公开(公告)号：JPS6023123B2

公开(公告)日：1985-06-06

申请号：JP15798779

申请日：1979-12-07

Applicant: MITSUI TOATSU CHEMICALS

Inventor： SUZUKI KATSUJI ,  MORITA MORIJI ,  KISHI MASAO ,  KITAHARA AKIRA ,  FUSEYA YOSHIRO

IPC: B32B5/18 ,  B29C63/00 ,  B32B7/12 ,  B32B37/00 ,  C08J5/12 ,  C09J133/04

公开(公告)号：JPH0682895B2

公开(公告)日：1994-10-19

申请号：JP25590886

申请日：1986-10-29

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORIJI ,  NISHIHARA KUNIO ,  YAMAGUCHI TERUHIRO ,  OOTA MASAHIRO ,  TAMAI MASAJI

IPC: B32B15/00 ,  B32B15/08 ,  B32B15/088 ,  C08G69/26 ,  C08G73/10 ,  H01B3/30 ,  H05K1/03 ,  H05K3/38

公开(公告)号：JPH06218880A

公开(公告)日：1994-08-09

申请号：JP30370893

申请日：1993-12-03

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORIJI ,  TAGAWA KIMITERU ,  ABE KENJI ,  MINETA NAOSHI ,  KUBO TAKAYUKI ,  KOBA SHIGEO ,  OOKAWADO ETSUO ,  TANABE KENJI

IPC: B32B27/00 ,  B32B27/34 ,  H01B3/30 ,  H01B17/60

Abstract: PURPOSE:To obtain adherent insulating tape having excellent characteristics in adhesion bond between metal conductor, semiconductor and the like, reliability and mass-productivity by a method wherein thermoplastic polymer, which is formed on insulating board, has specified polyimide as essential ingredient and specified glass transition temperature and modulus of elasticity. CONSTITUTION:On both the sides or one side of insulating board, thermoplastic polymer layer, the essential ingredient of which is represented by the formula I. In this case, the glass transition temperature of the thermoplastic polymer is 180-280 deg.C and its modulus of elasticity is 10 -10 dyne/cm at 25 deg.C 10 -10 dyne/ cm at 250-300 deg.C. Silane coupling agent may be reacted or mixed with the thermoplastic polyimide at or after the synthesization of the thermoplastic polyimide. The adherent insulating tape 4 has excellent bonding characteristics to IC chip 1 and the like and adhesion takes place in a short period of time.

公开(公告)号：JPH0577195B2

公开(公告)日：1993-10-26

申请号：JP6665685

申请日：1985-04-01

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORIJI ,  SHIBUYA TAKEFUMI ,  SUZUKI SHOZO ,  YAMAGUCHI TERUHIRO ,  OOTA MASAHIRO

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/03

公开(公告)号：JPH05228418A

公开(公告)日：1993-09-07

申请号：JP7417992

申请日：1992-03-30

Applicant: MITSUI TOATSU CHEMICALS

Inventor： SATO TAKUSHI ,  SHISHIDO SHIGEYUKI ,  MORITA MORIJI

IPC: B05C9/14 ,  B05D3/00 ,  B05D3/04 ,  B05D7/14 ,  B05D7/24 ,  B32B15/08 ,  H05K3/38 ,  H05K9/00

Abstract: PURPOSE:To solve the trouble accompanied by the entrance of FMCL into a furnace and the discharge of FMCL from the furnace in a method and an apparatus for producing FMCL by coating metal foil with a polymer solution and drying and curing the coated metal foil in the furnace. CONSTITUTION:FMCL 1 is upwards inserted in a furnace and downwards discharged from the furnace. At this time, air curtains 5, 5' are employed to hold the concn. of oxygen in the furnace to 1-0.001vol% to perform imidation to set the bonding strength of a metal foil layer and a plastic layer to 1kg/cm or more as the peel strength of both layers.

公开(公告)号：JPH0442417B2

公开(公告)日：1992-07-13

申请号：JP357884

申请日：1984-01-13

Applicant: MITSUI TOATSU CHEMICALS

Inventor： HIROSE SUMIO ,  YAMAGUCHI TERUHIRO ,  MORITA MORIJI ,  KOIKE HIROYUKI

IPC: C08J5/04 ,  C08J5/24

公开(公告)号：JPH03170523A

公开(公告)日：1991-07-24

申请号：JP29540590

申请日：1990-11-02

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KOIKE HIROYUKI ,  MORITA MORIJI ,  YAMAGUCHI TERUHIRO

IPC: C08L63/00 ,  C08G59/00 ,  C08G59/38 ,  C08G59/50

Abstract: PURPOSE:To prepare the title compsn. having excellent room temp. curing properties and giving a cured product excellent in the resistance to heat and impact by compounding a specific epoxy resin, aminobenzylamine, and a rubber. CONSTITUTION:The title compsn. comprises an epoxy resin comprising 100-30wt.% epoxy resin contg. at least three epoxy groups in the molecule (e.g. Epo Tohto YH-434) and 0-70wt.% epoxy resin contg. at least two epoxy groups in the molecule (e.g. vinylcyclohexane diepoxide); aminobenzylamine (e.g. a mixture of o-, m-, and p-aminobenzylamines); and a rubber (e.g. a graft copolymer obtd. by reacting butyl acrylate with an acrylated epoxy resin obtd. by reacting a phenolic epoxy resin with acrylic acid).

公开(公告)号：JPH032370B2

公开(公告)日：1991-01-14

申请号：JP15554384

申请日：1984-07-27

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KOIKE HIROYUKI ,  MORITA MORIJI ,  YAMAGUCHI TERUHIRO

IPC: D06M15/55 ,  C08G59/00 ,  C08G59/20 ,  C08G59/32 ,  C08G59/50 ,  C09D163/00 ,  C09J163/00 ,  D06M13/02 ,  D06M13/322 ,  D06M13/325 ,  D06M13/332 ,  D21H19/24 ,  D21H19/44 ,  D21H19/62

公开(公告)号：JPH02168694A

公开(公告)日：1990-06-28

申请号：JP32192488

申请日：1988-12-22

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORIJI ,  YOSHIDA SHUNJI ,  TANABE KENJI

IPC: B32B15/08 ,  H05K1/03 ,  H05K3/46

Abstract: PURPOSE:To obtain a double-sided FMCL having high bonding strength among layers by bringing two layers brought into contact with the metallic foil layer of a heat-resistant polymer layer to the state of thermocompression bonding with the metallic foil layer and symmetrizing the heat-resistant polymer layer in the thickness direction to the central surface of the heat-resistant polymer layer. CONSTITUTION:A flexible metallic-foil laminate(FMCL) in which heat-resistant polymer layers are formed between two layers of metallic foil layers is manufactured, the heat-resistant polymer layers are composed of three layers or more, two layers brought into contact with the metallic foil layers can be thermocompression bonded with the metallic foil layers, and the heat-resistant polymer layers are symmetrized in the thickness direction to the central surfaces of the heat-resistant polymer layers. Three layers or more of the heat-resistant polymer layers are shaped through coating in the double-sided FMCL having three layers or more of the heat-resistant polymer layers at that time, thus acquiring high bonding strength through mixing and/or crosslinking near the interfaces of the polymer layers.

公开(公告)号：JPH02151432A

公开(公告)日：1990-06-11

申请号：JP30608788

申请日：1988-12-05

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORIJI ,  YOSHIDA SHUNJI ,  TANABE KENJI

IPC: H05K1/03 ,  B32B15/08 ,  B32B15/088

Abstract: PURPOSE:To reduce the curling of the heat-resistant polymer film remaining by removing a metal foil by lowering the amount of the residual solvent present in the heat-resistant polymer film. CONSTITUTION:The heat-resistant polymer film layer of a flexible metal foil laminated sheet is composed of a heat-resistant polymer containing an imide bond and/or having a heterocyclic ring other than the imide bond. This heat- resistant polymer is applied to a metal foil in a state dissolved in a solvent or in such a state that the precursor of the heat-resistant polymer is dissolved in a solvent and the coating layer is dried under heating using hot nitrogen, far infrared rays or high frequency waves to perform the removal of the solvent and/or dehydration. At this time, it is necessary to control the residual amount of the solvent to at least 0.02% or less and, by gradually raising temp. from room temp. at the time of heating, the solvent is prevented from remaining in the vicinity of the metal foil of the heat-resistant polymer.