Abstract:
A plasma generating electrode of the invention present includes at least a pair of electrodes 5, at least one electrode 5a of the pair of electrodes 5 including a plate-like ceramic body 2 as a dielectric and a conductive film 3 disposed inside the ceramic plate 2 and having a plurality of through-holes 4 formed through the conductive film 3 in its thickness direction, the through-holes having a cross-sectional shape including an arc shape along a plane perpendicular to the thickness direction. The plasma generating electrode can generate uniform and stable plasma at low power consumption.
Abstract:
A plasma apparatus, various components of the plasma apparatus, and an oxygen free and nitrogen free processes for effectively removing photoresist material and post etch residues from a substrate with a carbon and/or hydrogen containing low k dielectric layer(s).
Abstract:
A TEOS trap for controlling TEOS polymerization from reaction furnace effluent in a vacuum pump line a SiO2 CVD process includes a molecular species-selective flow impeding medium that adsorbs and retains TEOS and water molecules from the effluent long enough to consume substantially all the water molecules in TEOS hydrolysis reactions while allowing non-hydrolyzed teos, ethylene, and other gaseous byproducts to pass through the trap and retaining solid and liquid phase SiO2-rich TEOS polymers formed by the hydrolysis reactions in the trap for subsequent removal and disposal. The molecular species-selective flow impeding medium has a plurality of absorption surfaces to make a surface density that performs the TEOS and water flow impeding function and solid and liquid phase TEOS polymer trapping function.
Abstract:
An apparatus for converting PFC gases exhausted from semiconductor processing equipment to less harmful, non-PFC gases. One embodiment of the apparatus includes a silicon filter and a plasma generation system. The plasma generation system forms a plasma from the effluent PFC gases. Constituents from the plasma react with silicon and/or oxygen in the filter and convert the effluent PFC gases to less harmful, non-PFC gaseous products and byproducts. Another embodiment includes a plasma generation system and a particle trapping and collection system. The particle trapping and collection system traps silicon containing residue from deposition processes that produces such residue, and the plasma generation system forms a plasma from the effluent PFC gases. Constituents from the plasma react with the collected residue to convert the effluent PFC gases to less harmful, non-PFC gaseous products and byproducts.
Abstract:
Provided is a plasma reactor for removal of contaminants, which is installed between a process chamber and a vacuum pump and removes contaminants emitted from a process chamber. The plasma reactor includes: at least one dielectric body that forms a plasma generation space therein; a ground electrode connected to at least one end of the dielectric body; and at least one driving electrode fixed to an outer peripheral surface of the dielectric body, and connected to an AC power supply unit to receive an AC driving voltage. The ground electrode has a non-uniform diameter along the lengthwise direction of the plasma reactor.
Abstract:
The present invention provides a plasma reactor for abating hazardous materials generated in a low-pressure process during a process of manufacturing a display or a semiconductor. A plasma reactor for abating hazardous materials according to an exemplary embodiment of the present invention includes: a first ground electrode (21) and a second ground electrode (22) disposed at a distance from each other; a dielectric (30) fixed between the first ground electrode (21) and the second ground electrode (22); and at least one driving electrode (50) disposed on an outer surface of the dielectric, being spaced apart from the first ground electrode and the second ground electrode and connected to an AC power supply unit (40) to receive a driving voltage therefrom.
Abstract:
A plasma apparatus, various components of the plasma apparatus, and an oxygen free and nitrogen free processes for effectively removing photoresist material and post etch residues from a substrate with a carbon and/or hydrogen containing low k dielectric layer(s).
Abstract:
A TEOS trap for controlling TEOS polymerization from reaction furnace effluent in a vacuum pump line a SiO2 CVD process includes a molecular species-selective flow impeding medium that adsorbs and retains TEOS and water molecules from the effluent long enough to consume substantially all the water molecules in TEOS hydrolysis reactions while allowing non-hydrolyzed teos, ethylene, and other gaseous byproducts to pass through the trap and retaining solid and liquid phase SiO2-rich TEOS polymers formed by the hydrolysis reactions in the trap for subsequent removal and disposal. The molecular species-selective flow impeding medium has a plurality of absorption surfaces to make a surface density that performs the TEOS and water flow impeding function and solid and liquid phase TEOS polymer trapping function.
Abstract:
A method and apparatus for grounding a chamber isolation valve (101) are provided. Generally, the method makes use of an electrically conductive elastomeric member or members (107a) to effectively ground a chamber isolation valve and/or isolation valve door (107) while avoiding metal-to-metal contact between moving parts in the processing system. In one embodiment, the elastomeric member is attached to and in electrical communication with the door (107) of the chamber isolation valve. The elastomeric member is brought into contact with a grounded component of the plasma processing system when the door is in the closed position. In another embodiment, the conductive elastomeric member is attached to a bracing member (109) of the isolation valve and is brought into contact with a grounded component of the plasma processing system when the bracing member is deployed to hold the isolation valve door in place during substrate processing. Other configurations are also provided.
Abstract:
A TEOS trap for controlling TEOS polymerization from reaction furnace effluent in a vacuum pump line a SiO2 CVD process includes a molecular species-selective flow impeding medium that adsorbs and retains TEOS and water molecules from the effluent long enough to consume substantially all the water molecules in TEOS hydrolysis reactions while allowing non-hydrolyzed teos, ethylene, and other gaseous byproducts to pass through the trap and retaining solid and liquid phase SiO2-rich TEOS polymers formed by the hydrolysis reactions in the trap for subsequent removal and disposal. The molecular species-selective flow impeding medium has a plurality of absorption surfaces to make a surface density that performs the TEOS and water flow impeding function and solid and liquid phase TEOS polymer trapping function.