公开(公告)号：US20170094800A1

公开(公告)日：2017-03-30

申请号：US15279080

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Antti KERANEN ,  Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H05K3/12 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

公开(公告)号：US09496602B2

公开(公告)日：2016-11-15

申请号：US14263749

申请日：2014-04-28

Applicant: Apple Inc.

Inventor： Darshan R. Kasar

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01Q1/24 ,  H05K3/28 ,  H05K9/00 ,  H01Q1/42

CPC classification number: H01Q1/243 ,  H01Q1/42 ,  H05K1/189 ,  H05K3/284 ,  H05K9/0024 ,  H05K2201/09754 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1476

Abstract: Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure.

Abstract translation: 诸如电气部件和电线以及柔性印刷电路上的迹线的电路可以嵌入注射成型的塑料结构内。 电气部件可以包括集成电路，连接器和系统级封装电路模块。 系统级封装电路模块可以包括安装在基板上并被塑料覆盖的部件。 连接器可以包括用于与电子设备或电池上的相应连接器配合的连接器。 注射成型的塑料结构可以形成外壳。 壳体可以形成电子设备的一部分，接收电子设备的外部壳体或其他结构。 近场通信天线可以嵌入在塑料外壳内。 信号线和塑料纤维可以交织以形成嵌入在塑料外壳或其它注模塑料结构中的网状物。

公开(公告)号：US20150319850A1

公开(公告)日：2015-11-05

申请号：US14269736

申请日：2014-05-05

Applicant: Tim Gruhl

Inventor： Tim Gruhl

IPC: H05K1/02 ,  H05K3/40 ,  B29C67/00 ,  H05K3/46

CPC classification number: H05K1/0284 ,  B29C64/106 ,  B29L2031/3425 ,  H01L21/4846 ,  H05K3/1241 ,  H05K3/4007 ,  H05K3/4084 ,  H05K3/46 ,  H05K3/4611 ,  H05K3/4664 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09754 ,  H05K2201/2009 ,  H05K2203/013

Abstract: In an embodiment, a method includes forming a printed circuit board by depositing a first plurality of layers and forming an interconnect integral to the printed circuit board by depositing a second plurality of layers on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure and a contact positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material.

Abstract translation: 在一个实施例中，一种方法包括通过沉积第一多个层并通过在第一多个层的至少一部分上沉积第二多个层来形成与印刷电路板一体的互连来形成印刷电路板。 互连包括稳定结构和位于稳定结构内的接触。 所述稳定结构包括第一材料，并且所述触点包括不同于所述第一材料的第二材料。

公开(公告)号：US20150313035A1

公开(公告)日：2015-10-29

申请号：US14651159

申请日：2013-10-11

Applicant: ROBERT BOSCH GMBH

Inventor： Markus Kroeckel ,  Richard Gueckel

IPC: H05K7/14

CPC classification number: H05K7/1417 ,  H05K1/117 ,  H05K5/006 ,  H05K5/0069 ,  H05K2201/09063 ,  H05K2201/09754

Abstract: The invention relates to an electronic arrangement having a directly contactable circuit board (2), said electronic arrangement comprising: a circuit board (2) that includes at least one electric contact for electric contacting, a housing (3) inside which the circuit board (2) is arranged, and a plug shroud (33) that is arranged on the housing (3). The circuit board (2) includes a first circuit board half (24) that has a support (4) for supporting the circuit board (4), and a second circuit board half (25). The circuit board (2) is supported on the support (4) in such a way that the support (4) defines a swivel region, in particular a swivel axis of the circuit board (2), about which the circuit board (2) can swivel.

Abstract translation: 本发明涉及一种具有可直接接触的电路板（2）的电子装置，所述电子装置包括：电路板（2），包括至少一个用于电接触的电触点;壳体（3），电路板 2）布置，并且布置在壳体（3）上的塞子罩（33）。 电路板（2）包括具有用于支撑电路板（4）的支撑件（4）和第二电路板半部（25）的第一电路板半部（24）。 电路板（2）支撑在支撑件（4）上，使得支撑件（4）限定了电路板（2）的旋转区域，特别是电路板（2）的旋转轴线， 可以旋转。

公开(公告)号：US20140301032A1

公开(公告)日：2014-10-09

申请号：US14245343

申请日：2014-04-04

Applicant: PNY Technologies, Inc.

Inventor： Robert Stone ,  Joseph Pluchino

IPC: G06F1/18

CPC classification number: G06F1/185 ,  G06K19/07732 ,  H05K3/368 ,  H05K2201/09754 ,  H05K2201/0999

Abstract: A reduced length memory card is provided. The memory card, comprising a memory circuit, a housing for said memory circuit, said housing defining a first end, a second end opposite the first end and insertable into a port of a digital device, and opposing sidewalls between the first end and the second end, and a plurality of electrical contacts in electrical communication with said memory circuit, said contacts exposed through apertures formed in a bottom surface of the housing extending between the first end and the second end, wherein the memory card is electrically compatible with a Secure Digital (SD) standard, and wherein a length of the card extending between the first end and the second end is less than a width of the card extending between the opposing sidewalls. The memory could comprise an extraction ridge along the first end of the card and exposed when the card is inserted into the port of the digital device.

Abstract translation: 提供了缩小的存储卡。 所述存储卡包括存储器电路，用于所述存储器电路的外壳，所述壳体限定第一端，与所述第一端相对的第二端并可插入数字设备的端口中，以及所述第一端和所述第二端之间的相对的侧壁 端部以及与所述存储器电路电连通的多个电触头，所述触点通过形成在壳体的底表面中的孔在第一端和第二端之间暴露，其中存储卡与安全数字 （SD）标准，并且其中在第一端和第二端之间延伸的卡的长度小于在相对侧壁之间延伸的卡的宽度。 存储器可以包括沿着卡的第一端的提取脊，并且当卡被插入数字设备的端口时被暴露。

公开(公告)号：US20140174790A1

公开(公告)日：2014-06-26

申请号：US14191613

申请日：2014-02-27

Applicant: YAZAKI CORPORATION

Inventor： Mamoru SAWAI

IPC: H05K1/02

CPC classification number: H05K1/0213 ,  H05K1/056 ,  H05K3/40 ,  H05K3/4092 ,  H05K3/44 ,  H05K2201/09754 ,  H05K2201/10924 ,  Y10T29/49158 ,  Y10T29/49165

Abstract: A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.

Abstract translation: 布线基板包括具有主面和大致垂直于主面的侧面的布线板; 形成在布线基板的主面上的电路图案; 浸渍板，其布置在所述布线板的中间层中; 并且多个突出端子设置在中间层中并且从侧面向外突出。 突出端子在中间层中彼此电连接。

公开(公告)号：US20130065450A1

公开(公告)日：2013-03-14

申请号：US13365004

申请日：2012-02-02

Applicant: Chun-Nan Su ,  Chun-Ching Peng

Inventor： Chun-Nan Su ,  Chun-Ching Peng

IPC: H01R24/28 ,  H05K3/30

CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

Abstract translation: 本发明公开了一种USB应用设备，包括主体，电路板，多个第一电引脚和多个电元件。 电路板设置在体内。 多个第一电引脚设置在电路板上并消耗到主体，使得多个第一电引脚部分地暴露于主体。 在多个第一电引脚和电路板之间形成空间，使得多个电气元件可以设置在该空间上。 因此，电路板的长度变短，并且USB应用装置的体积减小。

公开(公告)号：US20110101411A1

公开(公告)日：2011-05-05

申请号：US13000042

申请日：2009-06-23

Applicant: Marcus Johannes Gerardus Elzinga

Inventor： Marcus Johannes Gerardus Elzinga

IPC: H01L33/62 ,  F21V21/00

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

Abstract: A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.

Abstract translation: 一种支撑模块（1），包括具有槽孔（5）的导电层（2）和适于接收固态光源（3）的接收表面，所述电接触焊盘（4）与所述通孔 （5）。 支撑模块（1）还包括电绝缘元件（8）和延伸穿过电绝缘元件（8）并且穿过通孔（5）突出的至少一个接触销（9）。 此外，电绝缘元件（8）包括通道（10），允许接触到接触销（9）的端部和由固态光源（3）的表面接收的固态光源（3）的电接触焊盘（4） 导电层（2）。 这样的通道使得可以用焊接工具通过绝缘元件到达接触针和接触垫的端部。 因此，可以通过将接触销焊接到接触焊盘来将固态光源附着在金属表面上。 由于金属表面的散热性优于印刷电路板，因此在金属表面上安装固态照明装置在需要良好散热的应用中是有利的。

公开(公告)号：US07458823B2

公开(公告)日：2008-12-02

申请号：US11408076

申请日：2006-04-21

Applicant: Keiichi Sugimoto ,  Mitsuru Nakagawa

Inventor： Keiichi Sugimoto ,  Mitsuru Nakagawa

IPC: H01R13/504

CPC classification number: B29C45/14065 ,  B29C45/14639 ,  H05K3/284 ,  H05K3/3405 ,  H05K5/0034 ,  H05K5/065 ,  H05K2201/09754 ,  H05K2201/1034 ,  H05K2203/1316

Abstract: A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

Abstract translation: 电子钥匙收发装置的壳体形成为密封电路部件的整体，安装有电路部件的印刷电路板的安装面以及端子的其他部分露出的部分端子。 印刷电路板的与安装面相对的后表面提供了外壳的外表面的一部分。 当通过插入成型工艺将印刷板设置在壳体中时，印刷板被保持在成型模具的空腔中，使得印刷板的后表面紧密接触空腔的内表面。 因此，由于在树脂浇注时或当树脂硬化时引起的压力导致印刷基板的变形被抑制。

公开(公告)号：US07227758B2

公开(公告)日：2007-06-05

申请号：US10624063

申请日：2003-07-21

Applicant: Scott D. Brandenburg ,  Thomas A. Degenkolb

Inventor： Scott D. Brandenburg ,  Thomas A. Degenkolb

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K3/4092 ,  H01R13/6658 ,  H01R31/065 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/184 ,  H05K3/284 ,  H05K2201/086 ,  H05K2201/09163 ,  H05K2201/09754 ,  H05K2201/10924

Abstract: A printed circuit board (PCB) assembly includes a PCB and a first integrated conductive bus structure extending from a first edge of the PCB. The PCB connects a plurality of electronic components and includes a plurality of conductive layers, each separated by a non-conductive layer. The first integrated conductive bus structure includes a first portion that extends from the first edge of the PCB and which forms a plurality of electrically separate contacts of a connector. A second portion of the bus structure is integrated within the PCB and couples each of the contacts to at least one conductive trace of the PCB through plated holes.

Abstract translation: 印刷电路板（PCB）组件包括PCB和从PCB的第一边缘延伸的第一集成导电总线结构。 PCB连接多个电子部件，并且包括多个导电层，每个导体层由非导电层隔开。 第一集成导电总线结构包括从PCB的第一边缘延伸并且形成连接器的多个电分离触点的第一部分。 总线结构的第二部分集成在PCB内，并且通过电镀孔将每个触点耦合到PCB的至少一个导电迹线。