公开(公告)号：US06447898B1

公开(公告)日：2002-09-10

申请号：US09440337

申请日：1999-11-15

Applicant: Ronald Pfaff

Inventor： Ronald Pfaff

IPC: B32B712

CPC classification number: H01L24/83 ,  C09J7/10 ,  H01B1/22 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0329 ,  H05K2201/2036 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2996 ,  H01L2924/00

Abstract: Electrically conductive, thermoplastic and heat-activatable adhesive sheet comprising i) a thermoplastic polymer in a proportion of at least 30% by weight, ii) one or more tackifying resins in a proportion of from 5 to 50% by weight and/or iii) epoxy resins with hardeners, with or without accelerators, in a proportion of from 5 to 40% by weight, iv) metallized particles in a proportion of from 0.1 to 40% by weight, v) non-deformable or virtually non-deformable spacer particles, in a proportion of from 1 to 10% by weight, which do not melt at the bonding temperature of the adhesive sheet.

Abstract translation: 导电性，热塑性和热可活化的粘合片，其包含：i）至少30重量％的热塑性聚合物，ii）5重量％至50重量％的一种或多种增粘树脂和/或iii）环氧树脂 硬化剂，有或没有促进剂，其含量为5-40重量％，iv）0.1-40重量％的金属化颗粒，v）不可变形或实际上不可变形的间隔颗粒， 在粘合片的粘合温度下不熔化的比例为1〜10重量％。

公开(公告)号：US06423172B1

公开(公告)日：2002-07-23

申请号：US09582628

申请日：2000-07-07

Applicant: Ciaran McArdle ,  Rory B. Barnes

Inventor： Ciaran McArdle ,  Rory B. Barnes

IPC: B32B3200

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

Abstract translation: 本发明提供了涂覆非随机和有序排列阵列的各种相互关联的方法，以及包含这种阵列的膜。 本发明还涉及由其制备的涂覆的非随机和有序排列的颗粒和膜。 通过使用可固化的铁磁流体组合物获得涂布的非随机和有序阵列。 阵列和膜可以包含可用于电子应用中的导电颗粒，用于实现导体之间的接触。

公开(公告)号：US20020067457A1

公开(公告)日：2002-06-06

申请号：US09988408

申请日：2001-11-19

Inventor： Akira Mase

IPC: G02F001/1339

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

公开(公告)号：US20020014615A1

公开(公告)日：2002-02-07

申请号：US09460389

申请日：1999-12-13

Inventor： YUKIO YAMADA ,  MIKIO SAKAIRI ,  YASUSHI AKUTSU ,  TOMOYUKI ISHIMATSU

IPC: H01B001/02 ,  H01B001/00

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0307 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00

Abstract: An anisotropic conductive adhesive film capable of maintaining a high connection reliability on connection electrodes with a fine pitch on which an oxide film is formed. The anisotropic conductive adhesive film 1 comprises conductive particles 7 dispersed in an insulating binder 6. Each conductive particle 7 consists of a styrene resin particle 71 and a thin metal film 72 formed on the surface thereof by gold-plating, etc. Projections 72a are formed on the surface of the thin metal film 72 of the conductive particle 7.

Abstract translation: 能够在形成有氧化膜的细间距的连接电极上保持高连接可靠性的各向异性导电粘合膜。 各向异性导电粘合膜1包括分散在绝缘粘合剂6中的导电粒子7.每个导电粒子7由苯乙烯树脂粒子71和通过镀金等形成在其表面上的薄金属膜72组成。形成突起72a 在导电性粒子7的薄金属膜72的表面上。

公开(公告)号：US20010030019A1

公开(公告)日：2001-10-18

申请号：US09800718

申请日：2001-03-08

Applicant: SONY CHEMICALS CORP.

Inventor： Masao Saitoh

IPC: B32B031/00

CPC classification number: B32B37/144 ,  B32B2305/55 ,  B32B2307/202 ,  B32B2307/54 ,  B32B2307/706 ,  B32B2379/08 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/0221 ,  H05K2201/0233

Abstract: An anisotropically electroconductive connecting material, which is disposed between a connection terminal on a first substrate and a connection terminal on a second substrate and joins the substrates together by thermocompression bonding while maintaining electroconductive connection therebetween, includes electroconductive particles dispersed in an insulating adhesive, wherein the modulus of elasticity of the electroconductive particles at the compression bonding temperature is 200% or less of the modulus of elasticity of the first substrate at the compression bonding temperature.

Abstract translation: 设置在第一基板上的连接端子和第二基板上的连接端子之间的各向异性导电连接材料，并且通过热压接合将基板连接在一起，同时保持其间的导电连接，包括分散在绝缘粘合剂中的导电颗粒，其中， 导电性粒子在压接温度下的弹性模量为第一基材在压接温度下的弹性模量的200％以下。

公开(公告)号：US5502891A

公开(公告)日：1996-04-02

申请号：US270675

申请日：1994-07-05

Applicant: Hideo Mori ,  Hiroshi Takabayashi ,  Masanori Takahashi

Inventor： Hideo Mori ,  Hiroshi Takabayashi ,  Masanori Takahashi

IPC: G02F1/1345 ,  G02F1/13 ,  H01B7/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/34 ,  H01R43/00

CPC classification number: H05K3/323 ,  H01R12/714 ,  H05K3/361 ,  G02F1/13452 ,  H01L2224/293 ,  H05K2201/0233 ,  H05K2201/0394 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49201

Abstract: A method of forming an electrical connection from a drive circuit to an electrical device is provided. An electrical connection structure includes: electrodes formed on a device side, electrodes formed on a flexible film carrier having an electrode pattern connected to a drive circuit; and an anisotropic conductive film having metal particles or metal plated particles dispersed therein, interposed between the electrodes on the device side and the electrodes on the flexible film carrier, for electrically connecting the electrodes facing each other through thermocompression bonding. The electrodes, on the flexible film carrier are exposed by removing the flexible film at an electrical connection area, and the length of each exposed electrode is from 1.5 mm to 2.5 mm.

Abstract translation: 提供了从驱动电路到电气设备形成电连接的方法。 电连接结构包括：在器件侧形成的电极，形成在具有连接到驱动电路的电极图案的柔性膜载体上的电极; 以及介于器件侧的电极和柔性膜载体上的电极之间分散有金属颗粒或金属电镀粒子的各向异性导电膜，用于通过热压接将电极彼此电连接。 柔性膜载体上的电极通过在电连接区域移除柔性膜而暴露，并且每个暴露电极的长度为1.5mm至2.5mm。

公开(公告)号：US5162087A

公开(公告)日：1992-11-10

申请号：US753198

申请日：1991-08-30

Applicant: Hidemoto Fukuzawa ,  Tatsuhiro Imai ,  Yasuhiro Okada ,  Noriyuki Ousaka

Inventor： Hidemoto Fukuzawa ,  Tatsuhiro Imai ,  Yasuhiro Okada ,  Noriyuki Ousaka

IPC: C09J135/00 ,  C08K9/08 ,  C09J1/02 ,  C09J9/02 ,  C09J133/04 ,  C09J133/08 ,  C09J201/00 ,  H01B1/22 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/323 ,  C08K9/08 ,  C09J133/08 ,  H01B1/22 ,  H01L2924/07811 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K3/361

Abstract: An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in thatsaid insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative,5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, andsaid particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.

公开(公告)号：US5155301A

公开(公告)日：1992-10-13

申请号：US567648

申请日：1990-08-15

Applicant: Akira Mase

Inventor： Akira Mase

IPC: H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0108 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/2036 ,  H05K3/361

Abstract: Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.

公开(公告)号：US5123986A

公开(公告)日：1992-06-23

申请号：US602715

申请日：1990-10-24

Applicant: Kazuhiro Sugiyama ,  Yoshinori Atsumi

Inventor： Kazuhiro Sugiyama ,  Yoshinori Atsumi

IPC: G02F1/13 ,  G02F1/1339 ,  G02F1/1345 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  B44C1/165

CPC classification number: H01R4/04 ,  G02F1/1345 ,  H05K3/323 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681 ,  H05K3/361

Abstract: A conductive connecting method for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

Abstract translation: 公开了一种用于电连接具有以小间距布置的多个连接端子的第一和第二电子部件的导电连接方法。 在第一和第二电子部件的多个连接端子之间插入有导电性接合剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电粘合剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时，由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而，平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子的比例增加，相邻的细连接粒子彼此接触，也可以在平面方向上保持绝缘性，而仅在厚度方向上获得传导 。

公开(公告)号：US5001542A

公开(公告)日：1991-03-19

申请号：US443169

申请日：1989-11-30

Applicant: Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

Inventor： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC: H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

Abstract: A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.