公开(公告)号：US09650471B2

公开(公告)日：2017-05-16

申请号：US14680181

申请日：2015-04-07

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Jeannette M. Garcia ,  James L. Hedrick ,  Rudy J. Wojtecki

IPC: C08G73/06 ,  H01B1/12 ,  C08J5/24 ,  D06M15/37 ,  H01B13/00 ,  H01L23/522

CPC classification number: C08G73/0644 ,  C08G12/06 ,  C08G73/0638 ,  C08J5/24 ,  C08J2379/04 ,  D06M15/37 ,  H01B1/128 ,  H01B13/0026 ,  H01L23/5226 ,  H05K1/0346 ,  H05K2201/0137

Abstract: Low dielectric constant (low-k) polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials with cyclic aliphatic ring structures are described. The materials are formed by a method that includes heating a mixture comprising amines and paraformaldehyde. The reaction mixtures may be used to form low-k PHT prepregs, composites and dielectrics used in integrated circuits.

公开(公告)号：US20160297931A1

公开(公告)日：2016-10-13

申请号：US14680181

申请日：2015-04-07

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Jeannette M. Garcia ,  James L. Hedrick ,  Rudy J. Wojtecki

IPC: C08G73/06 ,  C08J5/24 ,  D06M15/37 ,  H01B1/12

CPC classification number: C08G73/0644 ,  C08G12/06 ,  C08G73/0638 ,  C08J5/24 ,  C08J2379/04 ,  D06M15/37 ,  H01B1/128 ,  H01B13/0026 ,  H01L23/5226 ,  H05K1/0346 ,  H05K2201/0137

Abstract: Low dielectric constant (low-k) polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials with cyclic aliphatic ring structures are described. The materials are formed by a method that includes heating a mixture comprising amines and paraformaldehyde. The reaction mixtures may be used to form low-k PHT prepregs, composites and dielectrics used in integrated circuits.

公开(公告)号：US09258891B2

公开(公告)日：2016-02-09

申请号：US14128555

申请日：2013-03-19

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Masaaki Endo ,  Takamitsu Utsumi ,  Shoji Otani

IPC: B32B15/08 ,  H05K1/00 ,  H05K1/03 ,  C08J5/24

CPC classification number: H05K1/0366 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/285 ,  B32B27/32 ,  B32B2264/0257 ,  B32B2307/306 ,  B32B2307/538 ,  B32B2457/08 ,  C08J5/24 ,  C08J2371/12 ,  H05K1/0373 ,  H05K2201/0137 ,  H05K2201/0212 ,  Y10T428/24355

Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.

公开(公告)号：US09257386B2

公开(公告)日：2016-02-09

申请号：US14548784

申请日：2014-11-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiromu Arisaka ,  Noriyoshi Shimizu ,  Masato Tanaka ,  Tetsuya Koyama ,  Akio Rokugawa

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H01L21/00

CPC classification number: H01L23/49838 ,  H01L23/145 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/0137 ,  H05K2201/029 ,  H05K2201/0296 ,  H01L2924/00

Abstract: A wiring substrate includes first and second wiring structures. The first wiring structure includes a core substrate, first and second insulation layers each formed from a thermosetting insulative resin including a reinforcement material, and a via wire formed in the first insulation layer. The second wiring structure includes a wiring layer formed on upper surfaces of the first insulation layer and the via wire, an insulation layer formed on the upper surface of the first insulation layer, and an uppermost wiring layer including a pad used to electrically connect a semiconductor chip and the wiring layer. An outermost insulation layer stacked on a lower surface of the second insulation layer exposes a portion of a lowermost wiring layer stacked on the lower surface of the second insulation layer as an external connection pad. The second wiring structure has a higher wiring density than the first wiring structure.

Abstract translation: 布线基板包括第一和第二布线结构。 第一布线结构包括芯基板，由包括增强材料的热固性绝缘树脂形成的第一绝缘层和第二绝缘层，以及形成在第一绝缘层中的通孔布线。 第二布线结构包括形成在第一绝缘层和通孔导线的上表面上的布线层，形成在第一绝缘层的上表面上的绝缘层，以及包括用于将半导体 芯片和布线层。 堆叠在第二绝缘层的下表面上的最外绝缘层暴露作为外部连接焊盘堆叠在第二绝缘层的下表面上的最下布线层的一部分。 第二布线结构具有比第一布线结构更高的布线密度。

公开(公告)号：US09198283B2

公开(公告)日：2015-11-24

申请号：US14198658

申请日：2014-03-06

Applicant: Carolyn Rae Ellinger

Inventor： Carolyn Rae Ellinger

IPC: H05K1/16 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K1/0284 ,  C23C16/345 ,  C23C16/403 ,  C23C16/405 ,  C23C16/407 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/78642 ,  H01L29/78696 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2201/0137 ,  H05K2201/0326 ,  H05K2201/09045 ,  H01L2924/00

Abstract: A vertically separated electrode structure includes a polymeric material post on a substrate. An inorganic material cap covers the top of the post and extends beyond an edge of the post in at least a width dimension to define a first reentrant profile. A first electrode is located over the cap. A second electrode is located over the substrate and not over the post. The second electrode is adjacent to the edge of the post in the reentrant profile such that a distance between the first electrode and second electrode is greater than zero when measured orthogonally to the substrate surface. The first electrode and second electrode have the same material composition and layer thickness.

Abstract translation: 垂直分离的电极结构包括在基底上的聚合物材料柱。 无机材料盖覆盖柱的顶部并且在至少一个宽度尺寸上延伸超出柱的边缘以限定第一凹槽轮廓。 第一电极位于盖上。 第二电极位于衬底上并且不在柱上。 第二电极在折返轮廓中与柱的边缘相邻，使得当与衬底表面正交测量时，第一电极和第二电极之间的距离大于零。 第一电极和第二电极具有相同的材料组成和层厚度。

公开(公告)号：US20150237710A1

公开(公告)日：2015-08-20

申请号：US14701792

申请日：2015-05-01

Applicant: NGK Insulators, Ltd.

Inventor： Shinsuke YANO ,  Makoto TANI ,  Hirokazu NAKANISHI

IPC: H05K1/02 ,  H01L33/64 ,  H05K1/05 ,  H01L33/62

CPC classification number: H05K1/0207 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16245 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/053 ,  H05K2201/0137 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.

Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基底和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种通过实现低热阻作为整个基板的总热阻而可以显示出高散热能力而不降低基板的绝缘可靠性和高湿度可靠性的发光二极管的基板。

公开(公告)号：US20150179560A1

公开(公告)日：2015-06-25

申请号：US14548784

申请日：2014-11-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiromu Arisaka ,  Noriyoshi SHIMIZU ,  Masato TANAKA ,  Tetsuya KOYAMA ,  Akio ROKUGAWA

IPC: H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02 ,  H01L25/10 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/145 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/0137 ,  H05K2201/029 ,  H05K2201/0296 ,  H01L2924/00

Abstract: A wiring substrate includes first and second wiring structures. The first wiring structure includes a core substrate, first and second insulation layers each formed from a thermosetting insulative resin including a reinforcement material, and a via wire formed in the first insulation layer. The second wiring structure includes a wiring layer formed on upper surfaces of the first insulation layer and the via wire, an insulation layer formed on the upper surface of the first insulation layer, and an uppermost wiring layer including a pad used to electrically connect a semiconductor chip and the wiring layer. An outermost insulation layer stacked on a lower surface of the second insulation layer exposes a portion of a lowermost wiring layer stacked on the lower surface of the second insulation layer as an external connection pad. The second wiring structure has a higher wiring density than the first wiring structure.

Abstract translation: 布线基板包括第一和第二布线结构。 第一布线结构包括芯基板，由包括增强材料的热固性绝缘树脂形成的第一绝缘层和第二绝缘层，以及形成在第一绝缘层中的通孔布线。 第二布线结构包括形成在第一绝缘层和通孔导线的上表面上的布线层，形成在第一绝缘层的上表面上的绝缘层，以及包括用于将半导体 芯片和布线层。 堆叠在第二绝缘层的下表面上的最外绝缘层暴露作为外部连接焊盘堆叠在第二绝缘层的下表面上的最下布线层的一部分。 第二布线结构具有比第一布线结构更高的布线密度。

公开(公告)号：US20150038033A1

公开(公告)日：2015-02-05

申请号：US14486775

申请日：2014-09-15

Applicant: Sinovia Technologies

Inventor： Whitney GAYNOR ,  George Burkhard

IPC: H01B13/00

CPC classification number: G06F3/041 ,  B05D3/007 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  G03F1/24 ,  G03F7/0002 ,  G03F7/0047 ,  G03F7/038 ,  G03F7/0388 ,  G03F7/161 ,  G06F3/044 ,  G06F2203/04103 ,  H01B1/22 ,  H01B5/14 ,  H01B13/0013 ,  H01L51/444 ,  H01L51/5203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/036 ,  H05K1/09 ,  H05K3/103 ,  H05K2201/0108 ,  H05K2201/0137 ,  H05K2203/10 ,  Y10T428/24355 ,  Y10T442/188 ,  Y10T442/191

Abstract: A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of nanowires of an inorganic material. The nanowires are, in isolated form, characterized by a first conductivity stability temperature. Further, the plurality of nanowires is embedded within at least a region of the layer of cross-linked polymer, where the region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film having a second conductivity stability temperature that is greater than the first conductivity stability temperature.

Abstract translation: 提供一种复合导电膜，其包括具有表面的交联聚合物层和包含多个无机材料的纳米线的无机网。 纳米线是分离形式的，其特征在于第一导电稳定温度。 此外，多个纳米线嵌入在交联聚合物层的至少一个区域中，其中该区域是从交联聚合物层的表面连续的。 布置交联聚合物层和无机网以形成具有大于第一导电稳定温度的第二导电稳定温度的复合导电膜。

公开(公告)号：US20240260190A1

公开(公告)日：2024-08-01

申请号：US18290322

申请日：2022-04-28

Applicant: ELECTROLUX APPLIANCES AKTIEBOLAG

Inventor： Alex VIROLI ,  Massimo NOSTRO ,  Adriano SCOTTO D'APOLLONIA ,  Massimo ZANGOLI ,  Emanuel URGESE ,  Elia SCHIARATURA ,  Alan MENGOZZI

IPC: H05K1/14 ,  H05B6/12 ,  H05K3/34

CPC classification number: H05K1/141 ,  H05B6/12 ,  H05K3/34 ,  H05K2201/0137 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/049

Abstract: Induction cooking hob comprising at least one first board element (18) and at least one second board element (16), wherein the first board element (18) and at least one second board element (16) each comprise at least one or more electrical and/or electronical component(s), wherein the first board element (18) is electrically coupled to the second board element (16) and wherein the first board element (18) is directly mechanically coupled to the second board element (16.

公开(公告)号：US20230413427A1

公开(公告)日：2023-12-21

申请号：US18458457

申请日：2023-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongki JEONG ,  Jingook KIM ,  Chijoon KIM ,  Seungwhee CHOI

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H05K5/00 ,  G06F1/16

CPC classification number: H05K1/028 ,  H05K1/181 ,  H05K3/4038 ,  H05K5/0026 ,  G06F1/1652 ,  H05K2201/05 ,  H05K2201/10128 ,  H05K2203/1147 ,  H05K2201/0137

Abstract: An electronic device is provided. The electronic device includes a hinge, a first housing having at least a portion coupled to a first side of the hinge and including a first substrate assembly, a second housing having at least a portion coupled to a second side of the hinge, including a second substrate assembly, and configured to be foldable and unfoldable, a flexible display supported on the first and second housing and configured to be foldable and unfoldable, an FPCB electrically connecting the first and second substrate assembly, a through hole formed in the first housing forming a path through which the at least one FPCB passes, a first sealing member disposed so as to compress a first side surface of the at least one FPCB disposed in the through hole, and a second sealing member presses the second side surface of the FPCB disposed in the through hole.