Abstract:
The present invention provides an oscillator and a method of manufacturing the same. The oscillator includes a first electrode, an insulating layer which is arranged on the first electrode and includes a through hole, and an antenna pattern which is arranged on the insulating layer and is made of a conductive material which covers the upper surface of the through hole. The through hole is filled with a gas. The charge particles of the gas vibrate by a DC voltage applied between the first electrode and the antenna pattern.
Abstract:
PURPOSE: A coupled plasma generator with capacity and a substrate processing apparatus are provided to uniformly process a large area semiconductor substrate. CONSTITUTION: A first electrode (112) is configured to a circular shape and receives a first RF power of a first frequency in the center of one surface. A second electrode (114) is configured in a washer shape, receives a second RF power of a second frequency from a plurality of locations in the circumference of a circle having a specific radius in the center of one surface and arranges around the first electrode. An insulation spacer (116) is configured in a washer shape and is arranged between the first electrode and second electrode. A first RF power supply (122) supplies power to the first electrode. A second RF power supply (132) supplies power to the second electrode. A first RF power supply unit (170) is configured to a coaxial cable structure and supplies power to the first electrode. A second power distribution unit distributes the second RF power to a plurality of locations of the second electrode.
Abstract:
PURPOSE: A plasma generation apparatus is provided to form uniform helicon or inductively coupled plasma. CONSTITUTION: A plasma generation apparatus(100) includes a plurality of dielectric tubes(112a-112f,122) respectively installed in a plurality of penetration holes(111a-111f,121) formed in a vacuum container, antennae respectively mounted on the outer side of the dielectric tubes after being classified into a first group and a second group according to symmetry of being installed in the vacuum container, a first RF power supply(162) supplying power to antennae of the first group, a second RF power supply(164) supplying power to antennae of the second group and a first power distribution unit(122) distributing the power of the first RF power supply to the antennae of the first group while being arranged between the antennae of the first group and the first RF power supply.
Abstract:
PURPOSE: A plasma device and a substrate processing device are provided to uniformly form helicon plasma. CONSTITUTION: Antennas are classified into a first group(116) and a second group(216) according to symmetry in a vacuum bottle. A first RF(Radio Frequency) power source(162) supplies power to an antenna of the first group. A second RF power source(164) supplies power to an antenna of the second group. A first power distribution unit(122) is arranged between the antenna of the first group and the first RF power source. The first power distribution unit distributes the power of the first RF power source to the antenna of the first group.
Abstract:
PURPOSE: A capacitive coupled plasma generator is provided to prevent the degradation of the degree of uniformity by including holes which induce halo cathode discharge in a first electrode and to offer stable capacitive coupled plasma. CONSTITUTION: A first electrode(122) is connected to an RF(Radio Frequency) power source(142). The first electrode comprises a halo cathode domain. The halo cathode domain is divided into a plurality of sub halo cathode domains. The sub halo cathode domain has the form of a different hole. A second electrode(132) is arranged to be faced with the first electrode. Holes of the sub halo cathode domains are connected each other by a trench. The plasma intensity distribution of the sub halo cathode domains is controlled by the duty ratio of a pulse of the RF power source.
Abstract:
본 발명은 유체 분배 장치 및 유체 분배 방법을 제공한다. 이 방법은 예비 단위 영역들을 포함하는 예비 유체 분배부를 이용하여 기판의 최적 공정 위치를 선택하고, 및 기판의 최적 공정 위치에 대응하는 예비 유체 분배부의 구조를 전사하여 유체 분배부를 제공하는 것을 포함한다. 예비 단위 영역들 각각은 위치에 따라 서로 다른 유량을 공급하는 스플릿 영역들을 포함한다. 샤워 헤드, 유체 분배 장치, 분리 결합성, 국부적 유량 조절
Abstract:
PURPOSE: A fluid distributing apparatus and a fluid distributing method are provided to uniformly process a substrate at high speed by reducing pressure difference between a peripheral part and a center of a large substrate. CONSTITUTION: The optimal process position of a substrate is selected by using a preliminary fluid distributing unit(S100). A fluid distributing unit is provided by transferring the structure of the preliminary fluid distributing unit corresponding to the optimal process position of the substrate(S210). Preliminary unit areas include split areas to supply a different flow rate according to each position. The substrate is tested(S220). The process uniformity is checked in a preset range of the substrate(S230). The flow rate of the fluid distributing unit corresponding to the area which does not satisfy the process uniformity is controlled(S240). The substrate is processed by using the fluid distributing unit(S250).
Abstract:
PURPOSE: A plasma generating device and a substrate processing device are provided to increase a hollow cathode effect and an electron emitting effect by a hollow cathode and a needle arranged in an inner groove of the hollow cathode, thereby providing plasma of high density. CONSTITUTION: A substrate support member(130) is arranged in a processing chamber to support a substrate(W). A plurality of inner grooves from which plasma is generated is formed on one side of a hollow cathode(140). A plurality of needles(150) is fixed to the inner grooves. A power supply source(162) is electrically connected to the hollow cathode. An insertion hole penetrates the needles and the hollow cathode.
Abstract:
PURPOSE: A substrate processing device, a substrate processing method, a preliminary electrode structure, a measuring electrode structure, and a process electrode structure are provided to quickly obtain an optimal process condition by using a hollow cathode discharge electrode. CONSTITUTION: The shape of a hole is selected by checking at least one of plasma characteristic and process result according to the shape of the hole(S100). An optimal process position is selected by processing the substrate using a measuring electrode structure with the density of a hole according to a position(S200). A process electrode structure is provided by transferring the density of the hole of the measuring electrode structure corresponding to the optimal process position(S300). The process non-uniformity is compensated by using the process electrode structure(S400).