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    ULTRASOUND APPARATUSES AND METHODS FOR FABRICATING ULTRASOUND DEVICES
    5.
    发明专利
    ULTRASOUND APPARATUSES AND METHODS FOR FABRICATING ULTRASOUND DEVICES 未知

    公开(公告)号：CA3081760A1

    公开(公告)日：2019-05-23

    申请号：CA3081760

    申请日：2018-11-15

    Applicant: BUTTERFLY NETWORK INC

    Inventor： CHEN KAILIANG ,  SANCHEZ NEVADA J ,  ALIE SUSAN A ,  RALSTON TYLER S ,  ROTHBERG JONATHAN M ,  FIFE KEITH G ,  LUTSKY JOSEPH

    IPC: A61B8/00 ,  H01L21/98 ,  H01L23/535

    Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application- specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

    Pressure port for ultrasonic transducer on CMOS sensor
    8.
    发明专利
    Pressure port for ultrasonic transducer on CMOS sensor 未知

    公开(公告)号：AU2019263404A1

    公开(公告)日：2020-11-19

    申请号：AU2019263404

    申请日：2019-05-02

    Applicant: BUTTERFLY NETWORK INC

    Inventor： FIFE KEITH G ,  LIU JIANWEI ,  YANG JUNGWOOK ,  LUTSKY JOSEPH

    IPC: H04R7/02 ,  A61B8/00 ,  H04R31/00

    Abstract: Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.

    Ultrasound apparatuses and methods for fabricating ultrasound devices
    9.
    发明专利
    Ultrasound apparatuses and methods for fabricating ultrasound devices 未知

    公开(公告)号：AU2018369882A1

    公开(公告)日：2020-05-21

    申请号：AU2018369882

    申请日：2018-11-15

    Applicant: BUTTERFLY NETWORK INC

    Inventor： CHEN KAILIANG ,  SANCHEZ NEVADA J ,  ALIE SUSAN ,  RALSTON TYLER S ,  ROTHBERG JONATHAN M ,  FIFE KEITH G ,  LUTSKY JOSEPH

    IPC: A61B8/14 ,  H01L23/535

    Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application- specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

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