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公开(公告)号：US20190066937A1
公开(公告)日：2019-02-28
申请号：US16104145
申请日：2018-08-17
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN , Marin SIGURDSON
Abstract: Systems and methods for forming a magnetostatic MEMS switch include forming a movable beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A shunt bar on the movable plate may close the switch when lowered onto the contacts. The switch may generally be closed, with the shunt bar resting on the contacts. However, a magnetically permeable material may also be inlaid into the movable plate. The switch may then be opened by placing either a permanent magnet or an electromagnet in proximity to the switch.
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公开(公告)号：US20180124913A1
公开(公告)日：2018-05-03
申请号：US15800130
申请日：2017-11-01
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
Abstract: We describe below a structure and process that uses through-silicon-vias and wafer-to-wafer bonding to create transmission lines. The method may require one electroplating step, 3 etch steps, 4 lithography steps, one grind and polish step, and one wafer bonding step, totaling ten process steps per transmission line layer.
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公开(公告)号：US09950923B1
公开(公告)日：2018-04-24
申请号：US15485182
申请日：2017-04-11
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman , Jeffery F. Summers
IPC: H01L23/00 , B81C1/00 , B81B3/00 , H01L21/768 , H01L21/762 , H01L23/48
CPC classification number: H01L21/76879 , H01L21/76232 , H01L21/76877 , H01L23/481
Abstract: Described herein is a method and structure for fabricating vias in a semiconductor substrate. The semiconductor substrate is first doped to make it mildly conducting, via holes are formed therein, and a conductive material is deposited in the holes. Using the moderate conductivity of the substrate, the conductive material may be plated into the holes.
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公开(公告)号：US20180075994A1
公开(公告)日：2018-03-15
申请号：US15698819
申请日：2017-09-08
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
CPC classification number: H01H59/0009 , H01H49/00 , H01H2001/0052 , H01H2201/024 , H01H2229/016
Abstract: Systems and methods for forming an electrostatic MEMS switch that is used to hot switch a source of current or voltage. At least one surface of the MEMS switch is treated with an ion milling machine to reduce surface roughness to less than about 10 nm rms.
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公开(公告)号：US20170334712A1
公开(公告)日：2017-11-23
申请号：US15634230
申请日：2017-06-27
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN , Paul J. RUBEL
CPC classification number: B81B7/0058 , B23K20/023 , B32B9/041 , B32B2457/00 , B81C1/00269 , B81C2203/0118 , B81C2203/037
Abstract: A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.
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Patent Agency Ranking
公开(公告)号：US20170217767A1
公开(公告)日：2017-08-03
申请号：US15415919
申请日：2017-01-26
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN , Stuart Hutchinson
IPC: B81C1/00
CPC classification number: B81C1/00301 , B81C1/00095
Abstract: A through substrate via is formed by disposing a quantity of solder material at the top of a through hole formed in a substrate, coating the hole with a wetting layer, and melting the solder material such that it flows into the hole. The solder material may alloy with the wetting layer, freezing upon formation of the alloy. Subsequent processing steps may be performed at temperatures higher than the melting point of the solder material.
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公开(公告)号：US09493877B1
公开(公告)日：2016-11-15
申请号：US15144735
申请日：2016-05-02
Applicant: Innovative Micro Technology
Inventor： John Harley , Jeffery F. Summers , Tao Gilbert
IPC: C23F1/02 , C23F4/00 , C23F1/12 , H01J37/32 , C23F1/16 , C23F1/38 , C23F1/44 , B81C1/00 , G03F7/004
CPC classification number: C23F1/02 , B81C1/00531 , B81C1/00539 , B81C2201/0132 , B81C2201/0133 , C23F1/16 , C23F1/38 , C23F1/44 , C23F4/00 , G03F7/0041 , H01J37/32009 , H01J2237/334 , H01L21/02244 , H01L21/31111 , H01L21/32134 , H01L21/32136 , H01L21/32139
Abstract: A method for creating small features in an Al/Ag/Ti multilayer stack is disclosed. The method uses a combination of wet and dry etching techniques to anisotropically etch the layers.
Abstract translation: 公开了一种用于在Al / Ag / Ti多层叠层中形成小特征的方法。 该方法使用湿式和干式蚀刻技术的组合来各向异性地蚀刻层。
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公开(公告)号：US09372185B2
公开(公告)日：2016-06-21
申请号：US13987464
申请日：2013-07-29
Applicant: Owl biomedical, Inc. , Innovative Micro Technology
Inventor： John S Foster , Daryl W. Grummitt , Jaquelin K. Spong , Kimberley L. Turner , John C. Harley
CPC classification number: G01N33/5005 , B01L3/502738 , B01L3/502761 , B01L2200/0652 , B01L2400/043 , B01L2400/0633 , C12M47/04
Abstract: A MEMS-based system and a method are described for separating a target particle from the remainder of a fluid stream. The system makes use of a unique, microfabricated movable structure formed on a substrate, which moves in a rotary fashion about one or more fixed points, which are all located on one side of the axis of motion. The movable structure is actuated by a separate force-generating apparatus, which is entirely separate from the movable structure formed on its substrate. This allows the movable structure to be entirely submerged in the sample fluid.
Abstract translation: 描述了基于MEMS的系统和方法，用于将目标颗粒与流体流的其余部分分离。 该系统利用形成在基板上的独特的微加工可移动结构，其以旋转方式围绕一个或多个固定点移动，所述固定点都位于运动轴的一侧。 可移动结构由独立的力产生装置致动，该装置与其基板上形成的可移动结构完全分开。 这允许可移动结构完全浸没在样品流体中。
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公开(公告)号：US20160126696A1
公开(公告)日：2016-05-05
申请号：US14931883
申请日：2015-11-04
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
IPC: H01S5/022 , H04B10/516 , G02B27/09 , H01S5/026 , G02F1/09
CPC classification number: H04B10/516 , B81B7/0067 , B81C1/00301 , G02B27/0955 , H01S5/0064 , H01S5/021 , H01S5/02216 , H01S5/02248 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/0607 , H01S5/4025 , H01S5/4031
Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via.
Abstract translation: 一种微波加工的光学装置，包括由波形驱动的光源，转向镜和光束整形元件，其中波形通过至少一个通过硅通孔传送到光源。
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公开(公告)号：US09330874B2
公开(公告)日：2016-05-03
申请号：US14456972
申请日：2014-08-11
Applicant: Innovative Micro Technology
Inventor： Benedikt Zeyen , Vikram Patil
CPC classification number: H01H59/0009 , B81C1/00333 , H01H49/00 , H03H9/1057
Abstract: A method for forming a cavity in a microfabricated structure, includes the sealing of that cavity with a low temperature solder. The method may include forming a sacrificial layer over a substrate, forming a flexible membrane over the sacrificial layer, forming a release hole through a flexible membrane to the sacrificial layer, introducing an etchant through the release hole to remove the sacrificial layer, and then sealing that release hole with a low temperature solder.
Abstract translation: 用于在微细结构中形成空腔的方法包括用低温焊料密封该空腔。 该方法可以包括在衬底上形成牺牲层，在牺牲层上形成柔性膜，形成通过柔性膜到牺牲层的释放孔，通过释放孔引入蚀刻剂以去除牺牲层，然后密封 该释放孔与低温焊料。
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