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    POLYIMIDE RESIN COMPOSITION
    71.
    发明专利
    POLYIMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH01161055A

    公开(公告)日：1989-06-23

    申请号：JP31745187

    申请日：1987-12-17

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI MASAJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

    IPC: C08L79/08 ,  C08G73/10

    Abstract: PURPOSE:To obtain a resin composition excellent in heat resistance, chemical resistance, mechanical strengths and processability and low in water absorptivity, by mixing a thermoplastic polyimide having specified repeating units with an aromatic polyether-imide. CONSTITUTION:This resin composition comprises 99.9-50wt.% thermoplastic polyimide having repeating units of formula I and 0.1-50wt.% aromatic polyether-imide. In formula I, X is carbonyl or sulfonyl, and R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group and a noncondensed polycyclic aromatic group consisting of aromatic groups bonded directly or through a bridging member. The polyimide used can be obtained by imidating a polyamic acid obtained by reacting an ether-diamine of formula II with a tetracarboxylic acid dianhydride. Said aromatic polyether- imide is a polymer comprising ether and imide bonds as essential bonding units.

    POLYIMIDE RESIN COMPOSITION
    72.
    发明专利
    POLYIMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH01158070A

    公开(公告)日：1989-06-21

    申请号：JP31610187

    申请日：1987-12-16

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI MASAJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

    IPC: C08L79/08 ,  C08G73/10

    Abstract: PURPOSE:To obtain a polyimide resin composition for molding having improved heat-resistance and/or mechanical strength in addition to the excellent characteristics of polyimide resin, by compounding a specific polyimide with a specific amount of an aromatic polyamide imide. CONSTITUTION:The objective uniformly compounded pellet is produced by extruding, under melt kneading, (A) 99.9-50wt.% of a polyimide having a recurring unit of formula II (R is >=2C aliphatic group, alicylic group, monocyclic aromatic group, etc.) produced by reacting an ether diamine of formula I with a tetracarboxylic acid dianhydride in an organic solvent and imidating the reaction product and (B) 0.1-50wt.%, preferably 0.5-50wt.% of an aromatic polyamide imide having the recurring unit of formula III (Ar is trivalent aromatic group having one or more bezene rings; Z is bivalent organic group), preferably an aromatic polyamide imide having the recurring unit of formula IV and formula V.

    POLYAMIDE AND HEAT-RESISTANT ADHESIVE PREPARED THEREFROM
    76.
    发明专利
    POLYAMIDE AND HEAT-RESISTANT ADHESIVE PREPARED THEREFROM 失效

    公开(公告)号：JPH0859826A

    公开(公告)日：1996-03-05

    申请号：JP19146194

    申请日：1994-08-15

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  IIYAMA KATSUAKI ,  SHIBUYA ATSUSHI ,  YAMAGUCHI TERUHIRO

    IPC: C08G69/42 ,  C09D177/00 ,  C09D177/06 ,  H05K3/38

    Abstract: PURPOSE: To obtain a heat-resistant adhesive of a low-temp. adhesion type by using a polyamide obtd. by reacting bis(aminophenoxydimethylbenzyl)benzene, a specific diaminosiloxane compd., and terephthaloyl chloride. CONSTITUTION: A polyamide is produced by reacting 1mol of 1.3- or 1,4-bis[4-(4 aminophenoxy)-α, α-dimethylbenzyl]benzene, 1-0.005-mol of a diaminosiloxane compd. of formula I wherein n is 0-7), and terephthaloyl or isophthaloyl chloride. It is important from the viewpoint of the adhesive properties and heat resistance of the resulting adhesive that the polyamide contains the siloxane units derived from the compd. of formula I and the units of formula II in a ratio of the former units to the latter of 1-0.005, pref. 0.2-0.1. In the above reaction a monocarboxylic acid or a monoamine can be used for blocking molecular terminals. A low-temp. soln. polycondensation method is suitable for obtaining a heat-resistant adhesive soln. contg. the polyamide. The soln. is applied and dried to bond a copper foil to glass. etc., providing a sufficient 90 deg. peeling strength even at low temp. and pressure.

    78.
    发明专利
    失效

    公开(公告)号：JPH05306387A

    公开(公告)日：1993-11-19

    申请号：JP11116792

    申请日：1992-04-30

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OIKAWA HIDEAKI ,  TAMAI MASAJI ,  IIYAMA KATSUAKI ,  KAWASHIMA SABURO ,  ASANUMA TADASHI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10 ,  C09J179/08 ,  H05K3/38

    Abstract: PURPOSE:To obtain an adhesive bondable at low temperature under low pressure, useful for electronic materials, etc., having excellent adhesiveness, comprising a polyamic acid having a specific repeating structural unit, etc. CONSTITUTION:The adhesive comprises a polyamic acid and/or a polyimide which contains polymer molecule ends hindered with an aromatic dicarboxylic acid anhydride (e.g. phthalic anhydride) of formula I (Z is bifunctional group selected from a group consisting of monocyclic aromatic group and noncondensed polycyclic aromatic group) and has a repeating structural unit of formula II [Y is group of formula III or IV (X is direct bond, CO or O bifunctional group). The adhesive is preferably dissolved in a solvent to give a solution, which is used for adhesion.

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