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    ULTRASOUND TRANSDUCER DEVICES AND METHODS FOR FABRICATING ULTRASOUND TRANSDUCER DEVICES
    61.
    发明专利
    ULTRASOUND TRANSDUCER DEVICES AND METHODS FOR FABRICATING ULTRASOUND TRANSDUCER DEVICES 未知

    公开(公告)号：CA3092139A1

    公开(公告)日：2019-09-12

    申请号：CA3092139

    申请日：2019-03-08

    Applicant: BUTTERFLY NETWORK INC

    Inventor： FIFE KEITH G ,  LIU JIANWEI

    IPC: B06B1/00 ,  B81B3/00 ,  B81C1/00 ,  G10K9/12 ,  G10K11/18

    Abstract: Aspects of the technology described herein relate to ultrasound transducer devices including capacitive micromachined ultrasonic transducers (CMUTs) and methods for forming CMUTs in ultrasound transducer devices. Some embodiments include forming a cavity of a CMUT by forming a first layer of insulating material on a first substrate, forming a second layer of insulating material on the first layer of insulating material, and then etching a cavity in the second insulating material. A second substrate may be bonded to the first substrate to seal the cavity. The first layer of insulating material may include, for example, aluminum oxide. The first substrate may include integrated circuitry. Some embodiments include forming through- silicon vias (TSVs) in the first substrate prior to forming the first and second insulating layers (TSV-Middle process) or subsequent to bonding the first and second substrates (TSV-Last process).

    Monolithic ultrasonic imaging devices, systems and methods
    67.
    发明专利
    Monolithic ultrasonic imaging devices, systems and methods 未知

    公开(公告)号：AU2018200714A1

    公开(公告)日：2018-02-22

    申请号：AU2018200714

    申请日：2018-01-31

    Applicant: BUTTERFLY NETWORK INC

    Inventor： ROTHBERG JONATHAN M ,  FIFE KEITH G ,  RALSTON TYLER S ,  CHARVAT GREGORY L ,  SANCHEZ NEVADA J

    IPC: G01S7/52 ,  B06B1/02 ,  B81C1/00 ,  G01S15/89

    Abstract: An ultrasound device, comprising: at least first and second ultrasonic transducer elements; a first transmit control circuit comprising: a first pulser coupled to the first ultrasonic transducer element so as to drive the first ultrasonic transducer element so that the first ultrasonic transducer element emits an ultrasonic pulse; a first waveform generator coupled to the first pulser to provide a first waveform to the first pulser in response to receipt, by the first transmit control circuit, of a transmit enable signal generated by a timing and control circuit; and at least one first component that impacts a length of a first delay between when the first transmit control circuit receives the transmit enable signal and when the first waveform is applied to the first pulser; a second transmit control circuit comprising: a second pulser coupled to the second ultrasonic transducer element so as to drive the second ultrasonic transducer element so that the second ultrasonic transducer element emits an ultrasonic pulse; a second waveform generator coupled to the second pulser to provide a second waveform to the second pulser in response to receipt, by the second transmit control circuit, of the transmit enable signal generated by the timing and control circuit; and at least one second component that impacts a length of a second delay between when the second transmit control circuit receives the transmit enable signal and when the second waveform is applied to the second pulser; wherein the at least one first component is configured differently than the at least one second component, so that the length of the second delay is different than the length of the first delay, and wherein the first and second ultrasonic transducer elements, the first transmit control circuit, and the second transmit control circuit are formed on a single solid state semiconductor die. c-o

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