Abstract:
A process for forming a microtip cathode structure on a field emission display panel avoids the need of vacuum depositing a lift-off layer for the microtip deposition overstructure in specially equipped reactors to accomplish a deposition at a grazing angle, by co-patterning the lift-off layer together with an underlying metal grid layer by a succession of different etching steps through the openings of a grid definition mask. According to an embodiment, nickel is used as lift-off material and is either wet-etched or sputter-etched before performing a plasma etch of the underlying grid metal layer. According to an alternative embodiment the masking resist layer is used as lift-off material.
Abstract:
A negative charge pump circuit comprises: a plurality of charge pump stages (S1-S6), each charge pump stage (S1-S6) having an input node (I1-I6) and an output node (O1-O6) and comprising a pass transistor (P11-P16) and a first couplig capacitor (C21-C26), the pass transistor (P11-P16) having a first terminal connected to the input node (I1-I6), a second terminal connected to the output node (O1-O6) and a control terminal connected to an internal node (1-6) of the charge pump stage (S1-S6), said first coupling capacitor (C21-C26) having a first plate connected to said output node (O1-O6) and a second plate connected to a respective clock signal (A,B,C,D); negative voltage regulation means (7) for regulating a negative output voltage (V(O)) on an output node (O) of the negative charge pump circuit to provide a fixed negative voltage value. The negative charge pump circuit comprises at least one negative voltage limiting means (P7) electrically coupling said output node (O) of the negative charge pump circuit with the internal node (6) of the last charge pump stage (S6) of the negative charge pump circuit to limit the negative voltage on said internal node (6) and on the output node (O6) of said last charge pump stage (S6).
Abstract:
A sensor of instantaneous power dissipable through a power transistor (Pwr) of the MOS type connected between the output terminal (OUT) of a power stage and ground (GND). It comprises a MOS transistor (Q5) having its gate terminal connected to that of the power transistor, source terminal connected to ground, and drain terminal connected to a circuit node (N) which is coupled to the output terminal (OUT) by means of a current mirror circuit (D1,Q2) which includes a resistive element (R) in its input leg. Connected to the circuit node is the base terminal of a bipolar transistor (Q4) which is respectively connected, through a diode (D3) and a constant current generator (Iref) between the output terminal and ground.
Abstract:
The invention relates to a high-capacitance capacitor (1) which is monolithically integratable on a semiconductor substrate (3) doped with a first type (P) of dopant and accomodating a diffusion well (4) which is doped with a second type (N) of dopant and has a first active region (5) formed therein. A layer (6) of gate oxide is deposited over the diffusion well (4) which is covered with a first layer (POLY1) of polycrystalline silicon and separated from a second layer (POLY2) of polycrystalline silicon by an interpoly dielectric layer (7). Advantageously, the high-capacitance capacitor (1) of the invention comprises a first capacitor element (C1) having the first (POLY1) and second (POLY2) layers of polycrystalline silicon as its conductive plates, and the interpoly dielectric layer (7) as the isolation dielectric, and a second capacitor element (C2) having the first layer (POLY1) of polycrystalline silicon and the diffusion well (4) as its conductive plates and the gate oxide layer (6) as the isolation dielectric.
Abstract:
A MOS technology power device comprises: a semiconductor material layer (2) of a first conductivity type; a conductive insulated gate layer (7,8,9) covering the semiconductor material layer (2); a plurality of elementary functional units, each elementary functional unit comprising a body region (3) of a second conductivity type formed in the semiconductor material layer (2), the body region (3) having the form of an elongated body stripe, each elementary functional unit further comprising an elongated window (12) in the insulated gate layer (7,8,9) extending above the elongated body stripe (3). Each body stripe (3) includes at least one source portion (60;61;62) doped with dopants of the first conductivity type, intercalated with a body portion (40;41;3') of the body stripe (3) wherein no dopant of the first conductivity type are provided. The conductive insulated gate layer (7,8,9) comprises a first insulating material layer (7) placed above the semiconductor material layer (2), a conductive material layer (8) placed above the first insulating material layer (7), and a second insulating material layer (9) placed above the conductive material layer (8). Insulating material sidewall spacers (13) are provided to seal edges of the elongated window (12) in the insulated gate layer (7,8,9).
Abstract:
A low-consumption and high-density D flip-flop circuit implementation, particularly for standard cell libraries, which comprises a master section (100) and a slave section (200); the master section comprises a master latch structure (5) and the slave section comprises a slave latch structure (6); the master structure (100) and the slave structure (100) are interposed between a power supply line (V DD ) and a ground line (7), and each structure is constituted by a first pair of transistors (8, 9; 12, 13) and by a second pair of transistors (10, 11; 14, 15). The particularity of the invention is that in the master latch structure (5) the transistors (8, 9) the source terminals whereof are connected to the power supply line (V DD ) and constitute a first one of the two pairs of transistors (8, 9; 10, 11) are P-channel MOS transistors, the source terminals of the second pair of transistors (10, 11) of the master latch structure (5) are connected to the respective drain terminals of an additional pair of transistors (24, 25), the source terminals whereof are connected to the ground line (7); same-phase clock signals (CK) are fed both to the master section (100) and to the slave section (200).
Abstract:
A neural network (1) including a number of synaptic weighting elements (15, 17), and a neuron stage (5); each of the synaptic weighting elements (15, 17) having a respective synaptic input connection (11, 13) supplied with a respective input signal (x 1 , ..., x n ); and the neuron stage (5) having inputs (36, 37) connected to the synaptic weighting elements, and being connected to an output (39) of the neural network (1) supplying a digital output signal (O). The synaptic weighting elements (15, 17) are formed by memory cells programmable to different threshold voltage levels, so that each presents a respective programmable conductance; and the neuron stage (5) provides for measuring conductance (33-35, 43-45) on the basis of the current through the memory cells, and for generating a binary output signal on the basis of the total conductance of the synaptic elements.
Abstract:
The circuit described comprises a double half-wave rectifier (DHWR) connected to the outputs of the differential amplifier (VGA) in order to produce two quantities dependent on the amplitudes of the half-waves of the output signal of the amplifier (VGA), two comparators (COMP1, COMP2) each having an input (IN+1, IN+2) connected to an output (OUT1, OUT2) of the rectifier (DHWR) and a reference input (IN-1, IN-2) in order to produce respective output signals when the amplitudes of the respective half-waves are greater than the levels applied to the reference inputs (IN-1, IN-2), and processing means (Str1, A1, R1, Str2, A2, R2, C) for generating a signal for regulating the gain of the amplifier in dependence on the durations of the output signals of the two comparators. The circuit may advantageously be used when the signal to be amplified (v+, v-) is not symmetrical.