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公开(公告)号:SE9900574L
公开(公告)日:2000-08-19
申请号:SE9900574
申请日:1999-02-18
Applicant: ERICSSON TELEFON AB L M
Inventor: HOLMBERG PER
IPC: H05K20060101 , H05K5/03
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公开(公告)号:SE9900231L
公开(公告)日:2000-07-23
申请号:SE9900231
申请日:1999-01-22
Applicant: ERICSSON TELEFON AB L M
Inventor: HOLMBERG PER , ERIKSSON LARS
Abstract: A method for application of at least one image (5) onto a printing block (1, 22), which image is then transferred to a pad, whereupon the image (5) is pad printed on a component, preferably on the inner sides of a mobile telephone cover, at which the printing block (1, 22) comprises sides (8, 26), which can be angled in relation to each other, said image being applied onto said sides.
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公开(公告)号:AU4301799A
公开(公告)日:1999-11-16
申请号:AU4301799
申请日:1999-04-27
Applicant: ERICSSON TELEFON AB L M
Inventor: HOLMBERG PER , ERIKSSON LARS
Abstract: The invention relates to an electrically conductive unit having electrically conductive paths, which are directly or indirectly applied onto a case for creating a screening against electromagnetic radiation and for the draining of electrical currents.
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公开(公告)号:SE511330C2
公开(公告)日:1999-09-13
申请号:SE9704894
申请日:1997-12-29
Applicant: ERICSSON TELEFON AB L M
Inventor: HOLMBERG PER , SANDEVI TOMMY , FRIMAN DANIEL
Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.
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公开(公告)号:SE9903167D0
公开(公告)日:1999-09-08
申请号:SE9903167
申请日:1999-09-08
Applicant: ERICSSON TELEFON AB L M
Inventor: SVENSSON BENGT , SNYGG GOERAN , WIKGREN EMIL , MANHOLM LARS , HOLMBERG PER
Abstract: The invention relates to a distribution network for electromagnetic signals, preferably for use in an antenna arrangement in the microwave range, comprising at least two waveguide branches, in which branches the electromagnetic signals propagate in different directions in relation to one another. The invention is characterized in that the at least two waveguide branches overlap one another at one point in the distribution network. The waveguide branches in the distribution network which overlap one another are preferably neighboring branches and have at lease one aperture in the part of the branch which overlaps the other branch.
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公开(公告)号:SE9704476L
公开(公告)日:1999-06-23
申请号:SE9704476
申请日:1997-12-02
Applicant: ERICSSON TELEFON AB L M
Inventor: HALVARSSON DAN , JONSSON TOMAS , HOLMBERG PER
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公开(公告)号:SE9900573D0
公开(公告)日:1999-02-18
申请号:SE9900573
申请日:1999-02-18
Applicant: ERICSSON TELEFON AB L M
Inventor: HOLMBERG PER
Abstract: A portable electric apparatus, such as a radio telephone, has a main apparatus unit and a detachable power source unit, such as a battery pack. The apparatus also has first and second externally operable fastening members having respective first and second connecting elements for mechanically securing and electrically connecting the main apparatus unit to the power source unit. Both the first and second fastening members must be externally actuated, before the power source unit may be mechanically detached from the main apparatus unit.
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公开(公告)号:AU6232898A
公开(公告)日:1998-09-08
申请号:AU6232898
申请日:1998-02-03
Applicant: ERICSSON TELEFON AB L M
Inventor: HOLMBERG PER
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公开(公告)号:SE9702027D0
公开(公告)日:1997-05-29
申请号:SE9702027
申请日:1997-05-29
Applicant: ERICSSON TELEFON AB L M
Inventor: HOLMBERG PER , LARSSON MATS , FELDT OERJAN
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公开(公告)号:AT476864T
公开(公告)日:2010-08-15
申请号:AT05754987
申请日:2005-06-23
Applicant: ERICSSON TELEFON AB L M
Inventor: HOLMBERG PER , ANDRETZKY ULF
IPC: H05K7/20
Abstract: A cooling assembly and method of cooling a heat-generating electronic component on a circuit board. A heat collector collects heat from the electronic component. A heat pipe transfers the heat to a location remote from the electronic component. A heat sink is mounted to the circuit board at the distant location. The heat sink has at least one groove formed on an underside thereof. The heat sink is mounted so that it overlies the heat pipe and the heat pipe is introduced into the groove, thereby securing the heat pipe between the heat sink and the circuit board.
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