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    Reducing MEMS stiction by deposition of nanoclusters
    62.
    发明授权
    Reducing MEMS stiction by deposition of nanoclusters 有权
    通过沉积纳米团簇减少MEMS粘结

    公开(公告)号：US09290380B2

    公开(公告)日：2016-03-22

    申请号：US13718614

    申请日：2012-12-18

    Applicant: Robert F. Steimle ,  Ruben B. Montez

    Inventor： Robert F. Steimle ,  Ruben B. Montez

    IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08

    CPC classification number: B81B3/001 ,  B81B3/0005 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/06 ,  B81C1/0096 ,  B81C2201/115 ,  G01P15/0802 ,  G01P2015/0871 ,  G01P2015/0874

    Abstract: A mechanism for reducing stiction in a MEMS device by decreasing surface area between two surfaces that can come into close contact is provided. Reduction in contact surface area is achieved by increasing surface roughness of one or both of the surfaces. The increased roughness is provided by forming a micro-masking layer on a sacrificial layer used in formation of the MEMS device, and then etching the surface of the sacrificial layer. The micro-masking layer can be formed using nanoclusters. When a next portion of the MEMS device is formed on the sacrificial layer, this portion will take on the roughness characteristics imparted on the sacrificial layer by the etch process. The rougher surface decreases the surface area available for contact in the MEMS device and, in turn, decreases the area through which stiction can be imparted.

    Abstract translation: 提供了一种用于通过减小可以紧密接触的两个表面之间的表面积来减小MEMS器件中的静摩擦的机构。 通过增加一个或两个表面的表面粗糙度来实现接触表面积的减小。 通过在用于形成MEMS器件的牺牲层上形成微掩模层，然后蚀刻牺牲层的表面来提供增加的粗糙度。 微掩模层可以使用纳米团簇形成。 当MEMS器件的下一部分形成在牺牲层上时，该部分将通过蚀刻工艺承受赋予牺牲层的粗糙度特性。 较粗糙的表面减小了可用于MEMS器件中的接触的表面积，并且进而降低了可赋予粘性的面积。

    MEMS devices with multi-component sacrificial layers
    63.
    发明授权
    MEMS devices with multi-component sacrificial layers 失效
    具有多组分牺牲层的MEMS器件

    公开(公告)号：US08300299B2

    公开(公告)日：2012-10-30

    申请号：US13098292

    申请日：2011-04-29

    Applicant: Ming-Hau Tung ,  Lior Kogut

    Inventor： Ming-Hau Tung ,  Lior Kogut

    IPC: G02B26/00 ,  H01L21/311

    CPC classification number: B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

    Abstract: Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

    Abstract translation: 公开了在微机电装置的一个或多个表面上形成保护涂层的方法，其包括以下步骤：形成牺牲材料和保护材料的复合层，并选择性地蚀刻牺牲材料以形成保护涂层。 本发明的保护性涂层优选地改进了其中并入其中的微机电装置的性能的一个或多个方面。 还公开了通过本发明的方法形成的微机电装置以及包括这种装置的视觉显示装置。

    Method for fabricating nano-scale patterned surfaces
    64.
    发明授权
    Method for fabricating nano-scale patterned surfaces 失效
    制造纳米尺度图案表面的方法

    公开(公告)号：US08288945B2

    公开(公告)日：2012-10-16

    申请号：US12880107

    申请日：2010-09-12

    Applicant: Ron Naaman ,  Ben Golan ,  Zeev Fradkin ,  Adam Winkleman ,  Dan Oron

    Inventor： Ron Naaman ,  Ben Golan ,  Zeev Fradkin ,  Adam Winkleman ,  Dan Oron

    IPC: H01J40/06 ,  H01J9/12

    CPC classification number: B81C1/00206 ,  B81C1/00031 ,  B81C2201/0132 ,  B81C2201/115 ,  G03F7/40

    Abstract: A method for fabrication of substrate having a nano-scale surface roughness is presented. The method comprises: patterning a surface of a substrate to create an array of spaced-apart regions of a light sensitive material; applying a controllable etching to the patterned surface, said controllable etching being of a predetermined duration selected so as to form a pattern with nano-scale features; and removing the light sensitive material, thereby creating a structure with the nano-scale surface roughness. Silanizing such nano-scale roughness surface with hydrophobic molecules results in the creation of super-hydrophobic properties characterized by both a large contact angle and a large tilting angle. Also, deposition of a photo-active material on the nano-scale roughness surface results in a photocathode with enhanced photoemission yield. This method also provides for fabrication of a photocathode insensitive to polarization of incident light.

    Abstract translation: 提出了一种具有纳米级表面粗糙度的基板的制造方法。 该方法包括：图案化基板的表面以产生光敏材料的间隔开的区域的阵列; 对所述图案化表面施加可控制的蚀刻，所述可控蚀刻具有预定的持续时间，以便形成具有纳米尺度特征的图案; 并去除感光材料，从而产生具有纳米级表面粗糙度的结构。 用疏水分子对这样的纳米级粗糙表面进行硅烷化，导致产生了以接触角大和倾斜角大的特征的超疏水特性。 而且，在纳米级粗糙度表面上沉积光活性材料导致光电阴极具有增强的光电转换率。 该方法还提供对入射光的极化不敏感的光电阴极的制造。

    Display device with at least one movable stop element
    65.
    发明授权
    Display device with at least one movable stop element 有权
    具有至少一个可移动止动元件的显示装置

    公开(公告)号：US08270062B2

    公开(公告)日：2012-09-18

    申请号：US12562093

    申请日：2009-09-17

    Applicant: Manish Kothari ,  Sauri Gudlavalleti ,  Stephen Zee

    Inventor： Manish Kothari ,  Sauri Gudlavalleti ,  Stephen Zee

    IPC: G02B26/00

    CPC classification number: B81B3/0008 ,  B81B2201/042 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  G02B26/0841

    Abstract: In certain embodiments, a device is provided including a substrate and a plurality of supports over the substrate. The device may further include a mechanical layer having a movable portion and a stationary portion. The stationary portion may disposed over the supports. In certain embodiments, the device further includes a reflective surface positioned over the substrate and mechanically coupled to the movable portion. The device of certain embodiments further includes at least one movable stop element displaced from and mechanically coupled to the movable portion. In certain embodiments, the at least a portion of the stop element may be positioned over the stationary portion.

    Abstract translation: 在某些实施例中，提供了一种包括衬底和在衬底上的多个支撑体的装置。 该装置还可以包括具有可移动部分和固定部分的机械层。 固定部分可以设置在支撑件上方。 在某些实施例中，所述装置还包括位于所述基板上并且机械地联接到所述可移动部分的反射表面。 某些实施例的装置还包括至少一个可动止动元件，该可移动止动元件从可移动部分移动并机械联接到可动部 在某些实施例中，止动元件的至少一部分可以定位在固定部分上方。

    Micromechanical Component and Manufacturing Method
    66.
    发明申请
    Micromechanical Component and Manufacturing Method 有权
    微机械部件和制造方法

    公开(公告)号：US20080315332A1

    公开(公告)日：2008-12-25

    申请号：US12090566

    申请日：2006-11-29

    Applicant: Arnd Kaelberer ,  Jens Frey

    Inventor： Arnd Kaelberer ,  Jens Frey

    IPC: H01L29/84 ,  H01L21/00 ,  G11B5/65

    CPC classification number: B81C1/00984 ,  B81B3/001 ,  B81C2201/115 ,  Y10T428/24355

    Abstract: A micromechanical component has a substrate, a first intermediate layer which is situated thereupon, and a first layer which is situated thereupon and is structured down to the first intermediate layer. A second intermediate layer is situated above the first layer. A second layer is situated on the former, at least one movable micromechanical structure being structured into the second layer. The second intermediate layer is removed in a sacrificial zone beneath the movable micromechanical structure and the first intermediate layer is partially removed in zones beneath the first layer. The movable micromechanical structure is provided with at least one stop surface on a bottom face, this stop surface being contactable with a zone of the first layer which is supported by the first intermediate layer by deflection of the movable micromechanical structure. A method for producing such a micromechanical component is also described.

    Abstract translation: 微机械部件具有衬底，位于其上的第一中间层和位于其上并且被构造成第一中间层的第一层。 第二中间层位于第一层上方。 第二层位于前者上，至少一个可移动微机械结构被构造成第二层。 第二中间层在可移动微机械结构下面的牺牲区域中被去除，并且第一中间层在第一层下面的区域中被部分地去除。 可移动微机械结构在底面上设置有至少一个止动表面，该止动表面可通过可移动微机械结构的偏转而与第一层的区域接触，该区域由第一中间层支撑。 还描述了一种用于制造这种微机械部件的方法。

    Surface roughening process
    67.
    发明申请
    Surface roughening process 有权
    表面粗糙化处理

    公开(公告)号：US20080176381A1

    公开(公告)日：2008-07-24

    申请号：US11827709

    申请日：2007-07-13

    Applicant: Bernard Aspar ,  Chrystelle Lagahe Blanchard ,  Nicolas Sousbie

    Inventor： Bernard Aspar ,  Chrystelle Lagahe Blanchard ,  Nicolas Sousbie

    IPC: H01L21/30 ,  H01L21/44

    CPC classification number: B81C1/00952 ,  B81B3/001 ,  B81C2201/115

    Abstract: A process of forming a rough interface in a semiconductor substrate. The process includes the steps of depositing a material on a surface of the substrate, forming a zone of irregularities in the material, and forming a rough interface in the semiconductor substrate by a thermal oxidation of the material and a part of the substrate. Additionally, the surface of the oxidized material may be prepared and the surface may be assembled with a second substrate.

    Abstract translation: 在半导体衬底中形成粗糙界面的工艺。 该方法包括以下步骤：在衬底的表面上沉积材料，在材料中形成不规则区域，并通过材料和衬底的一部分的热氧化在半导体衬底中形成粗糙界面。 此外，可以制备氧化材料的表面，并且表面可以与第二衬底组装。

    Surface preparation for selective silicon fusion bonding
    68.
    发明授权
    Surface preparation for selective silicon fusion bonding 失效
    用于选择性硅熔融粘合的表面处理

    公开(公告)号：US07372074B2

    公开(公告)日：2008-05-13

    申请号：US11247700

    申请日：2005-10-11

    Applicant: James C. Milne ,  Leonard J. McNally

    Inventor： James C. Milne ,  Leonard J. McNally

    IPC: H01L29/04 ,  H01L31/036 ,  H01L23/02 ,  H01L23/12 ,  H01L23/06

    CPC classification number: B81B3/001 ,  B81C2201/115 ,  B81C2203/036

    Abstract: An apparatus and method for a silicon-based Micro-Electro Mechanical System (MEMS) device, including a pair of silicon cover structures each having a substantially smooth and planar contact surface formed thereon; a silicon mechanism structure having a part thereof that is movably suspended relative to a relatively stationary frame portion thereof, the frame portion being formed with substantially parallel and spaced-apart smooth and planar contact surfaces; a relatively rough surface disposed between the contact surfaces of the covers and corresponding surfaces of the movable part of the mechanism structure; and wherein the contact surfaces of the cover structures form silicon fusion bond joints with the respective contact surfaces of the mechanism frame.

    Abstract translation: 一种硅基微电子机械系统（MEMS）器件的装置和方法，包括一对硅覆盖结构，每个硅覆盖结构具有形成在其上的基本平滑且平坦的接触表面; 硅机构结构，其一部分相对于其相对固定的框架部分可移动地悬挂，所述框架部分形成有大致平行且间隔开的平滑和平坦的接触表面; 布置在所述盖的接触表面和所述机构结构的可移动部分的对应表面之间的相对粗糙的表面; 并且其中所述覆盖结构的接触表面与所述机构框架的相应接触表面形成硅熔合接合点。

    Surface preparation for selective silicon fusion bonding
    69.
    发明申请
    Surface preparation for selective silicon fusion bonding 失效
    用于选择性硅熔融粘合的表面处理

    公开(公告)号：US20070082420A1

    公开(公告)日：2007-04-12

    申请号：US11247700

    申请日：2005-10-11

    Applicant: James Milne ,  Leonard McNally

    Inventor： James Milne ,  Leonard McNally

    IPC: H01L21/00

    CPC classification number: B81B3/001 ,  B81C2201/115 ,  B81C2203/036

    Abstract: An apparatus and method for a silicon-based Micro-Electro Mechanical System (MEMS) device, including a pair of silicon cover structures each having a substantially smooth and planar contact surface formed thereon; a silicon mechanism structure having a part thereof that is movably suspended relative to a relatively stationary frame portion thereof, the frame portion being formed with substantially parallel and spaced-apart smooth and planar contact surfaces; a relatively rough surface disposed between the contact surfaces of the covers and corresponding surfaces of the movable part of the mechanism structure; and wherein the contact surfaces of the cover structures form silicon fusion bond joints with the respective contact surfaces of the mechanism frame.

    Abstract translation: 一种硅基微电子机械系统（MEMS）器件的装置和方法，包括一对硅覆盖结构，每个硅覆盖结构具有形成在其上的基本平滑且平坦的接触表面; 硅机构结构，其一部分相对于其相对固定的框架部分可移动地悬挂，所述框架部分形成有大致平行且间隔开的平滑和平坦的接触表面; 布置在所述盖的接触表面和所述机构结构的可移动部分的对应表面之间的相对粗糙的表面; 并且其中所述覆盖结构的接触表面与所述机构框架的相应接触表面形成硅熔合接合点。

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