RESIN COMPOSITION FOR PREPREG
    72.
    发明专利

    公开(公告)号:JPS62275123A

    公开(公告)日:1987-11-30

    申请号:JP11753286

    申请日:1986-05-23

    Abstract: PURPOSE:To obtain the title composition having large (specific) strength and (specific) modulus and excellent heat resistance, water resistance and impact resistance, by mixing a cyanic ester with a bismaleimide, a polyethery sulfone and an epoxy resin at a specified weight ratio. CONSTITUTION:10-90wt% total of 70-100pts.wt. cyanic ester (A) of formula I (wherein R is an aromatic organic group and m is 2-5) and 30-0pts.wt. bismaleimide (B) of formula II (wherein R is a bi- to penta-valent aromatic or aliphatic organic group) is mixed with 5-30wt% polyether sulfone (C) having the structure of formula III and 10-90wt% epoxy resin (D) based on a bisphenol F or bisphenol A-derived epoxy resin and containing, if necessary, other epoxy resins such as a phenol novolak epoxy resin and an alicyclic epoxy resin.

    MATRIX RESIN COMPOSITION FOR PREPREG

    公开(公告)号:JPS61246224A

    公开(公告)日:1986-11-01

    申请号:JP8625585

    申请日:1985-04-24

    Abstract: PURPOSE:The titled composition excellent in compressive strength and impact strength under high-humidity wet conditions, comprising a specified epoxy resin composition and a polyether sulfone. CONSTITUTION:5-50pts.wt. polyether sulfone of formula II is added to 100pts.wt. epoxy resin composition comprising 20-70wt% N,N,N'N'- tetraglycidyldiaminodiphenylmethane, 10-50wt% brominated epoxy resin of a bromine content of 16-50wt%, 10-60wt% bisphenol A epoxy resin and 0.5-0.7 equivalent of a compound of formula I (wherein R is residue derived by removing the OH groups from a 3-8 C alkylene glycol or a 5-14 C alicyclic diol) as a curing agent.

    POLYAMIDE RESIN COMPOSITION
    79.
    发明专利

    公开(公告)号:JPS5829854A

    公开(公告)日:1983-02-22

    申请号:JP12774481

    申请日:1981-08-17

    Abstract: PURPOSE:To provide the titled compsn. having excellent flexibility and resistance to impact and flexural fatigue, consistng of a polyamide, a copolyolefin and an ionomer resin. CONSTITUTION:A polyamide resin compsn. consists of 50-95wt% polyamide (A) such as nylon 6, nylon 66 or nylon 610, 5-40wt% copolyolefin (B) in which ethylene and 3C or higher alpha-olefin such as propylene are main structural units, and 1-30wt% ethylene ionomer resin (C) such as an ionic polymer obtd. by adding Na to an ethylene/(meth)acrylic acid copolymer. An extremely intinate mixture having excellent flexibility and resistance to impact and flexural fatigue can be obtd. by incorporating a small amount of component C in a mixture of components A and B, said mixture of A and B being poor in compatibility.

    RESIN COMPOSITION
    80.
    发明专利

    公开(公告)号:JPS57207644A

    公开(公告)日:1982-12-20

    申请号:JP9085681

    申请日:1981-06-15

    Abstract: PURPOSE:To obtain a resin composition having lowered moisture absorption and improved dimensional stability and hydrolysis resistance, and miscible uniformly over a wide range of the mixing ratio without phase-separation, by mixing a specific polyester-amide with a polyamide. CONSTITUTION:The objective resin is obtained by mixing (A) 5-95pts.wt. of a polyester-amide composed mainly of (i) 10-95wt% polyester unit of formulaI- formula V (k is 8-10; l is 2-6; m is 1-20), e.g. polybutylene terephthalate unit or a unit derived from undecane dicarboxylic acid and ethylene glycol and (ii) 5-90wt% polyamide unit of formula VI or VII[n is 10 or 11; R is (CH2)q or monocyclic aromatic nucleus; p is 6-12; q is 6-10]e.g. a unit derived from 11-aminoundecanoic acid, and (B) 95-5pts.wt. of a polyamide having a relative viscosity of 2.0-5.0 (measured at 25 deg.C by dissolving 1g of the polymer in 100ml of 98% concentrated sulfuric acid).

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