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公开(公告)号:DE602005009408D1
公开(公告)日:2008-10-16
申请号:DE602005009408
申请日:2005-01-14
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: MEGURO KIICHI , YAMAMOTO YOSHIYUKI , IMAI TAKAHIRO
IPC: C30B29/04 , C30B25/20 , H01L21/205 , C30B33/00
Abstract: A diamond single crystal substrate manufacturing method for growing by vapor-phase synthesis a single crystal from a diamond single crystal seed substrate, comprising etching away by reactive ion etching, prior to single crystal growth, at least 0.5 mu m and less than 400 mu m, in etching thickness off the surface of the seed substrate which has been mechanically polished, thereby removing from the surface of the seed substrate the work-affected layers caused by mechanical polishing; and growing then a single crystal thereon. The manufacturing method provides a diamond single crystal substrate having a high quality, large size, and no unintentional impurity inclusions, and suitable for use as semiconductor materials, electronic components, optical components or the like.
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62.
公开(公告)号:HK1094790A1
公开(公告)日:2007-04-13
申请号:HK07102147
申请日:2007-02-26
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: MEGURO KIICHI , YAMAMOTO YOSHIYUKI , IMAI TAKAHIRO
IPC: C01B20060101
Abstract: A method for manufacturing a diamond single crystal substrate, in which a single crystal is grown from a diamond single crystal serving as a seed substrate by vapor phase synthesis, said method comprising: preparing a diamond single crystal seed substrate which has a main surface whose planar orientation falls within an inclination range of not more than 8 degrees relative to a {100} plane or a {111} plane, as a seed substrate; forming a plurality of planes of different.orientation which are inclined in the outer peripheral direction of the main surface relative to the main surface on one side of this seed substrate, by machining; and then growing a diamond single crystal by vapor phase synthesis.
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公开(公告)号:CA2491242A1
公开(公告)日:2005-04-29
申请号:CA2491242
申请日:2003-12-22
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: IMAI TAKAHIRO , NISHIBAYASHI YOSHIKI , NAMBA AKIHIKO , SUMIYA HITOSHI , YAMAMOTO YOSHIYUKI
IPC: C30B29/04 , H01L21/04 , H01L21/265 , H01L21/425 , H01L21/477 , H01L29/167
Abstract: A method of manufacturing n-type semiconductor diamond by the present invention is characterized in producing diamond incorporating Li and N by implanting Li ions into, so that 10 ppm thereof will be contained i n, single-crystal diamond incorporating 10 ppm or more N, or else, in doping single-crystal diamond with Li and N ions, by implanting the ions so that ion-implantation depths at which the post-implantation Li and N concentrations each are 10 ppm or more will overlap, and thereafter annealin g the diamond in a temperature range of from 800.degree.C or more to less than 1800.degree.C to electrically activate the Li and N and restore the diamond crystalline structure. In the present invention, n-type semiconductor diamond incorporates, from the surface of the crystal to the same depth, 10 ppm or more of each of Li and N, wherein its sheet resistance is 10 7 .OMEGA./~ or less.
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公开(公告)号:DE69915903T2
公开(公告)日:2005-02-10
申请号:DE69915903
申请日:1999-01-15
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: YAMAMOTO YOSHIYUKI , SAITO HIROHISA , IMAI TAKAHIRO
IPC: H01L21/48 , H01L23/14 , H01L23/373 , H01L23/495 , H01L23/66
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公开(公告)号:DE69817642T2
公开(公告)日:2004-08-05
申请号:DE69817642
申请日:1998-03-10
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: SAITO HIROHISA , TSUNO TAKASHI , SHIOMI HIROMU , KUMAZAWA YOSHIAKI , IMAI TAKAHIRO
Abstract: An electron-emitting element comprises a diamond substrate, and a diamond protrusion grown on a surface of the diamond substrate so as to have a pointed portion in a form capable of emitting an electron. Since the diamond protrusion formed by growth has a sharply pointed tip portion, it can fully emit electrons. Preferably, the surface of the diamond substrate is a ä100ü face, and the diamond protrusion is surrounded by ä111ü faces.
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公开(公告)号:CA2153848C
公开(公告)日:2003-05-13
申请号:CA2153848
申请日:1995-07-13
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: TANAKA MOTOYUKI , IMAI TAKAHIRO , FUJIMORI NAOJI
Abstract: An oxide thin film having a quartz crystal structure formed on a substrate, the oxide thin film being composed of a single layer or a plurality of layers having a thickness of 5 nm to 50 .mu.m per layer, each of the layer comprising silicon dioxide, germanium dioxide, or a mixture thereof.
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公开(公告)号:DE69521409T2
公开(公告)日:2002-05-16
申请号:DE69521409
申请日:1995-11-21
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: UTSUMI YOSHIHARU , IMAI TAKAHIRO , FUJIMORI NAOJI
Abstract: Boron-aluminum nitride BxAl1-xNy (0.001
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公开(公告)号:DE3856475T2
公开(公告)日:2001-11-08
申请号:DE3856475
申请日:1988-03-11
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: IMAI TAKAHIRO , FUJIMORI NAOJI , NAKAHATA HIDEAKI
Abstract: A thin film single crystal substrate which comprises a base substrate made of single crystal diamond having the (100) or (110) plane orientation, an intermediate layer of single crystal silicon carbide, and at least one thin film of a single crystal of a material selected from the group consisting of silicon, boron nitride, gallium nitride, indium nitride, aluminum nitride, boron phosphide, cadmium selenide, germanium, gallium arsenide, gallium phosphide, indium phosphide, gallium antimonide, indium arsenide, indium antimonide, aluminum phosphide, aluminum arsenide, aluminum antimonide, cadmium telluride, mercury sulfide, zinc oxide, zinc sulfide, zinc selenide and zinc telluride.
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公开(公告)号:DE69521409D1
公开(公告)日:2001-07-26
申请号:DE69521409
申请日:1995-11-21
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: UTSUMI YOSHIHARU , IMAI TAKAHIRO , FUJIMORI NAOJI
Abstract: Boron-aluminum nitride BxAl1-xNy (0.001
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公开(公告)号:DE3856475D1
公开(公告)日:2001-07-12
申请号:DE3856475
申请日:1988-03-11
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: IMAI TAKAHIRO , FUJIMORI NAOJI , NAKAHATA HIDEAKI
Abstract: A thin film single crystal substrate which comprises a base substrate made of single crystal diamond having the (100) or (110) plane orientation, an intermediate layer of single crystal silicon carbide, and at least one thin film of a single crystal of a material selected from the group consisting of silicon, boron nitride, gallium nitride, indium nitride, aluminum nitride, boron phosphide, cadmium selenide, germanium, gallium arsenide, gallium phosphide, indium phosphide, gallium antimonide, indium arsenide, indium antimonide, aluminum phosphide, aluminum arsenide, aluminum antimonide, cadmium telluride, mercury sulfide, zinc oxide, zinc sulfide, zinc selenide and zinc telluride.
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