公开(公告)号：US12000960B2

公开(公告)日：2024-06-04

申请号：US16829778

申请日：2020-03-25

Applicant: INNOVIZ TECHNOLOGIES LTD

Inventor： Oded Yeruhami ,  Amit Steinberg ,  Nir Osiroff ,  Ronen Eshel

IPC: G01S7/481 ,  B60S1/02 ,  B81B3/00 ,  G01H1/00 ,  G01S7/48 ,  G01S7/484 ,  G01S7/4863 ,  G01S7/4911 ,  G01S7/4914 ,  G01S7/497 ,  G01S17/06 ,  G01S17/10 ,  G01S17/32 ,  G01S17/42 ,  G01S17/58 ,  G01S17/89 ,  G01S17/931 ,  G02B26/12

CPC classification number: G01S7/4817 ,  B60S1/02 ,  B81B3/0018 ,  G01H1/00 ,  G01S7/4802 ,  G01S7/4808 ,  G01S7/4814 ,  G01S7/4815 ,  G01S7/4816 ,  G01S7/484 ,  G01S7/4863 ,  G01S7/4911 ,  G01S7/4914 ,  G01S7/497 ,  G01S17/06 ,  G01S17/10 ,  G01S17/32 ,  G01S17/42 ,  G01S17/58 ,  G01S17/89 ,  G01S17/931 ,  B81B2201/04 ,  G01S2007/4975 ,  G02B26/122

Abstract: In some embodiments, a LIDAR system may include at least one processor configured to control at least one light source for projecting light toward a field of view and receive from at least one first sensor first signals associated with light projected by the at least one light source and reflected from an object in the field of view, wherein the light impinging on the at least one first sensor is in a form of a light spot having an outer boundary. The processor may further be configured to receive from at least one second sensor second signals associated with light noise, wherein the at least one second sensor is located outside the outer boundary; determine, based on the second signals received from the at least one second sensor, an indicator of a magnitude of the light noise; and determine, based on the indicator the first signals received from the at least one first sensor and, a distance to the object.

公开(公告)号：US11772959B2

公开(公告)日：2023-10-03

申请号：US17940770

申请日：2022-09-08

Applicant: Mirrorcle Technologies, Inc.

Inventor： Stefan Richter ,  Johannes Kindt ,  Veljko Milanovic

IPC: B81B3/00 ,  H02N1/00

CPC classification number: B81B3/0078 ,  H02N1/008 ,  B81B2201/04 ,  B81B2203/0154 ,  B81B2203/058

Abstract: MEMS devices include a suspended element connected to a fixed part of a substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate. An actuator coupled to the suspended element and a damping structure coupled to the suspended element extends into a gap between the suspended element and the fixed part of the substrate. One or more fluid confinement structures are configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.

公开(公告)号：US11726312B2

公开(公告)日：2023-08-15

申请号：US17844617

申请日：2022-06-20

Applicant: AG MICROSYSTEMS, INC.

Inventor： Asif Godil ,  Chase Valiente

IPC: G02B26/08 ,  G02B26/10 ,  B81B7/00 ,  B81B7/02

CPC classification number: G02B26/0841 ,  G02B26/0833 ,  B81B7/0003 ,  B81B7/02 ,  B81B2201/04 ,  B81B2203/0145 ,  B81B2207/091 ,  G02B26/101 ,  G02B26/105

Abstract: A layered hinge design providing an improved shock and vibration performance for a two-axis MEMS Micromirror featuring combs drive actuation with independent drive and control for rotating the Micromirror along two-axis of rotation. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, a plurality of actuation voltages are driven via conductive layers forming one or more hinges allowing the Micromirror to rotate along the two-axis of rotation. The layered hinge design achieves set angles that are highly stable over time and provides a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration.

公开(公告)号：US20230239626A1

公开(公告)日：2023-07-27

申请号：US18127506

申请日：2023-03-28

Applicant: Meta Platforms Technologies, LLC

Inventor： Limin Zhou ,  Chuming Zhao ,  Rex Pinegar Price ,  Mekell Jiles ,  Kevin Connor

IPC: H04R9/04 ,  B81B7/02 ,  H04R29/00 ,  H04R9/06 ,  H05K1/02

CPC classification number: H04R9/046 ,  B81B7/02 ,  H04R29/001 ,  H04R9/06 ,  H04R9/045 ,  B81B2201/04 ,  H05K1/0271

Abstract: A coil assembly for integration into a transducer is presented. The coil assembly may include a metal bobbin assembly, a wire coil, and one or more nonconductive printed circuit board (PCB) stiffeners. A speaker that renders micro noise in an artificial reality environment for improving simulated presence is further presented. The speaker may generate a plurality of micro noises based in part on the determined state of the virtual object. The speaker may spatialize the plurality of micro noises, such that the plurality of micro noises appears to originate from the virtual object. A speaker for speaker diaphragm motion detection using optical MEMS sensors is further presented. Optical MEMS sensors are used to optically monitor displacement of one or more portions of a speaker diaphragm. The speaker may be configured to determine that a speaker diaphragm is in rocking mode and move the speaker diaphragm out of rocking mode.

公开(公告)号：US11686667B2

公开(公告)日：2023-06-27

申请号：US17407803

申请日：2021-08-20

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Rainer Markus Schaller

IPC: G01N21/17 ,  G01N29/24 ,  B81B7/02

CPC classification number: G01N21/1702 ,  B81B7/02 ,  G01N29/2425 ,  B81B2201/0264 ,  B81B2201/04 ,  B81B2203/0315 ,  G01N2021/1704

Abstract: A photoacoustic sensor includes a first layer with an optical MEMS emitter; a second layer stacked over the first layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are offset laterally with respect to one another; and a third layer stacked over the second layer with a cavity for a reference gas. The optical MEMS emitter transmits optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is outside the course of the optical path.

公开(公告)号：US09969610B2

公开(公告)日：2018-05-15

申请号：US15416206

申请日：2017-01-26

Applicant: Raytheon Company

Inventor： Buu Q. Diep ,  Adam M. Kennedy ,  Thomas Allan Kocian ,  Mark Lamb

IPC: H01L31/0203 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

公开(公告)号：US09803979B2

公开(公告)日：2017-10-31

申请号：US14860443

申请日：2015-09-21

Applicant: Honeywell International Inc.

Inventor： Robert D. Horning ,  Grant Lodden

IPC: G01C19/00 ,  G01C19/5726 ,  G01C19/5621 ,  G01C19/5656 ,  G01C25/00 ,  G01P15/093 ,  G01P21/00 ,  G01C19/574 ,  G01P15/03 ,  G02B6/293 ,  G01P15/08

CPC classification number: G01C19/5726 ,  B81B2201/0228 ,  B81B2201/04 ,  B81B2203/053 ,  G01C19/5621 ,  G01C19/5656 ,  G01C19/574 ,  G01C25/00 ,  G01P15/032 ,  G01P15/093 ,  G01P21/00 ,  G01P2015/0822 ,  G02B6/29331

Abstract: Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.

公开(公告)号：US09771258B2

公开(公告)日：2017-09-26

申请号：US14748482

申请日：2015-06-24

Applicant: Raytheon Company

Inventor： Buu Q. Diep ,  Adam M. Kennedy ,  Thomas Allan Kocian ,  Mark Lamb

IPC: H01L23/498 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

公开(公告)号：US09715107B2

公开(公告)日：2017-07-25

申请号：US14599507

申请日：2015-01-18

Applicant: APPLE INC.

Inventor： Yuval Gerson ,  Naftali Chayat ,  Noel Axelrod ,  Alexander Shpunt

IPC: G02B26/10 ,  G01S17/10 ,  G01S17/42 ,  G01S7/481 ,  G02B26/08 ,  B81C1/00 ,  G01S17/89

CPC classification number: G02B26/101 ,  B81B2201/04 ,  B81C1/0015 ,  B81C2201/013 ,  G01S7/4817 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G02B26/085

Abstract: A scanning device includes a substrate, which is etched to define an array of two or more parallel rotating members and a gimbal surrounding the rotating members. First hinges connect the gimbal to the substrate and defining a first axis of rotation, about which the gimbal rotates relative to the substrate. Second hinges connect the rotating members to the support and defining respective second, mutually-parallel axes of rotation of the rotating members relative to the support, which are not parallel to the first axis.

公开(公告)号：US09423605B2

公开(公告)日：2016-08-23

申请号：US13202528

申请日：2010-02-19

Applicant: Sasikanth Manipatruni ,  Michal Lipson ,  Jacob T. Robinson

Inventor： Sasikanth Manipatruni ,  Michal Lipson ,  Jacob T. Robinson

IPC: G02B26/00 ,  G02B6/42 ,  A61F9/02 ,  G02B1/00 ,  H01S3/00

CPC classification number: G02B26/001 ,  A61F9/022 ,  A61F9/023 ,  B81B3/0083 ,  B81B2201/04 ,  B81B2201/047 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81C1/0015 ,  B81C2201/013 ,  G02B1/005 ,  G02B6/4209 ,  G02C7/104 ,  G02C7/107 ,  H01S3/005 ,  H01S3/0064

Abstract: There is set forth herein an optomechanical device which can comprise a first mirror and a second mirror forming with the first mirror a cavity. In one aspect the first mirror can be a movable mirror. The optomechanical device can be adapted so that the first mirror is moveable responsively to radiation force.

Abstract translation: 这里提出了一种光学机械装置，其可以包括第一反射镜和形成有第一反射镜的第二反射镜的腔。 在一个方面，第一镜可以是可移动镜。 光学机械装置可以适于使得第一反射镜能够响应于辐射力而移动。