SINGLE MOTOR DYNAMIC CALIBRATION UNIT
    71.
    发明申请
    SINGLE MOTOR DYNAMIC CALIBRATION UNIT 有权
    单电机动态校准单元

    公开(公告)号:US20140245810A1

    公开(公告)日:2014-09-04

    申请号:US13783606

    申请日:2013-03-04

    Applicant: Kionix, Inc.

    CPC classification number: B81C99/005

    Abstract: A calibration unit, system, and method for calibrating a device under test are provided. The calibration unit, system, and method use a single axis rotational unit to calibrate devices under test on a test head. The single axis rotation unit is configured to extend at an angle from a known axis. The test head can be designed in the shape of a frustum with multiple sides. The calibration unit, system, and method can use combinations of gravitational excitation, Helmholtz coil excitation, and rotational rate excitation for calibrating the device under test. The calibration unit, system, and method can calibrate a 3 degree for freedom or higher MEMS devices.

    Abstract translation: 提供了用于校准被测器件的校准单元,系统和方法。 校准单元,系统和方法使用单轴旋转单元在测试头上校准被测器件。 单轴旋转单元构造成从已知轴线以一定角度延伸。 测试头可以设计成具有多边的截头锥体的形状。 校准单元,系统和方法可以使用重力激励,亥姆霍兹线圈激励和旋转速率激励的组合来校准被测器件。 校准单元,系统和方法可以自由地校准3度或更高的MEMS器件。

    Method for fabricating ESI device using smile and delayed LOCOS techniques
    72.
    发明申请
    Method for fabricating ESI device using smile and delayed LOCOS techniques 有权
    使用微笑和延迟LOCOS技术制造ESI器件的方法

    公开(公告)号:US20040082088A1

    公开(公告)日:2004-04-29

    申请号:US10692457

    申请日:2003-10-23

    Applicant: Kionix, Inc.

    CPC classification number: B05B5/00 H01J49/0018 H01J49/167 Y10S438/942

    Abstract: Three fundamental and three derived aspects of the present invention are disclosed. The three fundamental aspects each disclose a process sequence that may be integrated in a full process. The first aspect, designated as nulllatent maskingnull, defines a mask in a persistent material like silicon oxide that is held abeyant after definition while intervening processing operations are performed. The latent oxide pattern is then used to mask an etch. The second aspect, designated as nullsimultaneous multi-level etching (SMILE)null, provides a process sequence wherein a first pattern may be given an advanced start relative to a second pattern in etching into an underlying material, such that the first pattern may be etched deeper, shallower, or to the same depth as the second pattern. The third aspect, designated as nulldelayed LOCOSnull, provides a means of defining a contact hole pattern at one stage of a process, then using the defined pattern at a later stage to open the contact holes. The fourth aspect provides a process sequence that incorporates all three fundamental aspects to fabricate an integrated liquid chromatography (LC)/electrrospray ionization (ESI) device. The fifth aspect provides a process sequence that incorporates two of the fundamental aspects to fabricate an ESI device. The sixth aspect provides a process sequence that incorporates two of the fundamental aspects to fabricate an LC device. The process improvements described provide increased manufacturing yield and design latitude in comparison to previously disclosed methods of fabrication.

    Abstract translation: 公开了本发明的三个基本和三个派生方面。 三个基本方面各自公开了可以整合到完整过程中的过程序列。 第一方面,被指定为“潜屏蔽”,定义了在固定材料(例如氧化硅)中的掩模,该掩模在定义之后被保持为静止,而执行中间处理操作。 然后将潜在氧化物图案用于掩模蚀刻。 指定为“同时多级蚀刻(SMILE)”的第二方面提供了一种处理顺序,其中在蚀刻到下面的材料中第一图案可相对于第二图案被赋予高级开始,使得第一图案可以是 蚀刻成更深,更浅或与第二图案相同的深度。 指定为“延迟LOCOS”的第三方面提供了在过程的一个阶段定义接触孔图案的方法,然后在稍后阶段使用限定的图案来打开接触孔。 第四方面提供了一个整合液相色谱(LC)/电喷雾离子化(ESI)装置的所有三个基本方面的过程序列。 第五方面提供了一种结合两个基本方面来制造ESI装置的过程序列。 第六方面提供了一种结合两个基本方面来制造LC器件的过程序列。 与先前公开的制造方法相比,所描述的工艺改进提供了增加的制造产量和设计自由度。

    Methods of fabricating microelectromechanical and microfluidic devices

    公开(公告)号:US20020084249A1

    公开(公告)日:2002-07-04

    申请号:US10003672

    申请日:2001-11-02

    Applicant: Kionix, Inc.

    CPC classification number: B05B5/00 H01J49/0018 H01J49/167 Y10S438/942

    Abstract: Three fundamental and three derived aspects of the present invention are disclosed. The three fundamental aspects each disclose a process sequence that may be integrated in a full process. The first aspect, designated as nulllatent maskingnull, defines a mask in a persistent material like silicon oxide that is held abeyant after definition while intervening processing operations are performed. The latent oxide pattern is then used to mask an etch. The second aspect, designated as nullsimultaneous multi-level etching (SMILE)null, provides a process sequence wherein a first pattern may be given an advanced start relative to a second pattern in etching into an underlying material, such that the first pattern may be etched deeper, shallower, or to the same depth as the second pattern. The third aspect, designated as nulldelayed LOCOSnull, provides a means of defining a contact hole pattern at one stage of a process, then using the defined pattern at a later stage to open the contact holes. The fourth aspect provides a process sequence that incorporates all three fundamental aspects to fabricate an integrated liquid chromatography (LC)/electrospray ionization (ESI) device. The fifth aspect provides a process sequence that incorporates two of the fundamental aspects to fabricate an ESI device. The sixth aspect provides a process sequence that incorporates two of the fundamental aspects to fabricate an LC device. The process improvements described provide increased manufacturing yield and design latitude in comparison to previously disclosed methods of fabrication.

    Accelerometer apparatuses and systems for noise rejection

    公开(公告)号:US11885647B2

    公开(公告)日:2024-01-30

    申请号:US17591086

    申请日:2022-02-02

    Applicant: Kionix, Inc.

    Inventor: Jonah Dewall

    CPC classification number: G01D18/00 G01R29/26 H03F3/45475 H03H11/126

    Abstract: A sensor apparatus includes a resonator, a transducer, a damping resistor, a first switch, a filter stage, a second switch, and a noise rejection stage. The transducer is configured to detect a position of the resonator. The damping resistor is configured to electrostatically actuate the transducer and convert a thermomechanical noise of the resonator to an electromechanical noise. The first switch is configured to receive a first signal from the transducer. The filter stage is configured to receive the first signal and adjust a phase and a gain of the first signal and output a filtered first signal. The second switch is configured to receive a second signal from the transducer. The noise rejection stage is configured to receive the filtered first signal and the second signal and reduce the filtered first signal from an output signal.

    Accelerometer having a root-mean-square (RMS) output

    公开(公告)号:US11693020B2

    公开(公告)日:2023-07-04

    申请号:US16669111

    申请日:2019-10-30

    CPC classification number: G01P15/0802 B81B3/0021 B81B2201/0235

    Abstract: Accelerometers are described herein that have RMS outputs. For instance, an example accelerometer may include a MEMS device and an ASIC. The MEMS device includes a structure having an attribute that changes in response to acceleration of an object. The ASIC determines acceleration of the object based at least in part on changes in the attribute. The ASIC includes analog circuitry, an ADC, and firmware. The analog circuitry measures the changes in the attribute and generates analog signals that represent the changes. The ADC converts the analog signals to digital signals. The firmware includes RMS firmware. The RMS firmware performs an RMS calculation on a representation of the digital signals to provide an RMS value that represents an amount of the acceleration of the object.

    Composite spring for robust piezoelectric sensing

    公开(公告)号:US11634317B2

    公开(公告)日:2023-04-25

    申请号:US16392224

    申请日:2019-04-23

    Applicant: Kionix, Inc.

    Abstract: A micro-electromechanical system (MEMS) device comprises a fixed portion and a proofmass suspended by at least one composite beam. The composite beam is cantilevered relative to the fixed portion and extends between a first end that is integrally formed with the fixed portion and a second distal end. The composite beam comprises an insulator having a top surface and at least two side surfaces; a conductor extending away from the fixed portion and surrounding at least a portion of the insulator; and a second conductor positioned adjacent to the top surface of the conductor and extending parallel with the insulator away from the fixed portion. The second conductor is separated from the first conductor to provide a low parasitic conductance of the composite beam.

    ACCELEROMETER APPARATUSES AND SYSTEMS

    公开(公告)号:US20220252636A1

    公开(公告)日:2022-08-11

    申请号:US17591092

    申请日:2022-02-02

    Applicant: Kionix, Inc.

    Abstract: A sensor having a proximal end and a distal end includes an anchor, a proof mass, a fixed finger, and a movable finger. The anchor is disposed at the proximal end. The proof mass is coupled to the anchor and disposed at a first distance from the anchor. The fixed finger and the movable finger are coupled to the anchor and disposed at a second distance from the anchor at the distal end. The fixed and movable fingers are configured to measure a first capacitance area. A ratio of the first distance over the second distance is between about 0.2 to about 0.6. The ratio is configured to deflect the movable finger at least about 1 μm relative to the fixed finger.

    MECHANICALLY-SENSITIVE SEMICONDUCTING TRIODE CAPACITOR

    公开(公告)号:US20220252635A1

    公开(公告)日:2022-08-11

    申请号:US17591077

    申请日:2022-02-02

    Applicant: Kionix, Inc.

    Inventor: Jonah DEWALL

    Abstract: A sensor apparatus includes a base, a tap, a channel, and a gate. The tap is adjacent the base and electrically coupled to the base. The channel is between the tap and the base. The gate is adjacent the channel and electrically coupled to the channel. The gate is separated from the channel by a gap. At least a portion of a charge flow in the channel is substantially parallel or antiparallel to an electric field between the gate and the channel. A triode capacitor system includes a channel region, a gate region, and a processor. The gate region is separated from the channel region by a gap. The processor is coupled to a base contact, a tap contact, and a gate contact and configured to measure a distance of the gap based on a potential difference between the base contact and the tap contact.

    Eutectic bonding with ALGe
    80.
    发明授权

    公开(公告)号:US10766767B2

    公开(公告)日:2020-09-08

    申请号:US16407045

    申请日:2019-05-08

    Applicant: Kionix, Inc.

    Abstract: A MEMS device formed in a first semiconductor substrate is sealed using a second semiconductor substrate. To achieve this, an Aluminum Germanium structure is formed above the first substrate, and a polysilicon layer is formed above the second substrate. The first substrate is covered with the second substrate so as to cause the polysilicon layer to contact the Aluminum Germanium structure. Thereafter, eutectic bonding is performed between the first and second substrates so as to cause the Aluminum Germanium structure to melt and form an AlGeSi sealant thereby to seal the MEMS device. Optionally, the Germanium Aluminum structure includes, in part, a layer of Germanium overlaying a layer of Aluminum.

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