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公开(公告)号:AU2018290989A1
公开(公告)日:2019-12-19
申请号:AU2018290989
申请日:2018-06-29
Applicant: BUTTERFLY NETWORK INC
Inventor: CHEN KAILIANG , WEST LAWRENCE C , ZAHORIAN JAIME SCOTT , SANCHEZ NEVADA J , RALSTON TYLER S
Abstract: Ultrasound devices configured to perform high-intensity focused ultrasound (HIFU) are described. An ultrasound device may include HIFU units configured to emit high acoustic intensities. Multiple ultrasound devices may be disposed on a substrate, which may be configured to be flexed so that the direction of emission of the ultrasound devices can be mechanically controlled. Additionally, or alternatively, the ultrasound beams produced by different ultrasound devices may be electronically oriented by adjusting the phases of the signals with which each element of a device is driven. For example, multiple phased arrays of ultrasound devices may be used to concentrate ultrasound energy into a desired location. In some embodiments, the time at which different ultrasound signals are emitted may be controlled, for example to ensure that the combined signal has at least a desired intensity.
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公开(公告)号:AU2018289357A1
公开(公告)日:2019-12-19
申请号:AU2018289357
申请日:2018-06-19
Applicant: BUTTERFLY NETWORK INC
Inventor: SINGH AMANDEEP , CHEN KAILIANG , RALSTON TYLER S
Abstract: An ultrasound circuit comprising a single-ended trans-impedance amplifier (TIA) is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.
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公开(公告)号:CA3081760A1
公开(公告)日:2019-05-23
申请号:CA3081760
申请日:2018-11-15
Applicant: BUTTERFLY NETWORK INC
Inventor: CHEN KAILIANG , SANCHEZ NEVADA J , ALIE SUSAN A , RALSTON TYLER S , ROTHBERG JONATHAN M , FIFE KEITH G , LUTSKY JOSEPH
IPC: A61B8/00 , H01L21/98 , H01L23/535
Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application- specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
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公开(公告)号:CA3064616A1
公开(公告)日:2019-01-03
申请号:CA3064616
申请日:2018-06-29
Applicant: BUTTERFLY NETWORK INC
Inventor: CHEN KAILIANG , WEST LAWRENCE C , ZAHORIAN JAIME SCOTT , SANCHEZ NEVADA J , RALSTON TYLER S
Abstract: Ultrasound devices configured to perform high-intensity focused ultrasound (HIFU) are described. An ultrasound device may include HIFU units configured to emit high acoustic intensities. Multiple ultrasound devices may be disposed on a substrate, which may be configured to be flexed so that the direction of emission of the ultrasound devices can be mechanically controlled. Additionally, or alternatively, the ultrasound beams produced by different ultrasound devices may be electronically oriented by adjusting the phases of the signals with which each element of a device is driven. For example, multiple phased arrays of ultrasound devices may be used to concentrate ultrasound energy into a desired location. In some embodiments, the time at which different ultrasound signals are emitted may be controlled, for example to ensure that the combined signal has at least a desired intensity.
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公开(公告)号:CA3064584A1
公开(公告)日:2018-12-27
申请号:CA3064584
申请日:2018-06-19
Applicant: BUTTERFLY NETWORK INC
Inventor: SINGH AMANDEEP , CHEN KAILIANG , RALSTON TYLER S
Abstract: An ultrasound circuit comprising a single-ended trans-impedance amplifier (TIA) is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.
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公开(公告)号:CA3052673A1
公开(公告)日:2018-09-13
申请号:CA3052673
申请日:2018-03-07
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , ALIE SUSAN A , FIFE KEITH G , SANCHEZ NEVADA J , RALSTON TYLER S , ZAHORIAN JAIME SCOTT
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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77.
公开(公告)号:AU2018203942A1
公开(公告)日:2018-06-21
申请号:AU2018203942
申请日:2018-06-04
Applicant: BUTTERFLY NETWORK INC
Inventor: RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J , ROTHBERG JONATHAN M , FIFE KEITH G
Abstract: An apparatus, comprising: a semiconductor wafer having a complementary metal oxide semiconductor (CMOS) integrated circuit and an electrode; a conductive membrane bonded to the semiconductor wafer to form a bonded structure such that a sealed cavity exists between an uppermost portion of the semiconductor wafer and a first side of the conductive membrane, thereby defining, at least in part, an ultrasonic transducer, with the sealed cavity disposed between the conductive membrane and the electrode; and the uppermost portion of the semiconductor wafer providing an electrical connection between the CMOS integrated circuit and the first side of the conductive membrane. 136 144 1310 128 '' 1'' -'' D18 138 142 . .. . .. . .. S. .'.6.4. . W ... l' . . . . . . . . . . . . . . \ . . . . . . . . . . . . . . 2602 118 2602 104.102 2602 18 242 FIG. 2610 12
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78.
公开(公告)号:AU2016364819A1
公开(公告)日:2018-06-14
申请号:AU2016364819
申请日:2016-12-01
Applicant: BUTTERFLY NETWORK INC
Inventor: CHEN KAILIANG , RALSTON TYLER S
Abstract: An ultrasound device including an asynchronous successive approximation analog-to- digital converter and method are provided. The device includes at least one ultrasonic transducer, a plurality of asynchronous successive-approximation-register (SAR) analog-to- digital converters (ADC) coupled to the at least one ultrasonic transducer, at least one asynchronous SAR in the plurality having a sample and hold stage, a digital-to-analog converter (DAC), a comparator, and control circuitry, wherein a DAC update event following at least one bit conversion is synchronized to a corresponding DAC update event of at least one other ADC in the plurality of ADCs.
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公开(公告)号:AU2014223521B2
公开(公告)日:2018-04-19
申请号:AU2014223521
申请日:2014-02-26
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J , MAGARY ALEXANDER
Abstract: Ultrasound imaging devices and heads up displays, as well and systems utilizing both are described. In some embodiments, ultrasound data or images may be displayed on a heads up display, which may be a head-mounted display. One or more users may manipulate the images. Image capture devices and sensors may also be implemented.
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公开(公告)号:AU2015328143B2
公开(公告)日:2017-11-23
申请号:AU2015328143
申请日:2015-10-07
Applicant: BUTTERFLY NETWORK INC
Inventor: RALSTON TYLER S , CASPER ANDREW J , SANCHEZ NEVADA J
IPC: A61B8/00
Abstract: Programmable ultrasound probes and methods of operation are described. The ultrasound probe may include memory storing parameter data and may also include a parameter loader which loads the parameter data into programmable circuitry of the ultrasound probe. In some instances, the ultrasound probe may include circuitry grouped into modules which may be repeatable and which may be coupled together to allow data to be exchanged between the modules.
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