公开(公告)号：US5516031A

公开(公告)日：1996-05-14

申请号：US235909

申请日：1994-05-02

Applicant: Toru Nishikawa ,  Masahito Ijuin ,  Ryohei Sato ,  Mitsugu Shirai

Inventor： Toru Nishikawa ,  Masahito Ijuin ,  Ryohei Sato ,  Mitsugu Shirai

IPC: B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34 ,  B23K3/08

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/75 ,  H05K3/3436 ,  H05K3/3489 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/75272 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426 ,  Y02P70/613

Abstract: In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.

Abstract translation: 为了通过无焊接方法及其设备通过溅射蚀刻来对应于其通过溅射蚀刻的焊接和焊接材料的焊接材料的焊接和焊接材料上的氧化膜和污染膜去除氧化物膜和污染膜，在溅射蚀刻下从焊料材料发射的物质使用 检测并确定原子或离子是来自焊料材料还是来自其上的氧化物膜。 基于去除氧化膜的测定来控制溅射蚀刻。 然后，将构件在氧化气氛中排列并在非氧化气氛中焊接。

公开(公告)号：US5509597A

公开(公告)日：1996-04-23

申请号：US323822

申请日：1994-10-17

Applicant: Paul Laferriere

Inventor： Paul Laferriere

IPC: B23K1/005 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K3/3421 ,  B23K1/0056 ,  B23K2201/36 ,  H05K1/0269 ,  H05K2201/09918 ,  H05K2201/10689 ,  H05K2203/0545 ,  H05K2203/107 ,  H05K2203/163 ,  H05K3/3494 ,  Y02P70/613

Abstract: Apparatus and method for soldering a first material to a second material uses a laser and involves applying solder paste over the first material, placing the second material on the solder paste in alignment with the first material to form a sample, and focusing a laser beam onto a predetermined location on the sample to segment the solder paste and form a solder joint between the first material and the second material. During the soldering, optical images of at least one region-of-interest in the solder paste adjacent the solder joint are captured. Formation of the solder joint is monitored by repeatedly calculating pixel value sums in the region-of-interest from the optical images to determine whether the solder paste in the region-of-interest has segmented. Control signals may be generated based on the pixel value sums and used to adjust at least one of the intensity and duration of the laser beam.

Abstract translation: 用于将第一材料焊接到第二材料的装置和方法使用激光并且包括将焊膏涂覆在第一材料上，将第二材料放置在与第一材料对准的焊膏上以形成样品，并将激光束聚焦到 样品上的预定位置以分割焊膏并在第一材料和第二材料之间形成焊接接头。 在焊接期间，捕获与焊料相邻的焊膏中至少一个感兴趣区域的光学图像。 通过从光学图像重复计算感兴趣区域中的像素值和来确定感兴趣区域中的焊膏是否已经被分割来监测焊接点的形成。 可以基于像素值和生成控制信号，并且用于调整激光束的强度和持续时间中的至少一个。

公开(公告)号：US5505367A

公开(公告)日：1996-04-09

申请号：US333168

申请日：1994-11-02

Applicant: Yinon Degani ,  Thomas D. Dudderar ,  John G. Spadafora

Inventor： Yinon Degani ,  Thomas D. Dudderar ,  John G. Spadafora

IPC: H01L21/52 ,  B23K1/00 ,  B23K31/02

CPC classification number: B23K1/0016 ,  B23K2201/36

Abstract: The bonding pads (18) of a semiconductor chip (12) each may be provided with a solder bump (36) by first screen printing a pattern of solder paste (36) on a heat-resistant, non-wettable surface (24). The chip (12) is then placed on the surface (24) so each bonding pad (18) contacts a portion of the solder paste pattern (36). The solder paste is then reflowed, yielding molten solder that bonds to the bonding pads (18) of the chip, but not to the surface (24). After reflow, the chip, with its now-bumped pads, is removed from the surface for subsequent soldering to a wettable substrate.

Abstract translation: 半导体芯片（12）的接合焊盘（18）可以通过在耐热不可湿表面（24）上首先丝网印刷焊膏（36）的图案而设置有焊料凸块（36）。 然后将芯片（12）放置在表面（24）上，使得每个接合焊盘（18）接触焊膏图案（36）的一部分。 然后将焊膏回流，产生粘结到芯片的焊盘（18）而不是表面（24）的熔融焊料。 在回流之后，将具有其现在凸起的焊盘的芯片从表面上移除，以便随后焊接到可润湿的基板上。

公开(公告)号：US5493775A

公开(公告)日：1996-02-27

申请号：US185602

申请日：1994-01-21

Applicant: Vijay S. Darekar ,  Charles G. Woychik

Inventor： Vijay S. Darekar ,  Charles G. Woychik

IPC: B23K31/12 ,  G01R31/04 ,  H05K3/34 ,  B23K1/06

CPC classification number: G01R31/046 ,  B23K31/12 ,  B23K2201/36 ,  Y10T29/49144 ,  Y10T29/49774

Abstract: A method and apparatus for non-destructively detecting pressure contact open types of solder connections transmits acoustic emissions through an electronic component and the carrier upon which the electronic component is mounted by one or more solder connections. Emissions which are transmitted through the solder connections and which will interact with acoustic emissions generated if pressure contact opens are present are analyzed by comparison with the signal which is used to cause emissions to detect the presence of pressure contact opens by comparison of one or more of harmonics, energy, count, voltage, duration, rise time and time delay. A housing is preferably used to position a pair of transducers at respective locations which have solder connections topologically intervening therebetween. The testing process can thus be automated for screening assembled devices for the presence of pressure contact opens.

Abstract translation: 用于非破坏性地检测压力接触开放类型的焊接连接的方法和装置通过电子部件和通过一个或多个焊接连接安装电子部件的载体来传输声发射。 通过焊接连接传输的和与压力接触打开时产生的声发射相互作用的排放通过与用于使排放物通过比较一个或多个 谐波，能量，计数，电压，持续时间，上升时间和时间延迟。 优选地使用壳体来将一对换能器定位在具有拓扑上介于其间的焊接连接的相应位置处。 因此，可以自动化测试过程，以便筛选组装的设备以保持压力接触打开。

公开(公告)号：US5478700A

公开(公告)日：1995-12-26

申请号：US171898

申请日：1993-12-21

Applicant: Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

Inventor： Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

IPC: B05C5/02 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34 ,  G03F7/16 ,  B05D5/12 ,  B23K31/02

CPC classification number: H01L24/27 ,  B23K3/0692 ,  H01L21/4853 ,  H01L21/4867 ,  H01L24/83 ,  H05K3/1233 ,  H05K3/3484 ,  B23K2201/36 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2201/0989 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K3/321 ,  H05K3/3452 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a bonding agent injection head which includes a wiping guide, a blade which cooperates with the wiping guide to form an elongate nozzle slit, and an evacuation path ahead of the nozzle slit in a direction of movement of the injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The evacuation path ahead of the nozzle slit lets air out of the cavity openings as the cavity openings are filled with bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, the stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.

Abstract translation: 在电子电路的制造中，将粘合剂（例如焊膏和导电粘合剂）施加到衬垫部位的方法使用粘合剂注射头，其包括擦拭引导件，与擦拭引导件配合形成细长喷嘴狭缝的刀片 以及在注射头的移动方向上的喷嘴狭缝前方的抽空路径。 具有腔体开口的永久性掩模施加在载体上的导电焊盘周围。 导电垫对应于芯片附接位置。 使注射头与掩模的表面接触，并且将压力施加到注射头中的粘合剂。 然后将注射头移动到掩模的表面上，用粘合剂填充空腔开口。 喷嘴狭缝前方的抽空路径使空腔从空腔开口排出，因为空腔开口填充有粘结剂。 然后将注射头从掩模的表面去除。 如果使用焊膏，则将红外线辐射施加到填充的空腔开口，以蒸发浆料焊剂并回流焊料，以在突出在掩模上方的空腔开口内形成焊球。 如果使用导电粘合剂，则在将掩模与所述注射头接触之前，将模板施加到掩模的表面。 当空腔开口被填充时，将模板从掩模中取出，填充空腔开口的导电粘合剂被干燥。

公开(公告)号：US5478004A

公开(公告)日：1995-12-26

申请号：US309584

申请日：1994-09-21

Applicant: Sang-Hong Lee

Inventor： Sang-Hong Lee

IPC: B23K1/20 ,  B05C5/02 ,  B23K3/00 ,  H05K3/34

CPC classification number: B23K1/203 ,  B23K2201/36

Abstract: An automatic soldering apparatus and method includes compressed air pipes on both sides of a ceramic foaming tube to prevent through holes of the ceramic foaming tube from being clogged by a foreign substance and to constantly maintain the air pressure within the ceramic foaming tube for uniform dimension of foaming flux and uniform foaming height, thereby performing uniform flux treatment upon a circuit board to eliminate inferiority caused by the foaming flux.

Abstract translation: 一种自动焊接装置和方法包括在陶瓷发泡管两侧的压缩空气管，以防止陶瓷发泡管的通孔被异物堵塞，并且恒定地保持陶瓷发泡管内的空气压力，使其尺寸均匀 发泡焊剂和均匀的发泡高度，从而对电路板进行均匀的焊剂处理，以消除由发泡通量引起的劣化。

公开(公告)号：US5458281A

公开(公告)日：1995-10-17

申请号：US269854

申请日：1994-06-30

Applicant: Andrew J. Downing ,  Donald C. Foster ,  Karl J. Puttlitz

Inventor： Andrew J. Downing ,  Donald C. Foster ,  Karl J. Puttlitz

IPC: B23K1/018

CPC classification number: B23K1/018 ,  B23K2201/36

Abstract: The present invention relates generally to a new apparatus and method for removing solid material and liquid material that may contain solid material from a substrate. More particularly, the invention encompasses an apparatus and method for removing molten solder which may contain solid particles and solder balls or columns from a substrate using a unique squeegee. Also, disclosed is a method for removing solder balls or columns from a substrate using a backer having an adhesive thereon.

Abstract translation: 本发明一般涉及一种用于从固体材料中除去固体材料和液体材料的新装置和方法，所述固体材料和液体材料可以含有来自基底的固体材料。 更具体地说，本发明包括一种用于去除熔融焊料的装置和方法，该装置和方法可以使用独特的刮板从基板上包含固体颗粒和焊球或者列。 此外，公开了一种使用其上具有粘合剂的衬垫从衬底去除焊球或柱的方法。

公开(公告)号：US5452838A

公开(公告)日：1995-09-26

申请号：US165698

申请日：1993-12-10

Applicant: Farhad Farassat

Inventor： Farhad Farassat

IPC: B23K20/10 ,  H01R43/02

CPC classification number: H01L24/85 ,  B23K20/10 ,  H01L24/78 ,  H01R43/0207 ,  B23K2201/36 ,  B23K2203/10 ,  H01L2224/45124 ,  H01L2224/78313 ,  H01L2224/78822 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033

Abstract: A bonding head for an ultrasonic bonding machine comprises a wedge operatively associated with an ultrasound transducer by means of which an electrically conducting wire can be pressed against a contact surface of an electrical or electronic component and bonded thereto by ultrasonic excitation of the wedge. A wire clamp is located adjacent to and ahead of the wedge and can be moved back and forth by drive means in the direction of the wire being fed to the wedge. The wedge can be moved up and down together with the wire clamp and its drive means in a direction substnatially perpendicular to the contact surface. The bonding head as a whole is also disposed so that it can be swung about an axis perpendicular to the contact surface. The drive means for wire clamp comprises a translational drive which can move the wire clamp exactly parallel to the direction of the wire being fed to the wedge.

Abstract translation: 用于超声波接合机的接合头包括与超声换能器可操作地相关联的楔子，借助于该超声换能器，导电线可以压靠在电子或电子部件的接触表面上并通过楔的超声波激发而与其结合。 线夹位于楔形件的附近和前方，并且可以通过驱动装置在被馈送到楔形物的线的方向上来回移动。 楔形件可以与线夹及其驱动装置一起沿垂直于接触表面的方向上下移动。 整个接合头也被布置成使得它可以围绕垂直于接触表面的轴摆动。 用于电线夹的驱动装置包括平移驱动器，该平移驱动器能够精确地平行于馈送到楔形物的线的方向移动线夹。

公开(公告)号：US5104494A

公开(公告)日：1992-04-14

申请号：US724644

申请日：1991-07-02

Applicant: D. Morgan Tench ,  Dennis P. Anderson

Inventor： D. Morgan Tench ,  Dennis P. Anderson

IPC: B23K1/00 ,  B23H9/00 ,  B23K1/20 ,  C25C1/00 ,  H05K3/07 ,  H05K3/22 ,  H05K3/34

CPC classification number: H05K3/22 ,  B23H9/00 ,  B23K1/20 ,  B23K2201/36 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K3/07

Abstract: A low-temperature, nondestructive method of electrochemical reduction is provided for restoring solderability of oxidized electronic component leads and solderable portions of printed wiring boards. The component or circuit board is immersed in an electrolyte solution. The electrolyte is chosen to be non-reactive with the circuit board and component materials. In one embodiment, the electrolyte comprises a benign borate buffer solution. The solderable portion of the component or circuit board is connected to the cathode of an electric power source to form a first electrode. A second, inert electrode is connected to the anode of the current source and immersed in the electrolyte. Current passing between the electrodes electrochemically reduces the metallic oxides on the solderable portions of the component or circuit board. In a second embodiment, the electrolyte comprises an active reducing agent. When the solderable portion of the component or circuit board is immersed in the reducing agent, localized galvanic action causes reduction of any metallic oxides without connection to an external power source. This is particularly useful for restoring solderability of printed wiring boards having non-interconnected circuitry. Reduction of the oxides to their metallic form restores and ensures solderability of the solderable portions of the electronic component or printed wiring board.

Abstract translation: 提供了电化学还原的低温，非破坏性方法，用于恢复氧化电子部件引线和印刷线路板的可焊接部分的可焊性。 将部件或电路板浸入电解液中。 电解质被选择为与电路板和组件材料不反应。 在一个实施方案中，电解质包含良性硼酸盐缓冲溶液。 部件或电路板的可焊接部分连接到电源的阴极以形成第一电极。 第二惰性电极连接到电流源的阳极并浸入电解质中。 电极之间的电流通过电化学方式减少部件或电路板的可焊接部分上的金属氧化物。 在第二个实施方案中，电解质包含活性还原剂。 当组件或电路板的可焊接部分浸入还原剂中时，局部电化作用导致任何金属氧化物的还原，而不与外部电源连接。 这对于恢复具有非互连电路的印刷电路板的可焊性特别有用。 将氧化物还原为其金属形状还原并确保电子部件或印刷线路板的可焊接部分的可焊性。

公开(公告)号：US4889275A

公开(公告)日：1989-12-26

申请号：US266470

申请日：1988-11-02

Applicant: William B. Mullen, III ,  Douglas W. Hendricks

Inventor： William B. Mullen, III ,  Douglas W. Hendricks

IPC: B23K1/005 ,  B23K1/20 ,  G02B6/44 ,  H01L41/22 ,  H01R43/02 ,  H05K3/34 ,  H05K3/36

CPC classification number: G02B6/4442 ,  B23K1/20 ,  G02B6/4471 ,  H01L41/29 ,  H01R43/0221 ,  H05K3/3457 ,  H05K3/363 ,  B23K2201/36 ,  B23K2201/40 ,  H05K2201/09709 ,  H05K2201/10666 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/107 ,  H05K3/3494

Abstract: A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.

Abstract translation: 提供了一种用于在衬底和其中具有通孔的至少一个金属化膜之间实现高密度焊料互连的方法。 首先将焊料应用于基板的金属化部分，然后对焊料进行回流工艺以提供回流焊料。 在第二回流过程中，对回流焊料施加压力以提供预应力或成形焊料。 金属化膜然后与邻近成形焊料的至少一个金属化部分定位。 来自激光器的热被引导通过膜中的通孔以熔化焊料并在基底和金属化膜之间形成焊料互连。