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公开(公告)号：JP2000309706A
公开(公告)日：2000-11-07
申请号：JP12078399
申请日：1999-04-27
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , KOBAYASHI KAZUHIKO
Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition improved in moldability, heat resistance, hot-water resistance, and the surface smoothness of a molding by mixing a polyphenylene sulfide resin with an olefin (co)polymer. SOLUTION: This composition is prepared by mixing 100 pts.wt. total of 50-98 wt.%, desirably, 75-98 wt.% polyphenylene sulfide resin having a melt viscosity of 5-2,000 Pa s, desirably, 10-300 Pa s (at 310 deg.C and a shear rate of 1,000/sec) and an ash content of at most 0.4 wt.% and 50-2 wt.%, desirtbly, 15-2 wt.% olefin (co)polymer having at least one type of functional groups selected from among epoxy groups, acid anhydride groups, carboxyl groups, carboxylate groups, and carboxylic ester groups with, optionally, 10-200 pts.wt., desirably, 20-80 pts.wt. glass fiber having an average fiber diameter of 5-15 μm, desirably, 9-14 μm, an ignition loss of at most 0.7 wt.%, desirably, at most 0.5 wt.% (JIS R 3420), and a fiber length of 10 μm to 10 mm.
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公开(公告)号：JPH11335558A
公开(公告)日：1999-12-07
申请号：JP14630498
申请日：1998-05-27
Applicant: TORAY INDUSTRIES
Inventor： KOBAYASHI SADAYUKI , ISHIO ATSUSHI , KOBAYASHI KAZUHIKO
Abstract: PROBLEM TO BE SOLVED: To obtain a composition which shows prevented coloring and improved whiteness by adding a solution of at least one salt selected from phosphites and borates to a water-containing polyphenylenesulfide resin and drying thereof. SOLUTION: A resin composition of the present invention is obtained by spraying a 0.1-50 wt.% aqueous solution of at least one salt selected from phosphites such as a sodium phophite and the like and borates such as a sodium borate and the like, the sprayed amount of the salts as a solid being 0.01-3 pts.wt., onto 100 pts.wt. of a polyphenylenesulfide resin comprising 70 mol.% of a repeated unit represented by formula and containing 30-70 wt.% of moisture and drying thereof. The composition is further compounded with 0.1-5 pts.wt. of an alkoxysilane compound having an epoxy group, a mercapto group or the like for increasing strength, 1-50 pts.wt. of an oligomer having an aromatic group for decreasing burr and 30-40 pts.wt. of a fibrous filler such as a glass fiber and the like or a non-fibrous filler such as an aluminum hydroxide and the like for improving strength and dimensional stability.
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公开(公告)号：JPH11309795A
公开(公告)日：1999-11-09
申请号：JP11716098
申请日：1998-04-27
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , KOBAYASHI KAZUHIKO
Abstract: PROBLEM TO BE SOLVED: To provide a multilayered hollow molded object made of a thermoplastic resin excellent in barrier properties, toughness and interlaminar bonding properties and having conductivity. SOLUTION: In a multilayered hollow molded object constituted of at least two thermoplastic resin layers, at least one layer among the thermoplastic resin layers is (a) a layer comprising a compsn. mainly constituted of a polyphenylene sulfide resin and at least one layer among them is (b) a layer comprising a thermoplastic resin compsn. mainly constituted of a thermoplastic resin other than the polyphenylene sulfide resin and adhesive surface treatment is applied to the surface of the (a) layer coming into contact with the (b) layer and the polyphenylene sulfide resin compsn. constituting the (a) layer contains 1-200 pts.wt. olefinic copolymer containing a functional group per 100 pts.wt. polyphenylene sulfide resin.
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公开(公告)号：JPH11269385A
公开(公告)日：1999-10-05
申请号：JP1212799
申请日：1999-01-20
Applicant: TORAY INDUSTRIES
Inventor： KOBAYASHI SADAYUKI , ISHIO ATSUSHI , KOBAYASHI KAZUHIKO
Abstract: PROBLEM TO BE SOLVED: To obtain the subject composition excellent in injection moldability, scarcely causing flashes especially at the time of injection molding and useful for molding electrical and electronic parts, etc., such as a connector by including a polyphenylene sulfide resin and a specific polyolefin in a specified proportion. SOLUTION: This composition is obtained by including (A) a polyphenylene sulfide resin and (B) a polyolefin having >=10 wt.% content of a carboxylic acid anhydride in an amount of 0.05-10 pts.wt. based on 100 pts.wt. of the component A. Furthermore, the component A is preferably obtained by carrying out the polymerization using, e.g. sodium sulfide nonahydrate, sodium acetate, N- methyl-2-pyrrolidone and 1,4-dichlorobenzene. The cross-linking/increasing of molecular weight, etc., are preferably carried out by heating in air. The component B is preferably a homopolymer of maleic anhydride or a copolymer of maleic anhydride and an olefin such as isobutylene.
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公开(公告)号：JPH10306219A
公开(公告)日：1998-11-17
申请号：JP5232098
申请日：1998-03-04
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , KOBAYASHI KAZUHIKO
IPC: B32B27/18 , B32B27/34 , C08K3/04 , C08L77/00 , C08L81/04 , C08L101/00 , C08L101/08
Abstract: PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition, especially a polyamide resin composition and a hollow formed product therefrom, having an electroconductivity, and excellent in well-balanced surface smoothness, tenacity, extrusion forming property, antistatic property, etc. SOLUTION: This thermoplastic resin composition contains 1-100 pts.wt. electroconductive filler based on 100 pts.wt. polyamide resin. A gut is obtained by putting such composition into a melt indexer (temperature = melting point + 60 deg.C, staying time; 5 min, load; 5 kg, orifice diameter; 0.0825 inch, length; 0.315 inch), and the number of projected parts having >=25 μm height is
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Patent Agency Ranking
公开(公告)号：JPH10120902A
公开(公告)日：1998-05-12
申请号：JP19413097
申请日：1997-07-18
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , KOBAYASHI SADAYUKI , KOBAYASHI KAZUHIKO
Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition reduced in burr and having high crystallization speeds in both high and low temperature regions by compounding polyphenylene sulfide resin with a specific amount of an aromatic group- containing amide oligomer having a relative viscosity in a specific region. SOLUTION: This composition is composed of 99.9-80wt.% (A) polyphenylene sulfide resin and 0.1-20wt.% (B) aromatic group-containing amide oligomer. The component B is a polycondensate containing one or not less than two kinds selected from among divalent residues of COR CO, NHR NH and NHR CO (R to R each a 6-20C divalent nonaromatic organic group) and one or not less than two kinds selected from among divalent residues of COAr CO, NHAr NH and NHAr CO (Ar to Ar are each a 6-20C divalent organic group containing an aromatic group). Herein, the residues are connected with each other through an amide bond, and the oligomer has a relative viscosity (1% sulfuric acid solution, 25 deg.C) of 1.01-2.00.
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公开(公告)号：JPH09235468A
公开(公告)日：1997-09-09
申请号：JP4137796
申请日：1996-02-28
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , KOBAYASHI KAZUHIKO
Abstract: PROBLEM TO BE SOLVED: To obtain a highly tough nonreinforced PPS material excellent in elongation, Izod impact strength, and hot water resistance by melt mixing and kneading a polyphenylene sulfide resin with a specific alkoxysilane compd. SOLUTION: This polyphenylene sulfide resin compsn. which does not substantially contain a fibrous filler or a nonfibrous filler is obtd. by melt mixing and kneading 99.7-97wt.% polyphenylene sulfide resin contg. 90mol% or higher repeating units represented by the formula and having a Soxhlet extractability with chloroform of 1.5wt.% or lower, a heat of crystallization by temp. fall with a differential scanning calorimeter of 40J/g or lower, and a total ash content of 0.2wt.% or lower with 0.3-3wt.% alkoxysilane compd. having a cyclohexylepoxy group [pref. d-(3,4-epoxycyclohexyl)ethyltrimethoxysilane] as a toughness improver and an amide compd. formed from a 12-40C aliph. monocarboxylic acid, a 2-20C polybasic acid, and a diamine.
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公开(公告)号：JPH093326A
公开(公告)日：1997-01-07
申请号：JP15128995
申请日：1995-06-19
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , KOBAYASHI KAZUHIKO , KAWAMURA HIROTAKA
Abstract: PURPOSE: To obtain a polyphenylene sulfide resin compsn. markedly improved in resistance to peeling from an epoxy resin by compounding a polyphenylene sulfide resin with an olefin copolymer and a carboxamide wax. CONSTITUTION: This compsn. comprises 100 pts.wt. polyphenylene sulfide resin, 2-70 pts.wt. olefin copolymer mainly formed from 60-99.5wt.% a-olefin and 0.5-40wt.% glycidyl α, β-unsatd. carboxylate, and 0.01-10 pts.wt. carboxamide wax obtd. by reacting a higher aliph. monocarboxylic acid, a polybasic acid, and a diamine.
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公开(公告)号：JP2501637B2
公开(公告)日：1996-05-29
申请号：JP14866189
申请日：1989-06-12
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , KOBAYASHI KAZUHIKO , YABE HIDEMITSU
IPC: C08K7/14 , C08K5/54 , C08K5/5435 , C08L81/02
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公开(公告)号：JPH07224209A
公开(公告)日：1995-08-22
申请号：JP31380094
申请日：1994-12-16
Applicant: TORAY INDUSTRIES
Inventor： GOTO NORIAKI , AKIYAMA FUMIO , ISHIO ATSUSHI
Abstract: PURPOSE:To obtain a polyphenylene sulfide resin composition reduced in the burr formation and improved in weld strength by mixing a specified polyphenylene sulfide resin and a specified liquid crystal polymer, a specified epoxy compound and filler. CONSTITUTION:100 pts.wt., in total, 95-5wt.% polyphenylene sulfide resin having a number-average molecular weight of 7000-15000 (gel permeation chromatography using a 1-chloronaphthalene solvent) and a melt flow rate after a 15min residence (as specified in ASTM D1238-86 (at 315.5 deg.C under a load of 500g) corresponding to 50-95% of the melt flow rate after a 5min residence, having a cross-linkage and containing 70mol% or above repeating units of formula I and 5-95wt.% liquid crystal polymer capable of forming an anisotropic melt phase when melted is mixed with 0.1-5 pts.wt. epoxy compound selected from between the compounds of formulas II and III (wherein R1 and R2 are each -COOG, -OG, a group of formula IV or a group of formula V: and G is a group of formula VI) and 0-400 pts.wt. filler, and the resulting mixture is melt-kneaded at 280-380 deg.C.
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