Steerable high-intensity focused ultrasound (HIFU) elements

    公开(公告)号:AU2018290989A1

    公开(公告)日:2019-12-19

    申请号:AU2018290989

    申请日:2018-06-29

    Abstract: Ultrasound devices configured to perform high-intensity focused ultrasound (HIFU) are described. An ultrasound device may include HIFU units configured to emit high acoustic intensities. Multiple ultrasound devices may be disposed on a substrate, which may be configured to be flexed so that the direction of emission of the ultrasound devices can be mechanically controlled. Additionally, or alternatively, the ultrasound beams produced by different ultrasound devices may be electronically oriented by adjusting the phases of the signals with which each element of a device is driven. For example, multiple phased arrays of ultrasound devices may be used to concentrate ultrasound energy into a desired location. In some embodiments, the time at which different ultrasound signals are emitted may be controlled, for example to ensure that the combined signal has at least a desired intensity.

    ULTRASOUND APPARATUSES AND METHODS FOR FABRICATING ULTRASOUND DEVICES

    公开(公告)号:CA3081760A1

    公开(公告)日:2019-05-23

    申请号:CA3081760

    申请日:2018-11-15

    Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application- specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

    STEERABLE HIGH-INTENSITY FOCUSED ULTRASOUND (HIFU) ELEMENTS

    公开(公告)号:CA3064616A1

    公开(公告)日:2019-01-03

    申请号:CA3064616

    申请日:2018-06-29

    Abstract: Ultrasound devices configured to perform high-intensity focused ultrasound (HIFU) are described. An ultrasound device may include HIFU units configured to emit high acoustic intensities. Multiple ultrasound devices may be disposed on a substrate, which may be configured to be flexed so that the direction of emission of the ultrasound devices can be mechanically controlled. Additionally, or alternatively, the ultrasound beams produced by different ultrasound devices may be electronically oriented by adjusting the phases of the signals with which each element of a device is driven. For example, multiple phased arrays of ultrasound devices may be used to concentrate ultrasound energy into a desired location. In some embodiments, the time at which different ultrasound signals are emitted may be controlled, for example to ensure that the combined signal has at least a desired intensity.

    Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

    公开(公告)号:AU2018203942A1

    公开(公告)日:2018-06-21

    申请号:AU2018203942

    申请日:2018-06-04

    Abstract: An apparatus, comprising: a semiconductor wafer having a complementary metal oxide semiconductor (CMOS) integrated circuit and an electrode; a conductive membrane bonded to the semiconductor wafer to form a bonded structure such that a sealed cavity exists between an uppermost portion of the semiconductor wafer and a first side of the conductive membrane, thereby defining, at least in part, an ultrasonic transducer, with the sealed cavity disposed between the conductive membrane and the electrode; and the uppermost portion of the semiconductor wafer providing an electrical connection between the CMOS integrated circuit and the first side of the conductive membrane. 136 144 1310 128 '' 1'' -'' D18 138 142 . .. . .. . .. S. .'.6.4. . W ... l' . . . . . . . . . . . . . . \ . . . . . . . . . . . . . . 2602 118 2602 104.102 2602 18 242 FIG. 2610 12

    Asynchronous successive approximation analog-to- digital converter and related methods and apparatus

    公开(公告)号:AU2016364819A1

    公开(公告)日:2018-06-14

    申请号:AU2016364819

    申请日:2016-12-01

    Abstract: An ultrasound device including an asynchronous successive approximation analog-to- digital converter and method are provided. The device includes at least one ultrasonic transducer, a plurality of asynchronous successive-approximation-register (SAR) analog-to- digital converters (ADC) coupled to the at least one ultrasonic transducer, at least one asynchronous SAR in the plurality having a sample and hold stage, a digital-to-analog converter (DAC), a comparator, and control circuitry, wherein a DAC update event following at least one bit conversion is synchronized to a corresponding DAC update event of at least one other ADC in the plurality of ADCs.

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