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公开(公告)号：JPH0551616B2
公开(公告)日：1993-08-03
申请号：JP4070688
申请日：1988-02-25
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OOTA MASAHIRO , KAWASHIMA SABURO , IIYAMA KATSUAKI , TAMAI MASAJI , OIKAWA HIDEAKI , YAMAGUCHI TERUHIRO
IPC: C08G73/10
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公开(公告)号：JPS6354435A
公开(公告)日：1988-03-08
申请号：JP16466886
申请日：1986-07-15
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMATANI NORIMASA , KOGA NOBUSHI , OOTA MASAHIRO , YAMAGUCHI TERUHIRO
IPC: C08G73/12
Abstract: PURPOSE:To form a thermosetting resin composition which retains inherent heat resistance and has toughness excellent in impact resistance and flexibility, by mixing a specified bismaleimide compound with a diamine compound. CONSTITUTION:This thermosetting resin composition comprises a bismaleimide compound [A] of formula I (wherein R is a bivalent group of formula II or III, X is a direct bond or a group selected from among a 1-10C bivalent hydrocarbon, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl or oxide group and a diamine compound [B] of formula IV (wherein R is as defined in formula I). The mixing ratio of A to B is preferably 1:0.1-1:1.2 (by mole).
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公开(公告)号：JPS6348335A
公开(公告)日：1988-03-01
申请号：JP19056486
申请日：1986-08-15
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMATANI NORIMASA , KOGA NOBUSHI , OOTA MASAHIRO , YAMAGUCHI TERUHIRO
IPC: C08G73/12
Abstract: PURPOSE:To obtain a thermosetting resin composition excellent in heat resistance, impact resistance and flexibility and suitable for use in electronic components, etc., by reacting a specified bismaleimide compound with 4,4'- diaminodiphenylmethane. CONSTITUTION:A bismaleimide compound (A) of formula I (wherein R is a group of formula II or III, X is a direct bond, a 1-10C bivalent hydrocarbon, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl or oxide group), e.g., N,N'-1,3-bis(3-amino-phenoxy)benzenebismaleimide, is mixed with 4,4- diaminodiphenylmethane in a molar ratio of 10:1-1:1.2, and the mixture is reacted by heating to obtain the title thermosetting resin composition. Component A can be easily produced by condensing a diamine compound of formula IV with maleic anhydride.
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公开(公告)号：JPS6337123A
公开(公告)日：1988-02-17
申请号：JP18018086
申请日：1986-08-01
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAGUCHI KEISABURO , OIKAWA HIDEAKI , SUGIMOTO KENICHI , OOTA MASAHIRO , YAMAGUCHI TERUHIRO
IPC: C08G65/40
Abstract: PURPOSE:To obtain a stable heterocyclic ring-containing compound, by polycondensing a specific dihalogenopyridine with dihydroxy compound and having a high condensation degree as well as various useful functions. CONSTITUTION:A thermoplastic aromatic polyether pyridine expressed by formula I (X is formulas II-IV, etc.; n indicates the polymerization degree and >=10). The above-mentioned compound is obtained by the presence of a 2,6- dihalogenopyridine expressed by formula V (Y is chloro, bromo or fluoro) and a dihydroxy compound expressed by the formula HO-X-OH in equimolar amounts and polycondensing both compounds in the presence of an alkali metal carbonate and/or bicarbonate or hydroxide under anhydrous condition.
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公开(公告)号：JPS6253388A
公开(公告)日：1987-03-09
申请号：JP19302085
申请日：1985-09-03
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OOTA MASAHIRO , KAWASHIMA SABURO , SONOBE YOSHIO , TAMAI MASAJI , OIKAWA HIDEAKI , YAMAGUCHI TERUHIRO
IPC: C08G73/00 , C08G73/10 , C09J5/06 , C09J179/08
Abstract: PURPOSE:A novel heat-resistant adhesive having bond strength, keeping high bond strength especially even at high temperature, comprising a polyamic acid and/or polyimide having a specific repeating unit. CONSTITUTION:The aimed adhesive comprising a polyamic acid and/or polyimide having a repeating unit shown by the formula I[X is carbonyl or sulfonyl; Y is group shown by the formula II or formula II(R is >=2C aliphatic, cyclic alihpatic, monocyclic aromatic, condensed polycylic aromatic or noncondensed polycyclic aromatic wherein aromatic group is directly bonded or aromatic groups are bonded each other through crosslinked members)].
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Patent Agency Ranking
公开(公告)号：JPS6248782A
公开(公告)日：1987-03-03
申请号：JP18661085
申请日：1985-08-27
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OOTA MASAHIRO , KAWASHIMA SABURO , SONOBE YOSHIO , TAMAI MASAJI , OIKAWA HIDEAKI , YAMAGUCHI TERUHIRO
IPC: C08G73/10 , C09J179/08
Abstract: PURPOSE:A heat-resistant adhesive, consisting of a polyimide having repeating units of a specific structure and inherent viscosity within a specific range, having improved heat resistance and adhesive force, soluble in low-boiling solvents, having good operability and useful for bonding electrical and electronic apparatus, etc. CONSTITUTION:An adhesive, consisting of a polyimide having repeating units expressed by the formula and having 0.05-1.5dl/g inherent viscosity (measured by using a solution in N,N-dimethylacetamide in 0.5g/100ml solvent concentration at 35 deg.C) and obtained by reacting, e.g. 2,2-bis[4-(3-aminophenoxy) phenyl]propane with 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride to form a polyamic acid and dehydrocylcizing the resultant polyamic acid. The above-mentioned adhesive is preferably used by dissolving in an aliphatic halogenated hydrocarbon.
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公开(公告)号：JPS61195130A
公开(公告)日：1986-08-29
申请号：JP3531085
申请日：1985-02-26
Applicant: MITSUI TOATSU CHEMICALS
Inventor： TAMAI MASAJI , KAWASHIMA SABURO , SONOBE YOSHIO , OOTA MASAHIRO , OIKAWA HIDEAKI , YAMAGUCHI TERUHIRO
Abstract: PURPOSE:To obtain the titled product having improved heat resistance, electric characteristics and mechanical characteristics in good film-forming properties, by adding an amide polar solvent to an ether solvent solution containing an aromatic polyamic acid having a specific viscosity, to give a raw material solution. CONSTITUTION:Firstly, (B) 1-20pts.wt. amide-based polar solvent (preferably N-methyl-2-pyrrolidone, etc.) is added to (A) 100pts.wt. ether-based solvent solution containing 5-50wt% aromatic polyamic acid having 0.1dl/g (measured in N,N-dimethylacetamide solvent at 0.5g/100ml solvent at 35 deg.C) logarithmic viscosity. Then, the solution is cast into a substrate, heated, so the solvent is removed and a dehydration reaction takes place, to give the aimed product. The component A is preferably obtianed by reacting an acid anhydride component such as pyromellitic dianhyride, etc., with a diamine component such as m-phenyl-diamine, etc., in an ether solvent.
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公开(公告)号：JPS61143479A
公开(公告)日：1986-07-01
申请号：JP26522184
申请日：1984-12-18
Applicant: MITSUI TOATSU CHEMICALS
Inventor： TAMAI MASAJI , KAWASHIMA SABURO , SONOBE YOSHIO , OOTA MASAHIRO , YAMAGUCHI TERUHIRO
IPC: C08G73/00 , C08G65/40 , C08G73/10 , C09J179/08
Abstract: PURPOSE:To provide the titled adhesive composed of a specific polyether-imide resin, exhibiting strong adhesivity without lowering the heat-resistance, and capable of keeping the high adhesivity even at a high temperature. CONSTITUTION:The polyether-imide resin containing the recurring unit of formula is used as an adhesive in the form of film or powder.
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公开(公告)号：JPS61143477A
公开(公告)日：1986-07-01
申请号：JP26521984
申请日：1984-12-18
Applicant: MITSUI TOATSU CHEMICALS
Inventor： TAMAI MASAJI , KAWASHIMA SABURO , SONOBE YOSHIO , OOTA MASAHIRO , YAMAGUCHI TERUHIRO
IPC: C08G73/00 , C08G65/40 , C08G73/10 , C09J179/08
Abstract: PURPOSE:To provide a heat-resistant adhesive consisting of polyamic acid and polyimic acid having specific recurring units, and capable of keeping the heat- resistance and adhesivity even at a high temperature. CONSTITUTION:The objective adhesive is composed of a polymer having the recurring unit of formula I [Y is group of formula II or III; R is >=3C (cyclo) aliphatic group, (condensed polycyclic) aromatic group, or mutually connected non-condensed polycyclic aromatic groups]. The polymer wherein Y is group of formula II can be prepared by reacting (A) 1,3-bis(3-aminophenoxy)benzene with (B) the compound of formula IV (e.g. 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride) in an organic solvent [e.g. bis(2-methoxyethyl) ether] preferably at
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公开(公告)号：JPS60161426A
公开(公告)日：1985-08-23
申请号：JP1503384
申请日：1984-02-01
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OOTA MASAHIRO , KAWAMATA MOTOO , TSUBOI HIKOTADA , SONOBE YOSHIO , HASHIMOTO MITSUYOSHI
Abstract: PURPOSE:In interfacial polymerization, to obtain a polyester having improved heat resistance and molding properties in high reproducibility, by bringing an alkali aqueous solution of a bisphenol into contact with a solution of an acid chloride in an organic solvent with vigorous stirring in a short time so that the solutions are dispersed rapidly and uniformly. CONSTITUTION:In subjecting a solution of a dicarboxylic acid dihalide shown by the formula I (carbonyl is in m-position and p-position each other; X is halogen) in an organic solvent and an alkali aqueous solution of bisphenol shown by the formula II (OH is in m-position or p-position based on -SO2-) and shown by the formula III (OH is in m-position or p-position based on Y; Y is 1-20C bifunctional hydrocarbon, -O-, etc.; a is 0, or 1; R1-4 are H, or 1-8C hydrocarbon or halogen; when Y is -SO2- and a is L, R1-R4 are not H simultaneously) to interfacial polymerization in a ratio of 0.36-1.06mol of the bisphenol shown by the formula II and 0.04-0.66mol of the bisphenol shown by the formula III based on 1mol of the dihalide (total amount of both the bisphenols is 0.90-1.10mol), polymerization is carried out with vigorous stirring in such a way that the polymerization time tc and the addition time ta satisfy the relationship shown by the equation 0
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