公开(公告)号：EP3113211A4

公开(公告)日：2017-10-11

申请号：EP15754804

申请日：2015-01-13

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO ,  IWASAKI YASUNORI ,  TAKAGAKI TATSURO ,  IDE AKIYOSHI ,  NAKANISHI HIROKAZU

IPC: H01L21/02 ,  C04B35/115 ,  C04B37/02

CPC classification number: C04B35/115 ,  C01F7/02 ,  C04B35/62675 ,  C04B35/6268 ,  C04B35/645 ,  C04B37/00 ,  C04B37/005 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5436 ,  C04B2235/549 ,  C04B2235/72 ,  C04B2235/963 ,  C04B2237/062 ,  C04B2237/30 ,  C04B2237/343 ,  C04B2237/708 ,  H01L21/2007

公开(公告)号：EP2930751A4

公开(公告)日：2016-09-14

申请号：EP14774099

申请日：2014-03-26

Applicant: NGK INSULATORS LTD

Inventor： IDE AKIYOSHI ,  IWASAKI YASUNORI ,  MIYAZAWA SUGIO

IPC: H01L21/02 ,  C04B37/00 ,  H01L21/18

CPC classification number: H01L21/76251 ,  B23K20/00 ,  C04B35/111 ,  C04B35/115 ,  C04B35/565 ,  C04B35/581 ,  C04B35/587 ,  C04B37/001 ,  C04B37/005 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5409 ,  C04B2235/5445 ,  C04B2235/6562 ,  C04B2235/6582 ,  C04B2235/661 ,  C04B2235/662 ,  C04B2235/72 ,  C04B2235/725 ,  C04B2235/963 ,  C04B2237/062 ,  C04B2237/064 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/52 ,  C04B2237/708 ,  H01L21/02002 ,  H01L21/0243 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/76254 ,  Y10T428/24355

Abstract: A composite substrate for a semiconductor includes a handle substrate 11 and a donor substrate bonded to a surface of the handle substrate 11 directly or through a bonding layer. The handle substrate 11 is composed of an insulating polycrystalline material, a surface 15 of the handle substrate 11 has a microscopic central line average surface roughness Ra of 5 nm or smaller, and recesses 6 are formed on the surface of the handle substrate.

公开(公告)号：EP2626882A4

公开(公告)日：2014-05-28

申请号：EP11830530

申请日：2011-09-27

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO ,  WATANABE KEIICHIRO ,  OHASHI TSUNEAKI

IPC: H01J9/24 ,  B28B1/14 ,  B28B11/00 ,  H01J61/30

CPC classification number: B28B1/002 ,  H01J7/22 ,  H01J9/247 ,  H01J9/266 ,  H01J9/395 ,  H01J61/302

公开(公告)号：EP1380396A4

公开(公告)日：2004-08-18

申请号：EP02717084

申请日：2002-04-09

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO ,  HAYASHI SHINZO ,  DOI MASARU

IPC: B28B1/14 ,  B28B7/34 ,  C01B33/24 ,  C04B35/115 ,  C04B35/486 ,  C04B35/505 ,  C04B35/565 ,  C04B35/581 ,  C04B35/584 ,  C04B35/632 ,  C04B35/634 ,  C04B35/638 ,  H01J9/24 ,  H01J61/30 ,  B28B21/86

CPC classification number: H01J61/302 ,  B28B1/14 ,  B28B7/342 ,  C01B33/24 ,  C04B35/115 ,  C04B35/486 ,  C04B35/505 ,  C04B35/565 ,  C04B35/581 ,  C04B35/584 ,  C04B35/597 ,  C04B35/624 ,  C04B35/62625 ,  C04B35/6264 ,  C04B35/62655 ,  C04B35/63 ,  C04B35/632 ,  C04B35/63496 ,  C04B35/638 ,  C04B2235/3201 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3244 ,  C04B2235/3272 ,  C04B2235/3281 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/6021 ,  C04B2235/6022 ,  C04B2235/6023 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/77 ,  C04B2235/94 ,  H01J9/247 ,  Y10T428/13

Abstract: A method of manufacturing a light emitting container capable of remarkably increasing the function of the light emitting container formed by baking a hollow ceramic molded body by accurately controlling the inner shape of the body part of the hollow ceramic molded body as the precursor of the light emitting container, comprising the steps of filling slurry for molding in a forming die by using a core for molding having a wax molded body or a molded body formed with wax-like substance, curing the slurry to form the hollow ceramic molded body having the inner shape of the body part controlled on the outer peripheral surface of the molded body or the molded body formed with the wax-like substance, and baking the hollow ceramic molded body.

公开(公告)号：EP3107116A4

公开(公告)日：2018-01-03

申请号：EP15748537

申请日：2015-01-13

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO ,  IWASAKI YASUNORI ,  TAKAGAKI TATSURO ,  IDE AKIYOSHI ,  NAKANISHI HIROKAZU

IPC: H01L21/02

CPC classification number: H01L29/16 ,  C04B35/115 ,  C04B35/6264 ,  C04B35/632 ,  C04B35/634 ,  C04B37/001 ,  C04B37/005 ,  C04B37/008 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5409 ,  C04B2235/5445 ,  C04B2235/6023 ,  C04B2235/6582 ,  C04B2235/661 ,  C04B2235/662 ,  C04B2235/786 ,  C04B2237/062 ,  C04B2237/064 ,  C04B2237/08 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/52 ,  C04B2237/588 ,  C30B29/06 ,  C30B33/06 ,  H01L21/2007 ,  H01L29/0649 ,  Y10T428/24355

Abstract: A handle substrate of a composite substrate for a semiconductor is provided. The handle substrate is composed of polycrystalline alumina. The handle substrate includes an outer peripheral edge part with an average grain size of 20 to 55 µm and a central part with an average grain size of 10 to 50 µm. The average grain size of the outer peripheral edge part is 1.1 times or more and 3.0 times or less of that of the central part of the handle substrate.

公开(公告)号：EP3113586A4

公开(公告)日：2017-10-25

申请号：EP15754711

申请日：2015-02-20

Applicant: NGK INSULATORS LTD

Inventor： TAKAGAKI TATSURO ,  IWASAKI YASUNORI ,  MIYAZAWA SUGIO ,  IDE AKIYOSHI ,  NAKANISHI HIROKAZU

IPC: H05K1/03 ,  C04B35/111 ,  H05K3/00

CPC classification number: H05K1/115 ,  C04B35/111 ,  C04B35/119 ,  C04B35/634 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/3281 ,  C04B2235/3418 ,  C04B2235/6023 ,  C04B2235/606 ,  C04B2235/612 ,  C04B2235/6582 ,  C04B2235/662 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/95 ,  H01B3/12 ,  H01B17/56 ,  H05K1/03 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/0014 ,  H05K3/0029 ,  H05K2201/09009 ,  Y10T428/24273

Abstract: It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 µ m, and a diameter of the through hole is 20 to 100 µ m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 µ m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 µ m.

公开(公告)号：EP2991099A4

公开(公告)日：2016-11-30

申请号：EP14787593

申请日：2014-03-13

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO

IPC: H01L21/02 ,  C04B35/115 ,  H01L21/762

CPC classification number: C04B35/10 ,  C04B35/115 ,  C04B2235/3206 ,  C04B2235/5409 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/6027 ,  C04B2235/6582 ,  C04B2235/661 ,  C04B2235/786 ,  H01L21/2007 ,  H01L21/7624 ,  H01L21/76251 ,  Y10T428/24413

Abstract: A handle substrate is composed of a translucent alumina sintered body containing a sintering aid including at least magnesium. A concentration of magnesium at a bonding face of the handle substrate to a donor substrate is half or less of an average concentration of magnesium of the handle substrate.

Abstract translation: 手柄基板由包含至少包含镁的烧结助剂的半透明氧化铝烧结体构成。 处理基板与施主基板的接合面处的镁浓度为处理基板的镁平均浓度的一半以下。

公开(公告)号：EP2960925A4

公开(公告)日：2016-06-22

申请号：EP14754763

申请日：2014-02-18

Applicant: NGK INSULATORS LTD

Inventor： IDE AKIYOSHI ,  TAKAGAKI TATSURO ,  MIYAZAWA SUGIO ,  HORI YUJI ,  TAI TOMOYOSHI ,  HATTORI RYOSUKE

IPC: H01L21/02 ,  H01L21/683 ,  H03H3/08 ,  H03H9/145 ,  H03H9/25

CPC classification number: H01L21/6835 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/04 ,  B32B18/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/283 ,  B32B37/10 ,  B32B38/10 ,  B32B2264/105 ,  B32B2307/20 ,  B32B2307/206 ,  B32B2307/538 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2457/00 ,  B32B2457/14 ,  H01L21/78 ,  H01L41/1873 ,  H03H3/08 ,  H03H3/10 ,  H03H9/02574 ,  H03H9/25 ,  Y10T428/12597

Abstract: A composite substrate 10 includes a semiconductor substrate 12 and an insulating support substrate 14 that are laminated together. The support substrate 14 includes first and second substrates 14a and 14b made of the same material and bonded together with a strength that allows the first and second substrates 14a and 14b to be separated from each other with a blade. The semiconductor substrate 12 is laminated on a surface of the first substrate 14a opposite a surface thereof bonded to the second substrate 14b.

公开(公告)号：EP2863545A4

公开(公告)日：2016-02-24

申请号：EP13804294

申请日：2013-06-11

Applicant: NGK INSULATORS LTD

Inventor： HORI YUJI ,  TAI TOMOYOSHI ,  IDE AKIYOSHI ,  MIYAZAWA SUGIO

IPC: H01L41/313 ,  H03H9/02

CPC classification number: H01L41/081 ,  H01L41/053 ,  H01L41/1873 ,  H01L41/313 ,  H03H9/02574 ,  H03H9/25

Abstract: A composite substrate 10 includes a supporting substrate 12 and a piezoelectric substrate 14 which are bonded to each other. In this embodiment, the supporting substrate 12 and the piezoelectric substrate 14 are bonded to each other by an adhesive layer 16. In the composite substrate 10, since the supporting substrate 12 is composed of a translucent alumina ceramic, alignment is easily performed during FCB compared with the case where the supporting substrate is composed of an opaque ceramic. Furthermore, preferably, the linear transmittance and the total light transmittance from the front of the supporting substrate 12 in the visible light range (360 to 750 nm) are 10% or more and 70% or more, respectively.

公开(公告)号：EP1552913A4

公开(公告)日：2008-05-07

申请号：EP03756613

申请日：2003-10-15

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO

IPC: B28B13/06 ,  B28B1/14 ,  B28B7/34 ,  B28B7/38 ,  B28B11/24 ,  C04B35/00 ,  C04B35/111

CPC classification number: C04B35/111 ,  B28B7/342 ,  B28B13/065 ,  C04B35/624 ,  C04B35/62625 ,  C04B35/6263 ,  C04B35/6264 ,  C04B35/62655 ,  C04B2235/6023 ,  C04B2235/6582 ,  C04B2235/94 ,  H01J9/247

Abstract: A method for producing a ceramic formed article which comprises forming a ceramic formed article by the use of the gel cast method, heating the resulting formed article to take out a solvent contained in the ceramic formed article to the exterior of the article, and then releasing the article from a mold. The solvent taken out from the article forms a solvent film between the outer surface of the article and the inner surface of the mold and the solvent film aids the release of the article from the mold. Thus, the above method can be used for preventing such a ceramic formed article from being damaged in a releasing operation.