (h) of the recessed portion 22 is ≤1.0 mm. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:通过减小光学装置的尺寸和厚度来促进安装有光学装置的小尺寸各种光通信设备等。 解决方案:光学装置10具有底座12,安装在基座12上并具有至少一个元件的光学部件14和固定在基座12上以覆盖光学部件的透明间隙部件16 14是一个单一的身体和透明。 然后凹部22的底部22a和侧壁22b之间的角度θ为≤90°,并且凹部22的底部22a和侧壁22b之间的边界22c是弯曲的。 此外,凹部22的深度(h)≤1.0mm。 版权所有(C)2007,JPO&INPIT

    Optical parts and method of manufacturing the same
    55.
    发明专利
    Optical parts and method of manufacturing the same 审中-公开
    光学部件及其制造方法

    公开(公告)号:JP2003294989A

    公开(公告)日:2003-10-15

    申请号:JP2002093223

    申请日:2002-03-28

    Abstract: PROBLEM TO BE SOLVED: To provide optical parts which have a small coupling loss, a long life, and a high reliability by reducing a gap generated between an end face of an optical fiber block and an end face of an optical element block as much as possible and to provide a method of manufacturing the same. SOLUTION: Optical parts 10 are constituted of an optical fiber block 12 and an optical element block 14. The optical fiber block 12 is constituted of a substrate 16, V grooves 18 formed in the substrate 16, an optical fiber array 22 of optical fibers 20 stored in the V grooves 18 respectively, and a retaining member 24 for holding the optical fiber array 22 together with the substrate 16. The optical element block 14 is constituted of a substrate 30, a ceramic substrate 32 formed on the substrate 30, and an optical element array 36 of optical elements 34 formed on the ceramic substrate 32. The substrate 16 and the substrate 30 are stuck at spot welding points 42 formed by YAG laser. COPYRIGHT: (C)2004,JPO

    Abstract translation: 解决的问题:通过减少在光纤块的端面和光学元件块的端面之间产生的间隙,提供具有小的耦合损耗,长寿命和高可靠性的光学部件 并且提供制造该方法的方法。 解决方案:光学部件10由光纤块12和光学元件块14构成。光纤块12由基板16,形成在基板16中的V形槽18,光纤阵列22 存储在V槽18中的光纤20和用于将光纤阵列22与基板16一起保持的保持构件24.光学元件块14由基板30,形成在基板30上的陶瓷基板32 以及形成在陶瓷基板32上的光学元件34的光学元件阵列36.基板16和基板30被贴在由YAG激光形成的点焊点42处。 版权所有(C)2004,JPO

    OPTICAL INTERFACE FOR 4-CHANNEL OPTOELECTRONICS TRANSMITTER-RECEIVER

    公开(公告)号:JP2002311310A

    公开(公告)日:2002-10-23

    申请号:JP2002043990

    申请日:2002-02-20

    Abstract: PROBLEM TO BE SOLVED: To make it possible for two 4-channel transceivers having a transmission diode string and a reception diode string installed separately to use a single 8-fiber ribbon. SOLUTION: An optical head has an optical head main body 40 having a proximal surface and a distal surface, and eight optical fiber segments 48 are extended via the main body 40. The respective segments 48 have fiber end parts at respective proximal surface and distal surface. The fiber end parts at the proximal surfaces are grouped into two fiber end part strings consisting of four fiber end parts which are equally separated from each other to be positioned respectively optically by a transmission chip 26 and a reception chip 28. The fiber end pars at the distal surface consist of a single string of the eight fiber end parts equally separated from each other.

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