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公开(公告)号:JPH02218734A
公开(公告)日:1990-08-31
申请号:JP4105989
申请日:1989-02-20
Applicant: TORAY INDUSTRIES
Inventor: KAYABA KEIJI , SAWAMURA TAIJI , TANAKA MASAYUKI
IPC: C08K3/00 , C08G59/00 , C08G59/50 , C08G59/62 , C08K5/54 , C08K5/544 , C08L63/00 , H01L23/29 , H01L23/31
Abstract: PURPOSE:To obtain the title composition which has excellent heat resistance in soldering, moldability, and solvent resistance, and enables resin-sealed semiconductor equipment to be produced, by adding a silane-coupling agent of a specific chemical structure together with a styrene-block copolymer to an epoxy resin. CONSTITUTION:The subject composition comprises (A) an epoxy resin, (B) a curing agent, (C) a styrene block copolymer, (D) an amino group-containing silane coupling agent and (E) a filler. It is preferred that the component (D) is a silane compound in which all of the amino groups are secondary, the proportion of component (E) is 75 to 90wt.% based on the total weight, and component (E) is a fused silica which is composed of 90 to 40wt.% of fused and crushed silica of less than 12mum average particle size and pref. containing 10 to 60wt.% of spherical fused silica of less than 40mum average particle size.
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公开(公告)号:JPH0299552A
公开(公告)日:1990-04-11
申请号:JP25358088
申请日:1988-10-06
Applicant: TORAY INDUSTRIES
Inventor: KAYABA KEIJI , TANAKA MASAYUKI
Abstract: PURPOSE:To obtain an epoxy resin composition, excellent in solder heat resis tance and reliability and having a low linear expansion coefficient by blending an epoxy resin with a curing agent and fused silica of a specific composition. CONSTITUTION:A composition with / deg.C, especially / deg.C linear expansion coefficient obtained by blending (A) 5-25wt.% epoxy resin with (B) 2-15wt.% curing agent (e.g., novolak resin, such as phenol novolak) and (C) 75-85wt.%, preferably 75-83wt.% fused silica, consisting of (C1) 90-50wt.% crushed fused silica having
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公开(公告)号:JPH01245014A
公开(公告)日:1989-09-29
申请号:JP7298488
申请日:1988-03-25
Applicant: TORAY INDUSTRIES
Inventor: TANAKA MASAYUKI , UENO TOSHIAKI , TAKUWA SHIRO
IPC: C09K3/10 , C08G59/00 , C08G59/42 , C08G59/62 , C08G63/00 , C08K3/00 , C08K5/04 , C08K7/00 , C08K7/16 , C08L63/00 , H01L23/29 , H01L23/31
Abstract: PURPOSE:To obtain the title composition suitable for sealing semiconductor devices for surface mounting, not causing cracks of resin during soldering by blending a main component consisting of an epoxy resin, a curing agent and a specific powdery filler with a specific compound. CONSTITUTION:A main component consisting of (A) an epoxy resin, (B) a curing agent, (C) a powdery filler (preferably fused silica) containing >=50wt.% fine powder particles having
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公开(公告)号:JPH0122844B2
公开(公告)日:1989-04-28
申请号:JP9915582
申请日:1982-06-11
Applicant: TORAY INDUSTRIES
Inventor: NAKAGAWA KEIJI , TANAKA MASAYUKI , KISHIMOTO AKIHIKO
IPC: C08F8/00 , C08F8/32 , C08F22/06 , C08F222/00 , C08F222/06 , C08G73/10
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公开(公告)号:JPS6346780B2
公开(公告)日:1988-09-19
申请号:JP2171383
申请日:1983-02-14
Applicant: TORAY INDUSTRIES
Inventor: NAKAGAWA KEIJI , TANAKA MASAYUKI , KISHIMOTO AKIHIKO
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公开(公告)号:JPS6296551A
公开(公告)日:1987-05-06
申请号:JP23510785
申请日:1985-10-23
Applicant: TORAY INDUSTRIES
Inventor: TANAKA MASAYUKI , YABE HIDEMITSU , KISHIMOTO AKIHIKO
IPC: C08L23/08 , C08L23/00 , C08L23/26 , C08L29/00 , C08L33/00 , C08L33/02 , C08L33/24 , C08L51/00 , C08L51/02 , C08L51/06 , C08L77/00 , C08L101/00
Abstract: PURPOSE:To provide the titled compsn. having excellent rigidity and resistance to impact, heat and weather, by blending a polyglutarimide with weather, by blending a polyglutarimide with a polyamide and a specific polyolefin. CONSTITUTION:5-90wt% polyglutarimide (A), which is (co)polymer contg. cyclic imide units of the formula [wherein R1-R3 are each a 1-20C (substd.) alkyl, aryl], is blended with 5-90wt% polyamide (B) having a relative viscosity (as measured at 25 deg.C by dissolving 1g of the polymer in 100ml of 98% conc. sulfuric acid) of 2.0-5.0 (e.g., polycapramide), 5-60wt% polyolefin (C) contg. at least one functional group selected from among carboxyl and acid anhydride groups (e.g., a modified polyolefin obtd. by grafting a vinyl monomer contg. a carboxyl or acid anhydride group onto a polyolefin) and optionally a thermoplastic resin, a polyolefin rubber, a pigment, a filler, a thermal stabilizer, a lubricant, a plasticizer, etc.
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公开(公告)号:JPS6056726B2
公开(公告)日:1985-12-11
申请号:JP13875980
申请日:1980-10-06
Applicant: TORAY INDUSTRIES
Inventor: TANAKA MASAYUKI , KISHIMOTO AKIHIKO
IPC: C08F6/00 , C08C1/00 , C08C1/14 , C08F6/06 , C08F6/18 , C08F6/22 , C08F212/10 , C08F212/12 , C08F279/00 , C08F279/02 , C08J3/16 , C08L25/00 , C08L25/12 , C08L51/00 , C08L51/04
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公开(公告)号:JPS60233106A
公开(公告)日:1985-11-19
申请号:JP8922784
申请日:1984-05-07
Applicant: TORAY INDUSTRIES
Inventor: TANAKA MASAYUKI , KISHIMOTO AKIHIKO , TANEICHI SEISHIROU
Abstract: PURPOSE:The titled material that is composed of a specifically composed polyglutarimide polymer, thus showing high heat resistance, which is represented by heat distortion temperature, high clarity, small optical birefringence and good balance between them and being suitable for use in video disks. CONSTITUTION:The objective material is composed of a polyglutarimide polymer containing (A) 3-90wt% of glutarimide units of formula I [R1, R2 are H, methyl; R3 is H, 1-20 substituted or unsubstituted alkyl or aryl] and (B) 97-10wt% of acrylic units of formula II (R4 is H, methyl; R5 is H, 1-10C substituted or unsubstituted alkyl, aryl).
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公开(公告)号:JPS60231754A
公开(公告)日:1985-11-18
申请号:JP8609484
申请日:1984-05-01
Applicant: TORAY INDUSTRIES
Inventor: TANAKA MASAYUKI , GOTOU NORIAKI , KISHIMOTO AKIHIKO
IPC: C08L25/08 , C08L23/00 , C08L25/00 , C08L33/00 , C08L33/02 , C08L51/00 , C08L51/02 , C08L51/06 , C08L101/00
Abstract: PURPOSE:To provide the titled flexible material having well balanced properties with respect to melt moldability, impact strength and coatability, by melt-kneading a specified graft copolymer and a vinyl polymer. CONSTITUTION:31-70wt% ethylene/propylene copolymer rubber (a) and 69- 30wt% at least one vinyl monomer (b) selected from among arom. vinyl monomers [e.g. (alpha-methyl)styrene], alkyl methacrylate monomers (e.g. methyl methacrylate) and vinyl cyanide monomers (e.g. acrylonitrile) are solution- or suspension-polymerized in the presence of a peroxide polymn. initiator in an org. solvent to obtain a graft copolymer (A). 100pts.wt. component A and 0-125pts.wt. vinyl polymer (B) obtd. by polymerizing component (b) are extruded to obtain a flexible thermoplastic material having a component (a) content of 31-60wt% and a flexural modulus of 2,000-14,000kg/cm . The material is then injection- molded.
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公开(公告)号:JPS6031552A
公开(公告)日:1985-02-18
申请号:JP13763783
申请日:1983-07-29
Applicant: TORAY INDUSTRIES
Inventor: NAKAGAWA KEIJI , TANAKA MASAYUKI , KISHIMOTO AKIHIKO
IPC: C08L25/16 , C08L7/00 , C08L21/00 , C08L25/00 , C08L33/00 , C08L33/02 , C08L33/18 , C08L33/20 , C08L33/24 , C08L35/04 , C08L35/06 , C08L51/00 , C08L51/02 , C08L51/04 , C08L55/00 , C08L55/02
Abstract: PURPOSE:To provide the titled compsn. having well-balanced properties between heat resistance and impact strength, by blending two specified kinds of alpha-methylstyrene copolymers and a rubbery graft copolymer. CONSTITUTION:A multi-component copolymer obtd. by suspension-polymerizing 30-80wt% alpha-methylstyrene, 10-50wt% N-substd. maleimide monomer such as N-phenylmaleimide, 5-40wt% vinyl cyanide monomer such as acrylonitrile and 0-40wt% other vinyl monomer such as styrene, and a copolymer obtd. by emulsion-polymerizing 50-90wt% alpha-methylstyrene, 10-50wt% acrylonitrile and 0- 30wt% other vinyl monomer are used. 10-50pts.wt. said multi-component copolymer, 30-70pts.wt. said copolymer and 10-40pts.wt. rubbery graft copolymer such as ABS resin or MBS resin are blended together in a total amount of 100pts.wt.
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