Abstract:
This invention provides a porous member that, when used in a field requiring a high level of cleanness, can suppress energy loss in a microwave band and can evenly disperse gas. The porous member is formed of a porous ceramic and has a dielectric loss tangent at a microwave band of not more than 1 x 10-3. A ceramic member comprising a ceramic sinter comprising this porous member in a part thereof is also provided. ® KIPO & WIPO 2009
Abstract:
A plasma processing apparatus and a driving method thereof, and a plasma processing method, and a manufacturing method of an electronic device are provided to activate cleaning gas by utilizing the power of microwave. A plasma processing apparatus, which includes a space part(66) and a cleaning gas path(61), executes a plasma process on an objective processing member disposed in a processing chamber by utilizing microwaves through a waveguide(35). The space part is surrounded by a wall formed dielectrics in the waveguide. The cleaning gas path is used to supply cleaning gas into the processing chamber through the space part.
Abstract:
A microwave plasma processing device, a manufacturing method of a dielectric window, and a processing method of a microwave plasma are provided to uniformly generate the plasma through a uniformly and slowly supplied gas to a predetermined position. A microwave plasma processing device includes a slot antenna, a dielectric window, a gas supply unit, and a processing chamber. The slot antenna propagates a microwave. The dielectric window transmits the propagated microwave. The gas supply unit supplies a predetermined gas. The processing chamber processes a subject by converting the predetermined gas into plasma with the microwave transmitted through the dielectric window. The dielectric window includes a first porous material(31Ph) and a second porous material(31Pl). The first porous material has first porosity. The second porous material is connected to the first porous material and has second porosity lower than the first porosity. The gas supply unit induces the predetermined gas in the processing chamber from the second porous material through the first porous material.
Abstract:
Disclosed is a plasma nitriding method wherein a nitriding is performed at a process temperature of not less than 500°C in a process chamber of a plasma processing apparatus by causing a microwave-excited high-density plasma of a nitrogen-containing gas, which is formed by introducing a microwave into the process chamber using a multi-slotted planar antenna, to act on silicon in the surface of an object to be processed.
Abstract:
This invention provides an apparatus for film formation, comprising a blowout vessel having a construction for blowing out an organic EL molecular gas. The apparatus comprises a plurality of organic EL material vessels and a piping system for connecting the plurality of organic EL material vessels to the blowout vessel. The plurality of organic EL material vessels constructed so as to be selectively brought to an organic EL molecule feed state. The piping system is constructed so that the transport gas is fed into each organic EL material vessel in such a manner that the pressure during film formation and the pressure during non-film formation are equal to each other. During non-film formation, the transport gas is allowed to flow from one of the organic EL material vessels to other material vessel.