公开(公告)号：US10178755B2

公开(公告)日：2019-01-08

申请号：US15590020

申请日：2017-05-09

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Kai-Ming Yang ,  Chien-Tsai Li

IPC: H05K1/02 ,  H05K1/11

Abstract: A circuit board includes a first dielectric layer, a first circuit layer, a second circuit layer, a plurality of conductive vias, a second dielectric layer, a patterned seed layer, and a plurality of bonding layers. The first circuit layer is disposed in the first dielectric layer. The second circuit layer is disposed on the first dielectric layer. The conductive vias are disposed in the first dielectric layer and connect the first circuit layer to the second circuit layer. The second dielectric layer is disposed on the first dielectric layer and the second circuit layer and has a plurality of openings to expose a plurality of parts of the second circuit layer. The patterned seed layer is disposed on the exposed parts of second circuit layer and sidewalls of the openings. The bonding layers are respectively disposed on the patterned seed layer and made of porous copper.

公开(公告)号：US20160268206A1

公开(公告)日：2016-09-15

申请号：US14644197

申请日：2015-03-10

Applicant: Unimicron Technology Corp.

Inventor： Dyi-Chung Hu ,  Yin-Po Hung ,  Ra-Min Tain ,  Yu-Hua Chen

IPC: H01L23/538 ,  H01L21/768

CPC classification number: H01L21/76879 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827

Abstract: An interconnection structure and a manufacturing method thereof are provided. The interconnection structure includes a substrate, a conductive through via, a dielectric layer, and a conductive layer. The substrate has a first surface and a second surface opposite to each other. The conductive through via is disposed in the substrate and extended from the first surface beyond the second surface. The dielectric layer is disposed on the substrate, wherein the dielectric layer has an opening exposing a portion of the conductive through via. The top surface of the conductive through via protrudes from the bottom surface of the opening. The conductive layer is disposed in the opening and connected to the conductive through via.

Abstract translation: 提供互连结构及其制造方法。 互连结构包括衬底，导电通孔，电介质层和导电层。 基板具有彼此相对的第一表面和第二表面。 导电通孔设置在基板中并从第一表面延伸超过第二表面。 介电层设置在基板上，其中电介质层具有露出导电通孔的一部分的开口。 导电通孔的顶表面从开口的底表面突出。 导电层设置在开口中并连接到导电通孔。