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    Imprinted bi-layer micro-structure method with bi-level stamp
    71.
    发明授权
    Imprinted bi-layer micro-structure method with bi-level stamp 有权
    双层印刷双层微结构方法

    公开(公告)号：US09101056B2

    公开(公告)日：2015-08-04

    申请号：US14012240

    申请日：2013-08-28

    Applicant: Eastman Kodak Company

    Inventor： Ronald Steven Cok

    IPC: H01B13/00 ,  H05K1/02 ,  H05K3/46 ,  H05K3/12 ,  H05K3/00 ,  H05K1/09

    CPC classification number: H05K1/0274 ,  H05K1/0298 ,  H05K1/097 ,  H05K3/0041 ,  H05K3/12 ,  H05K3/1258 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/465 ,  H05K3/4685 ,  H05K2201/09209 ,  H05K2201/09281 ,  H05K2201/0979 ,  H05K2201/09845 ,  H05K2203/0108

    Abstract: A method of making an imprinted micro-wire structure includes providing a substrate having an edge area and a central area separate from the edge area and providing a first stamp and a multi-level second stamp. A curable bottom layer and multi-layer are provided on the substrate. A bottom-layer micro-channel is imprinted in the bottom layer. A multi-layer micro-channel and a top-layer micro-channel are imprinted in the multi-layer. Micro-wires are formed in each micro-channel. The bottom-layer micro-wire extends from the central area into the edge area. The multi-layer micro-wire contacts the bottom-layer micro-wire in the edge area. The top-layer micro-wire is over the central area and is separate from the multi-layer micro-wire and the bottom-layer micro-channel. The bottom-layer micro-wire is electrically connected to the multi-layer micro-wire and is electrically isolated from the top-layer micro-wire.

    Abstract translation: 制造压印微线结构的方法包括提供具有与边缘区域分离的边缘区域和中心区域的基板，并提供第一印模和多级第二印模。 在基板上设置有可固化的底层和多层。 底层微通道印在底层中。 多层微通道和顶层微通道印在多层中。 微线形成在每个微通道中。 底层微线从中心区域延伸到边缘区域。 多层微线接触边缘区域的底层微线。 顶层微线在中心区域之上，与多层微线和底层微通道分离。 底层微线电连接到多层微线，并与顶层微线电隔离。

    WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME, AND MANUFACTURING METHOD FOR BOTH
    72.
    发明申请
    WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME, AND MANUFACTURING METHOD FOR BOTH 审中-公开
    使用相同的接线板和发光装置，以及两个制造方法

    公开(公告)号：US20140225152A1

    公开(公告)日：2014-08-14

    申请号：US14257099

    申请日：2014-04-21

    Applicant: Panasonic Corporation

    Inventor： Toshiyuki ASAHI ,  Naoyuki TANI ,  Yoshito KITAGAWA ,  Yuta OKAZAKI

    IPC: H01L33/62 ,  H05K1/02

    CPC classification number: H01L33/62 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/49894 ,  H01L24/97 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/07802 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/0204 ,  H05K1/0296 ,  H05K2201/09209 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2924/01005

    Abstract: A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically connected to the plate wirings. The base has first and second surfaces on which the surface wirings are formed. The surface wirings are thinner than the plate wirings, and the minimum wiring gap between the surface wirings is smaller than the minimum wiring gap between the plate wirings. One of the plate wirings has substantially the same shape as that of a region where the first top-surface wiring on the first surface and the first bottom-surface wiring on the second surface overlap with each other in the normal direction of the first surface. The first top-surface wiring and the first bottom-surface wiring are connected to each other through the above-mentioned one of the plate wirings.

    Abstract translation: 布线基板包括基板，其中由金属板形成的板布线与由树脂或树脂组合物制成的绝缘部分以及与板布线电连接的表面布线一体地形成。 基座具有形成表面布线的第一和第二表面。 表面布线比板布线薄，并且表面布线之间的最小布线间隙小于板布线之间的最小布线间隙。 板状布线中的一个具有与第一表面上的第一顶表面布线和第二表面上的第一底表面布线在第一表面的法线方向上重叠的区域的形状基本相同的形状。 第一顶面布线和第一底面布线通过上述一个板布线彼此连接。

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