公开(公告)号：WO2012047266A3

公开(公告)日：2012-04-12

申请号：PCT/US2011/001663

申请日：2011-09-28

Applicant: R&D CIRCUITS, INC.

Inventor： WARWICK, Thomas, P. ,  RUSSELL, James, V.

IPC: H01P1/20 ,  H01P1/203 ,  H01P1/205

Abstract: The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

公开(公告)号：WO2011115662A3

公开(公告)日：2011-12-22

申请号：PCT/US2011000454

申请日：2011-03-11

Applicant: R & D CIRCUITS INC

Inventor： RUSSELL JAMES V

IPC: H01R12/51 ,  H05K1/11

CPC classification number: H01R12/7082 ,  H01R12/57

Abstract: An electrical connector electrically connects either an adaptor board or an electrical component to a main circuit board through the use of a thin printed circuit having an array of pads one each side where on one side the pads are connected to a main circuit board by solder balls, solder columns conductive epoxy or any other way practiced in the art and on the other side of the thin circuit the pads are connected to an adaptor board by a conductive compliant elastomeric material. The sides of the thin printed circuit are electrically connected to one another in ways practiced in the art.

Abstract translation: 电连接器通过使用具有垫阵列的薄印刷电路将适配器板或电气部件电连接到主电路板，每个侧面上的焊盘通过焊球连接到主电路板 ，焊料柱导电环氧树脂或在本领域中实践的任何其它方式，并且在薄电路的另一侧，焊盘通过导电柔性弹性体材料连接到适配器板。 薄印刷电路的侧面以本领域实践的方式彼此电连接。

公开(公告)号：WO2016209386A1

公开(公告)日：2016-12-29

申请号：PCT/US2016/031751

申请日：2016-05-11

Applicant: R&D CIRCUITS, INC.

Inventor： RUSSELL, James, V.

IPC: H01L23/50 ,  H01L21/50

CPC classification number: H01L23/50 ,  G01R1/07378 ,  H01L21/50 ,  H01L23/49827

Abstract: The present invention relates to a method and an apparatus for a resurfaceable contact pad that uses; an epoxy to encapsulate contact pads so that the epoxy and encapsulated contact pads are coplanar on a silicon redistribution interposer. These redistribution interposers electrically connect a wafer semi-conductor to a probe card where it is necessary to convert the course pad arrangement of one with a fine pad arrangement of the other through the use of an interposer board. The present invention relates to an apparatus and a method creates resurfaceable contact pads which may be resurfaced one or multiple times with an abrasive sanding operation to recreate a coplanar surface should any contact pad surfaces become damaged, allowing for a more cost- effective repair.

Abstract translation: 本发明涉及一种使用的可再现接触焊盘的方法和装置; 环氧树脂以封装接触焊盘，使得环氧树脂和封装的接触焊盘在硅再分布插入件上共面。 这些再分布插入器将晶片半导电体电连接到探针卡，其中需要通过使用插入板来将另一个的导线板布置与另一个的精细焊盘布置相结合。 本发明涉及一种设备和方法，其产生可重新接触的接触垫，其可以通过磨料砂磨操作重新浮雕一次或多次，以在任何接触垫表面损坏时重建共面，从而允许更具成本效益的修复。

公开(公告)号：WO2013158162A1

公开(公告)日：2013-10-24

申请号：PCT/US2013/000096

申请日：2013-03-28

Applicant: R&D CIRCUITS, INC.

Inventor： WARWICK, Thomas, P. ,  RUSSELL, James, V. ,  MCMULLIN, Dermick ,  QUICK, William

IPC: H01R12/00

CPC classification number: H01R13/03 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/26 ,  Y10T29/49208 ,  Y10T29/4921

Abstract: A method and an electrical interconnect mechanism in which elastomeric pins are printed onto metal retainer tabs having at least one protrusion or tab extending laterally therefrom to engage a catch or recess of the laminated housing so as to locate each of the elastomeric pins and secure them within the housing. In one embodiment a champher may be employed with a catch or recess to engagely secure a second protrusion or tab extending laterally from another side of said elastomeric pin. In another embodiment the elastomeric pin may have a solid metal ring or a slide collar around the center of the pin wherein the ring has one or two tabs for engaging the recess in the housing and if preferred also the recess of a champfer.

Abstract translation: 一种方法和电互连机构，其中弹性销被印刷到具有至少一个从其横向延伸的突起或突片的金属保持器突片上，以接合层叠壳体的卡扣或凹部，以便定位每个弹性销并将其固定在 住房。 在一个实施例中，可以使用带有卡扣或凹槽的凸轮来接合地固定从所述弹性销的另一侧横向延伸的第二突起或突出部。 在另一个实施例中，弹性体销可以具有围绕销的中心的实心金属环或滑动环，其中环具有用于接合壳体中的凹部的一个或两个突出部以及冠状器的凹部。

公开(公告)号：WO2012047266A2

公开(公告)日：2012-04-12

申请号：PCT/US2011001663

申请日：2011-09-28

Applicant: R & D CIRCUITS INC

Inventor： WARWICK THOMAS P ,  RUSSELL JAMES V

IPC: H01P1/20 ,  H01P1/203 ,  H01P1/205

CPC classification number: H05K1/0233 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

Abstract: The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

Abstract translation: 本公开涉及减少包含RF装置的印刷电路板（PCB）中的不需要的RF噪声。 隔离过滤器嵌入在包含RDF设备的PCB中。 通过将隔离滤波器尽可能靠近RF器件放置，以便显着减少由于PCB结构中的通孔和平面之间不可避免的耦合而导致的不必要的RF噪声。

公开(公告)号：WO2011115662A2

公开(公告)日：2011-09-22

申请号：PCT/US2011/000454

申请日：2011-03-11

Applicant: R&D CIRCUITS INC.

Inventor： RUSSELL, James, V.

IPC: H01R12/51 ,  H05K1/11

CPC classification number: H01R12/7082 ,  H01R12/57

Abstract: An electrical connector electrically connects either an adaptor board or an electrical component to a main circuit board through the use of a thin printed circuit having an array of pads one each side where on one side the pads are connected to a main circuit board by solder balls, solder columns conductive epoxy or any other way practiced in the art and on the other side of the thin circuit the pads are connected to an adaptor board by a conductive compliant elastomeric material. The sides of the thin printed circuit are electrically connected to one another in ways practiced in the art.

Abstract translation: 电连接器通过使用具有焊盘阵列的薄印刷电路将适配器板或电气部件电连接到主电路板，其中在每一侧焊盘连接在一侧上 通过焊球，导电环氧树脂或本领域中实践的任何其他方式通过焊球，在薄电路的另一侧上通过导电顺应性弹性体材料将焊盘连接至适配器板。 薄印刷电路的侧面以本领域实践的方式相互电连接。

公开(公告)号：WO2011034555A1

公开(公告)日：2011-03-24

申请号：PCT/US2010/000049

申请日：2010-01-08

Applicant: R&D CIRCUITS INC.

Inventor： RUSSELL, James, V.

IPC: H05K1/18 ,  H01L23/32 ,  H05K3/30

CPC classification number: H05K3/30 ,  G01R1/07378 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/50 ,  H01L24/13 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/14 ,  H05K1/0213 ,  H05K1/0231 ,  H05K1/0234 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/141 ,  H05K1/185 ,  H05K2201/049 ,  H05K2201/10378 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

Abstract: The present disclosure provides for attaching and embedding a capacitance or a resistance directly in an adaptor board or an interposer board that is then connected to the main circuit board. The adaptor board can be connected to the main circuit board by soldering, electrically connecting it by a conductive elastomer connection, spring pins or by any other way that is known in the art.

Abstract translation: 本公开提供了将电容或电阻直接附接和嵌入适配器板或插入器板中，然后连接到主电路板。 适配器板可以通过焊接连接到主电路板，通过导电弹性体连接，弹簧销或本领域已知的任何其它方式电连接。

公开(公告)号：WO2010129002A1

公开(公告)日：2010-11-11

申请号：PCT/US2010/000043

申请日：2010-01-08

Applicant: R&D CIRCUITS INC. ,  RUSSELL, James, V.

Inventor： RUSSELL, James, V.

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/185 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0234 ,  H05K1/112 ,  H05K3/4046 ,  H05K2201/096 ,  H05K2201/10636 ,  Y02P70/611

Abstract: The present disclosure relates to embedding a power modification component such as a capacitance or a resistance inside of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded capacitance or resistance is located beyond where the vias or blinds are located. Each of the pads will include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening. In this way the capacitance and the resistance will have a closer contact point the electrical component.

Abstract translation: 本公开涉及嵌入诸如电极内部的电容或电阻内部的功率修改部件，其位于延伸超过PCB的通孔的位置以使得包含嵌入的电容或电阻的焊盘的一部分位于 通道或百叶窗位于。 每个垫将包括位于通孔或百叶窗中的给定一个上的开口，以允许该通孔穿过开口。 以这种方式，电容和电阻将具有更接近的电气部件的接触点。

公开(公告)号：SG11201701593XA

公开(公告)日：2017-03-30

申请号：SG11201701593X

申请日：2015-08-26

Applicant: R&D CIRCUITS INC

Inventor： WARWICK THOMAS P ,  RUSSELL JAMES V

IPC: G01R31/303

Abstract: A method and a structure with multiple implementations is provided that depends on the specific need, for placing (embedding) a serial loopback circuit of known design in a printed circuit board directly beneath the device under test. Micro-vias and traces connect components including transmitter components (TX) and receiver components (RX) that are formed into a loopback circuit for connection to a device under test (DUT). The connection is accomplished by a coupling capacitor with a shortest possible electrical length approximating a straight line between said components and said DUT and said distance is a length of said short straight line times a square root of 2 so that said receiver components are beneath the DUT.

公开(公告)号：SG11201805911UA

公开(公告)日：2018-08-30

申请号：SG11201805911U

申请日：2017-08-28

Applicant: R&D CIRCUITS INC ,  THOMPSON DONALD ,  CANTAIORE COSIRNO

Inventor： THOMPSON DONALD ,  CANTAIORE COSIRNO

IPC: B29C64/153 ,  H01R13/40 ,  H05K1/14 ,  H05K3/36

Abstract: The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.