Abstract:
PURPOSE: An image sensor for outputting RGB bayer signals through internal conversion, and an image processing apparatus including the same are provided to enable the compatibility with a universal ISP(Image signal Processor) without an additional compatibility device. CONSTITUTION: A pixel array(111) comprises plural pixels including RGB bayer pattern, and an analog-digital converter(114) converts an analog pixel signal outputted from each pixel into a digital pixel signal. An RGB converter(115) converts the digital pixel signal into the RGB bayer signal. The first row line signal of the RGB bayer signal indicates R and G pixel signals which alternatively appear.
Abstract:
PURPOSE: An image sensor is provided to improve image quality by restraining crosstalk without the deterioration of a ratio of an optical sensing area to an overall area of the image sensor. CONSTITUTION: A plurality of optical detecting devices(121, 122, 123) generates an electric signal corresponding to incident light. An insulating layer(140) is formed on the back side(110b) of a semiconductor substrate(110). The insulating layer comprises a plurality of light blocking area(141a, 142a) formed on an area between a plurality of optical detecting devices.
Abstract:
PURPOSE: A color filter array, an image sensor including the same, and electric device including the same are provided to increase the brightness of emitted light by increasing the sensitivity of an incident ray. CONSTITUTION: A first layer comprises a first type color filter, a second type color filter, a first type color filter, and a third type color filter. The second layer comprises a second type color filter, a fourth type color filter, a third type color filter, and a fourth type color filter. A third layer comprises a first type color filter, a third type color filter, a first type color filter, and a second type color filter. A fourth layer comprises a third type color filter, a forth type color filter, a second type color filter, and a fourth type color filter.
Abstract:
PURPOSE: An image sensor of a rear illumination structure is provided to supply a clear image by suppressing a blooming phenomenon between photoelectric conversion elements. CONSTITUTION: A substrate(14) comprises a plurality of photoelectric conversion elements(15) which is respectively separated with the semiconductor material with a first type. A transparent electrode layer(13) is formed on the substrate. A positive or negative bias voltage is applied to the transparent electrode layer.
Abstract:
PURPOSE: An image sensor and an image sensing system including the same are provided to supply a drive power through a plurality of routes by inputting the drive power applied from outside to a connection pad of the image sensor through a pad area and a circuit area. CONSTITUTION: A pixel array is formed on a pixel area of a semiconductor substrate. The pixel array includes a plurality of photoelectron transform part(110). A driving part is formed on the circuit area of the semiconductor substrate. The driving part includes a plurality of driving circuits(201). A contact pad(301) is extended from a pad area of the semiconductor substrate to the circuit area. The contact pad is connected with the outside and provided a drive power.
Abstract:
PURPOSE: An image sensor and a manufacturing method thereof are provided to offer a clear image by eliminating the dark current generating on the surface of silicon or the well region of the top of the photo diode. CONSTITUTION: A plurality of photo diodes(1, 1a, 1b) is prepared. A plurality of wells(5, 5a, 5b, 5c) insulates intervals between the photo diodes. A plurality of barrier metals receives a bias voltage. The metal layer is formed on the lower part of the corresponding photo diode among the photo diodes. The oxide film is formed on the lower part of the well according to the STI(Shallow Trench Insulation) process.
Abstract:
PURPOSE: A CMOS image sensor and a driving method thereof are provided to increase the electric potential difference between a light receiving element and a detecting element by reduction of surround electric potential of the light receiving element when transferring electric charges. CONSTITUTION: A light receiving element(110) accumulates photo electric charges. An electric charge transfer element(130) controls transmission of the photo electric charges accumulated with the light receiving element. A detecting element(120) detects the photo electric charges transmitted with the electric charge transfer element. A well driving contact(107) is arranged to increase the electric potential difference between the light receiving element and the detecting element when transferring the photo electric charges.
Abstract:
An image sensor and method for fabricating the same is provided to increase the sensitivity of the image sensor in the magnetism pixel by blocking the light from is incident to the adjacent pixel. The active region between the gate of the gate(120) of the transfer transistor and the reset transistor comprise the floating diffusion region. The photo diode is surrounded by the device isolation region(210, 212) having the recess region(214). The high concentration p-type impurity region is formed near the device isolation region. The dark current's generation is suppressed by the high concentration p-type impurity region. The floating diffusion region stores the electric charge delivered from the photo diode. The power supply terminal is connected in the source of the reset transistor.
Abstract:
A CMOS image sensor and a manufacturing method of the same are provided to reduce flicker noise by modifying an energy band structure of a channel region. A CMOS image sensor includes a light sensing element and a drive transistor(168). The drive transistor includes a drive gate(167) on a semiconductor substrate(105) and a channel region within the semiconductor substrate under the drive gate. The channel region is used for forming a buried channel with an impurity implantation region of a stacked structure to obtain a band offset value in a conductive band by modifying an energy band structure of the channel region with a heterojunction. The channel region includes the impurity implantation region having a Si/SiGe/SiGeC/SiGe stacked structure.
Abstract:
A CMOS image sensor and a manufacturing method thereof are provided to reduce a dark current and to improve an image lag by separately forming a pocket photo diode related to a main photo diode and a charge transfer. A transfer transistor(Tx) has a transfer gate(132) on a first conductive-type semiconductor substrate(100) and a channel region(112). The channel region has a first conductive-type impurity ion implantation layer located in the semiconductor substrate at a lower portion of the transfer gate. A photo diode includes a second conductive-type main photo diode(140) in the semiconductor substrate and a second conductive-type pocket photo diode(142). The second conductive-type pocket photo diode is located between the channel region and the main photo diode. The channel region includes a second conductive-type impurity ion implantation layer at a lower portion of the first conductive-type impurity ion implantation layer. A first conductive-type diffusion layer(144) is formed on a surface of the main photo diode.