Abstract:
PURPOSE: A heat dissipative liquid crystal polymer composite gas separation membrane having selective permeability of high performance using morphological adjustment is provided, which has a merit of high permeability and is manufactured only in an extruder thus eliminating solution casting, solution recovery and treatment and can be produced in a mass production method. The membrane can be applied to all heat dissipating liquid crystal polymer and thermo plastic resin, so that can be used for separating gases having different permeability from mixed gas. CONSTITUTION: The separation membrane is prepared by melting 50-99 wt.% of thermo plastic resin, 1-50 wt.% of heat dissipative liquid crystal polymer that is 5-25 wt.% in concentration and normal diffluence agent of 0.1-10 wt.% of heat dissipative liquid crystal polymer and by processing.
Abstract:
PURPOSE: Provided is poly aliphatic aromatic silsesquioxane, which is soluble in organic solvents and excellent in heat-resistance, combustion-resistance, and flexibility and can be used as a heatproof coating agent, an optical fiber protection coating agent, an adhesive, a release paper, a protection film of semiconductor, resist material, etc. CONSTITUTION: The high regular poly aliphatic aromatic silsesquioxane (formula 1) is produced by condensing 1,3-organodisiloxane (formula 2) solution in an organic solvent at a temperature of 50-350deg.C in the presence of a catalyst selected from the consisting of an alkali metal hydroxide, an amine, a quaternary ammonium salt, and a fluoride. In the formula, one of R1 and R2 is unsubstituted or substituted monovalent aliphatic hydrocarbon and the other is unsubstituted or substituted monovalent aromatic hydrocarbon, X is H, Cl, OH, NH2, or COOH, R is H, alkyl, acetate, or an alkali metal.
Abstract:
PURPOSE: Provided are a polyimide sol-gel precursor, a void sol-gel monomer and a void organic-inorganic insulating low-dielectric substance prepared therefrom, which has high mechanic strength and lowered dielectric constant. CONSTITUTION: The polyimide sol-gel precursor having a triethoxysilane for a sol-gel process at a branch of polyimide is represented by the following formula (1). The polyimide sol-gel precursor having a triethoxysilane for a sol-gel process at a branch of adamantyl polyimide is represented by the following chemical formula (2) or (3). In the formulae (1), (2) and (3), X is a triethoxysilane containing an aromatic compound for a sol-gel process. The void sol-gel monomer is selected from compounds described as the formulae (5), (6), (7) and (8) in a description. The void organic-inorganic insulating low-dielectric substance is prepared by easily covalent bond with the void sol-gel monomer and is represented by the following formula (4).