PRODUCTION OF HEAT-RESISTANT RESIN MOLDING

    公开(公告)号:JPS5891727A

    公开(公告)日:1983-05-31

    申请号:JP18971581

    申请日:1981-11-26

    Abstract: PURPOSE:To produce the titled molding excellent in heat resistance and mechaical properties, by heat-treating a molding of a specified thermoplastic polyamide-imide copolymer. CONSTITUTION:A thermoplastic polyamide-imide copolymer having structural units of formulas III-VI, wherein Z is a trifunctional aromatic group, two of the three functional groups of which are bonded to the adjacent C atoms, is obtained by reacting 1mol of a mixture consisting of 4-70mol% aromatic tricarboxylic anhydride chloride and 96-30mol% aromatic dicarboxylic chloride with 0.9- 1.1mol of a diamine mixture consisting of 10-96mol% aromatic diamine of formulaI, wherein R is H or methyl, and 90-4mol% aromatic diamine of formula II, wherein X is -SO2-, -S- or -O-, and then subjecting the product to a dehydration ring closure. This copolymer is melt-molded under conditions including a temperature of 300-400 deg.C and a pressure of 50-500kg/cm , and heat-treated for at least 5hr at a temperature above 200 deg.C and below the glass transition point of the copolymer.

    PREPARATION OF MOLDED ARTICLE OF HEAT-RESISTANT RESIN

    公开(公告)号:JPS57198732A

    公开(公告)日:1982-12-06

    申请号:JP8244781

    申请日:1981-06-01

    Abstract: PURPOSE:To improve the heat resistance, mechanical properties, solvent resistance, etc. of a molded article consisting of a high-melting polyamide resin, by heating it under specific conditions so that a crosslinking reaction takes place in it. CONSTITUTION:A polyamide resin comprising preferably >=70mol% repeating unit shown by the formula (R is 1,4-phenyl group or 1,4-cyclohexyl group; n is 10-14) as a main constitutional unit, or a resin composition obtained by blending optionally the polyamide resin with =150 deg.C is melted and molded to give a molded article. This molded article is heat-treated in a temperature range >=200 deg.C and the melting point of the polyamide resin for >=5hr, preferably >=10hr, to give the desired molded article.

    POLYAMIDEEIMIDE RESIN COMPOSITION
    63.
    发明专利

    公开(公告)号:JPS5610558A

    公开(公告)日:1981-02-03

    申请号:JP8587179

    申请日:1979-07-09

    Abstract: PURPOSE:A polyamide-imide resin composition, having balanced flow and mechanical characteristics, composed of an aromatic polyamide-imide resin and a specified amount of a polyphenylene ether resin. CONSTITUTION:A composition, composed of (A) 5-99.9wt% of an aromatic polyamide-imide resin, having a repeating unit of the formula (wherein Ar is a trivalent aromatic residue, including a 6C ring; R is 9 bivalent aromatic and/or aliphatic residue; R' is methyl or phenyl), as the main structural unit, (B) 0.1- 50wt% of a polyphenylene ether resin, and (C) 0-70wt% of a filler. The polyphenylene ether resin contains a phenylene ether linkage as a part of the reapting unit and is decomposed at a temperature >=350 deg.C. A polyphenylene ether resin of decomposition temperature

    PREPARATION OF GRAFT POLYMER
    64.
    发明专利

    公开(公告)号:JPS5536210A

    公开(公告)日:1980-03-13

    申请号:JP10848078

    申请日:1978-09-06

    Abstract: PURPOSE:To prepare a graft polymer useful for electric parts, etc. and having improved heat resistance and melt moldability, by polymerizing vinyl monomers in the presence of a polyarylene ether sulfone having carbon-carbon double bonds at the chain ends or the side chains. CONSTITUTION:A graft polymer is prepared by polymerizing vinyl monomers (e.g. mixture of acrylonitrile and styrene etc.) in the presence of a polyarylene ether sulfone having carbon-carbon double bonds at the chain ends and/or side chains, and of a radical polymerization initiator. For example, the polyarylene ether sulfone is prepared by adding an aqueous solution of sodium hydroxide to a solution of 4, 4'-dichlorodiphenyl sulfone and bisphenol A under heating, and reacting the reaction product with methacryloyl chloride.

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