公开(公告)号：DE10142116A1

公开(公告)日：2002-11-14

申请号：DE10142116

申请日：2001-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/50

Abstract: An electronic component comprises a first semiconductor chip (1) and a second semiconductor chip (2) each having contact surfaces (3, 8) on their active surfaces; and a substrate (11) with contact connection surfaces (14) and external contact surfaces (15). An intermediate support (4) is arranged between the chips and has outer parameters which are the same or larger than the longest length and width of both chips. The chips each have wiring surfaces (6, 7) with wiring strip conductors (9, 10). An Independent claim is also included for the production of the electronic component. Preferred Features: The chips are electrically connected to the intermediate support via contact humps (12, 13) using flip-chip technology. The intermediate support is made from an organic laminate, a ceramic material or a silicon material.