Surface preparation for selective silicon fusion bonding
    52.
    发明公开
    Surface preparation for selective silicon fusion bonding 审中-公开
    Oberflächenvorbereitungfürselektive Silicium-Schmelzverbindung

    公开(公告)号:EP1772426A2

    公开(公告)日:2007-04-11

    申请号:EP06121955.6

    申请日:2006-10-09

    CPC classification number: B81B3/001 B81C2201/115 B81C2203/036

    Abstract: An apparatus and method for a silicon-based Micro-Electro Mechanical System (MEMS) device, including a pair of silicon cover structures each having a substantially smooth and planar contact surface formed thereon; a silicon mechanism structure having a part thereof that is movably suspended relative to a relatively stationary frame portion thereof, the frame portion being formed with substantially parallel and spaced-apart smooth and planar contact surfaces; a relatively rough surface disposed between the contact surfaces of the covers and corresponding surfaces of the movable part of the mechanism structure; and wherein the contact surfaces of the cover structures form silicon fusion bond joints with the respective contact surfaces of the mechanism frame.

    Abstract translation: 一种用于硅基微机电系统(MEMS)器件的装置和方法,包括一对硅覆盖结构,每个硅覆盖结构在其上形成有基本平滑和平坦的接触表面; 硅机构结构,其一部分相对于其相对固定的框架部分可移动地悬挂,所述框架部分形成有大致平行且间隔开的平滑和平坦的接触表面; 设置在所述盖的接触表面和所述机构结构的可移动部分的对应表面之间的相对粗糙的表面; 并且其中所述覆盖结构的接触表面与所述机构框架的相应的接触表面形成硅熔合接合点。

    METHOD AND APPARATUS FOR USING AN ARRAY OF GRATING LIGHT VALVES TO PRODUCE MULTICOLOR OPTICAL IMAGES
    53.
    发明公开
    METHOD AND APPARATUS FOR USING AN ARRAY OF GRATING LIGHT VALVES TO PRODUCE MULTICOLOR OPTICAL IMAGES 失效
    方法和设备发生光学彩色图像期用格子光阀组

    公开(公告)号:EP0875010A2

    公开(公告)日:1998-11-04

    申请号:EP97904813.0

    申请日:1997-01-17

    CPC classification number: B81B3/001 B81C2201/115 G02B5/1828 G02B26/0808

    Abstract: A multicolor optical image-generating device comprised of an array of grating light valves (GLVs) organized to form light-modulating pixel units for spatially modulating incident rays of light. The pixel units are comprised of three subpixel components each including a plurality of elongated, equally spaced apart reflective grating elements arranged parallel to each other with their light-reflective surfaces also parallel to each other. Each subpixel component includes means for supporting the grating elements in relation to one another, and means for moving alternate elements relative to the other elements and between a first configuration wherein the component acts to reflect incident rays of light as a plane mirror, and a second configuration wherein the component diffracts the incident rays of light as they are reflected from the grating elements. The three subpixel components of each pixel unit are designed such that when red, green and blue light sources are trained on the array, colored light diffracted by particular subpixel components operating in the second configuration will be directed through a viewing aperture, and light simply reflected from particular subpixel components operating in the first configuration will not be directed through the viewing aperture.

    Method of manufacturing a micro-mechanical devices and micro-mechanical element

    公开(公告)号:JP2009519447A

    公开(公告)日:2009-05-14

    申请号:JP2008544935

    申请日:2006-11-29

    CPC classification number: B81C1/00984 B81B3/001 B81C2201/115 Y10T428/24355

    Abstract: 本発明は、マイクロメカニカル素子であって、基板(1)が設けられており、該基板(1)の上に第1の中間層(2)が配置されており、該第1の中間層(2)の上に第1の層(3)が配置されていて、該第1の層(3)が第1の中間層(2)にまで構造形成されており、第1の層(3)の上に第2の中間層(6)が配置されており、該第2の中間層(6)の上に第2の層(9)が配置されており、該第2の層(9)内に、少なくとも1つの可動のマイクロメカニカル構造体(14)が構造形成されており、第2の中間層(6)が、可動のマイクロメカニカル構造体(14)の下における犠牲領域において、除去されており、第1の中間層(2)が部分的に、第1の層(3)の下における領域において除去されている形式のものに関する。 このような形式のマイクロメカニカル素子において、本発明の構成では、可動のマイクロメカニカル構造体(14)が下側に、少なくとも1つのストッパ面を有しており、該ストッパ面が、可動のマイクロメカニカル構造体(14)の変位によって、第1の中間層(2)によって支持されている第1の層(3)の領域に接触可能である。 本発明はまた、このようなマイクロメカニカル素子のための製造方法にも関する。

    Reducing MEMS stiction by increasing surface roughness
    60.
    发明授权
    Reducing MEMS stiction by increasing surface roughness 有权
    通过增加表面粗糙度来减少MEMS粘结

    公开(公告)号:US09550664B2

    公开(公告)日:2017-01-24

    申请号:US14574784

    申请日:2014-12-18

    Abstract: A mechanism for reducing stiction in a MEMS device by decreasing surface area between two surfaces, such as a travel stop and travel stop region, that can come into close contact is provided. Reduction in contact surface area is achieved by increasing surface roughness of the travel stop region. This is achieved by depositing a polysilicon layer over a dielectric layer using gaseous hydrochloric acid as one of the reactants. A subsequent etch back is performed to further increase the roughness. The deposition of polysilicon and subsequent etch back may be repeated one or more times in order to obtain the desired roughness. A final polysilicon layer may then be deposited to achieve a desired thickness. This final polysilicon layer is patterned to form the travel stop regions. The rougher surface decreases the surface area available for contact and, in turn, decreases the area through which stiction can be imparted.

    Abstract translation: 提供了一种用于通过减小可以紧密接触的两个表面之间的表面积(例如行驶停止和行驶停止区域)来减小MEMS装置中的静摩擦的机构。 通过增加行驶停止区域的表面粗糙度来实现接触表面积的减小。 这是通过使用气态盐酸作为反应物之一在电介质层上沉积多晶硅层来实现的。 执行随后的回蚀以进一步增加粗糙度。 多晶硅的沉积和随后的回蚀可以重复一次或多次,以获得所需的粗糙度。 然后可以沉积最终的多晶硅层以达到期望的厚度。 对该最终多晶硅层进行图案化以形成行驶停止区域。 较粗糙的表面减小了可用于接触的表面积,并且进而降低了可赋予粘性的面积。

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