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公开(公告)号：JPS62187022A
公开(公告)日：1987-08-15
申请号：JP2894586
申请日：1986-02-14
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , KONDO MAKOTO , YAMAMOTO YOSHIYUKI
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公开(公告)号：JPS62184037A
公开(公告)日：1987-08-12
申请号：JP2574086
申请日：1986-02-10
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , KONDO MAKOTO , YAMAMOTO YOSHIYUKI
Abstract: PURPOSE:To obtain a thermoplastic resin composition excellent in flexibility, high-temperature properties, compression set resistance, mechanical properties, etc., by mixing a polyamide with a nitrile rubber and a specified organic peroxide and melt-kneading the mixture. CONSTITUTION:The following three components A-C are melt-kneaded together. (A): 5-50pts.wt. polyamide of a m.p. >=170 deg.C; (B): 95-50pts.wt. nitrile rubber; and (C): an organic peroxide having a 1min half-life temperature >=185 deg.C in an amount to provide 0.002-0.05mol of the peroxide group per 100g of the nitrile rubber (B) are melt-kneaded together (the total of A and B being 100pts. wt.). As component A, nylon 11, nylon 12, nylon 6/60 or nylon 6/66/610 is desirable. Examples of component C include di-t-butyl peroxide and 2,5-dimethyl-2,5- di-t-butylperoxyhexyne-3.
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公开(公告)号：JPS6295340A
公开(公告)日：1987-05-01
申请号：JP23510685
申请日：1985-10-23
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , MORI SATORU , YAMAMOTO YOSHIYUKI
Abstract: PURPOSE:A molding resin composition having improved molding and processing properties, providing a molded article with improved rubber characteristics, obtained by blending two polyether ester amides having different composition in a molten state. CONSTITUTION:A composition consisting of 1-99wt% polyether ester amide containing (A) Xwt% polyamide derived fro >=6C aminocarboxylic acid (preferably 11-aminoundecanoic acid), lactam or >=6C diamine and a carboxylate as a hard component and (B) 100-Xwt% polyether ester derived from a poly(alkylene oxide)glycol, preferably poly(tetramethylene oxide)glycol having 300-6,000 number-average molecular weight and 4-20C dicarboxylic acid as a soft component and 99-1wt% polyether ester amide containing Ywt% component A and 100-Ywt% component A, wherein X and Y are in a range shown by the formula.
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公开(公告)号：JPS6284141A
公开(公告)日：1987-04-17
申请号：JP22412185
申请日：1985-10-08
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , MORI SATORU , YAMAMOTO YOSHIYUKI
Abstract: PURPOSE:To obtain a composition of good appearance with high performance in flexibility, low-temperature characteristics resiliency and bleedout resistance, by incorporating a polyether-esteramide with a vinyl chloride graft copolymer. CONSTITUTION:The objective composition can be obtained by incorporating (A) 1-99wt% of a polyether esteramide derived from (i) a >=6C aminocarboxylic acid or (ii) a >=6C lactam or (iii) a salt from >=6C diamine and dicarboxylic acid and (iv) a poly (alkylene oxide) glycol with a number-average molecular weight 300-6,000 and (v) a 4-20C dicarblxylic acid with (B) 99-1wt% of a vinyl chloride graft copolymer prepared by graft copolymerization of vinyl chloride to ethylene-vinyl acetate copolymer. The EVA of the component B is preferably with such amount of the vinyl acetate copolymerized as to fall between 10 and 90wt%. The component B is preferably with such amounts the EVA and vinyl chloride copolymerized falling between 30 and 70wt% and 70 and 30wt%, respectively.
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公开(公告)号：JPS6280037A
公开(公告)日：1987-04-13
申请号：JP22074385
申请日：1985-10-03
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , KONDO MAKOTO , YAMAMOTO YOSHIYUKI
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Patent Agency Ranking
公开(公告)号：JPS61183352A
公开(公告)日：1986-08-16
申请号：JP2346685
申请日：1985-02-12
Applicant: TORAY INDUSTRIES
Inventor： OKITA SHIGERU , KAYABA KEIJI , YAMAMOTO YOSHIYUKI
Abstract: PURPOSE:To provide the titled compsn. having excellent impact resistance, durability and toughness, by blending a polyether ester amide with a linear arom. polyester. CONSTITUTION:At least one compd. (a) (e.g. 12-amino-dodecanoic acid) selected from among 6C or higher aminocarboxylic acids and lactams and salts of 6C or higher diamines with dicarboxylic acids, a poly(alkylene oxide) glycol (b) having a number-average MW of 300-6,000, such as poly(tetramethylene oxide) glycol, and a 4-20C dicarboxylic acid (c) such as dodecanedioic acid are solution-polymerized and the polymerization is then accelerated under high vacuum to obtain a polyether ester amide (A). 1-50wt% component A is blend ed with 99-50pts.wt. linear arom. polyester (e.g. polybutylene terephethalate) obtd. by condensing an arom. dicarboxylic acid with a diol as main components.
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公开(公告)号：JPS61183345A
公开(公告)日：1986-08-16
申请号：JP2346585
申请日：1985-02-12
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , KONDO MAKOTO , YAMAMOTO YOSHIYUKI
Abstract: PURPOSE:To provide a resin compsn. having excellent moldability, impact resistance, flexibility and mechanical properties, by mixing a polyether ester amide having a specified composition with a polyacetal. CONSTITUTION:A polyether ester amide is prepd. by reacting a 6C or higher aminocarboxylic acid or lactam, or a salt of a 6C or higher diamine and a dicarboxylic acid (e.g. 11-aminoundecanoic acid) (A), a poly(alkylene oxide) glycol (B) having a number-average MW of 300-6,000 [e.g. poly(tetramethylene oxide) glycol] and a 4-20C dicarboxylic acid (C) (e.g. terephthalic acid). 99-1wt% polyether ester amide is mixed with 1-99wt% polyacetal (e.g. formal dehyde homopolymer or formaldehyde/propylene oxide copolymer) to obtain the desired resin compsn.
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公开(公告)号：JP2003105174A
公开(公告)日：2003-04-09
申请号：JP2001303478
申请日：2001-09-28
Applicant: TORAY INDUSTRIES
Inventor： TANIMURA YASUAKI , KAYABA KEIJI , SHINTANI SHUICHI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin having excellent moldability. SOLUTION: The semiconductor sealing epoxy resin comprises (A) an epoxy resin, (B) a curing agent, (C) a filler, and (D) a hydrotalcite, and the epoxy resin (A) contains a tetramethylbisphenol F type epoxy resin to be represented by formula (I) and, simultaneously, the hydrotalcite (D) contains a hydrotalcite to be represented by formula (II): Mgx Aly (OH)2x+3y-2z (CO3 )2 .
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公开(公告)号：JPH1160698A
公开(公告)日：1999-03-02
申请号：JP2327498
申请日：1998-02-04
Applicant: TORAY INDUSTRIES
Inventor： TANAKA MASAYUKI , KAYABA KEIJI , UENO TOSHIAKI
Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition having a good soldering heat resistance by blending a biphenyl type epoxy resin or the like, a curing agent and a powder filler having a specific particle diameter as its major components. SOLUTION: A resin composition comprises 3-30 wt.% of an epoxy resin having a structure of formula I, 1-20 wt.% of a curing agent and 50-85 wt.% of a powder filler such as a molten silica containing not less than 50 wt.% of powder having a diameter of not more than 14 μm and less than 50 wt.% of powder having a diameter of not more than 12 μm as the major components. The composition also contains a curing accelerator, a flame retardant and a mold releasing agent or the like. The epoxy resin contains 4,4'-bis(2,3- epoxypropoxy)biphenyl, 4,4'-bis(2,3-epoxpropoxy), 3,3',5,5'-tetramethylbiphenyl or the like as the essential component. A phenol novolak type epoxy resin or the like is used in combination. As the curing agent, a phenol novolak resin, a polyhydric phenol compound or the like is used. In formula I, R1-R8 are each H, a 1-4C lower alkyl or a halogen atom.
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公开(公告)号：JPH09169894A
公开(公告)日：1997-06-30
申请号：JP396197
申请日：1997-01-13
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OKAMOTO MASARU
Abstract: PROBLEM TO BE SOLVED: To obtain a liquid-crystal polyester resin composition excellent in heat resistance, moldability and flowability and having high mechanical properties, high weld strength of a molding in particular, by blending a specified liquid-crystal polyester resin with a filler of a specified shape. SOLUTION: This composition consists of 99-20wt.% liquid-crystal polyester consisting of structural units of formula I [wherein X stands for at least one group selected from those of formula II; the carbonyl groups of structural units (IV) are at the p- or m-positions to each other, at least 50% of which are at the p-positions; and the total of the structural units (II) and (III) are substantially equimolar to the structural units (IV)], having a heat distortion temperature of 190-280 deg.C and a liquid-crystal initiation temperature of 330 deg.C or lower and forming an anisotropic melt phase with a melt viscosity of 10,000P or lower, and 1-80wt.% flaky or particulate filler. This composition is useful for a molded article having a weld part.
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