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    Surface mountable polymeric PTC device with integral weld plate
    72.
    发明公开
    Surface mountable polymeric PTC device with integral weld plate 有权
    Oberflächenmontierbares聚合物PTC Bauelement mit integrierten schweissbarenKontaktflächen

    公开(公告)号：EP1577905A2

    公开(公告)日：2005-09-21

    申请号：EP05101981.8

    申请日：2005-03-14

    Applicant: TYCO Electronics Corporation

    Inventor： Chandler, Daniel A. ,  Galla, Matthew P.

    IPC: H01C1/144 ,  H01C7/02

    CPC classification number: H01C1/1406 ,  H01C1/144 ,  H01C7/02 ,  H05K3/328 ,  H05K2201/10492 ,  H05K2201/10643

    Abstract: A surface mount circuit protection device (10) includes a laminar PTC resistive element (12) having first and second major surfaces and a thickness (t) therebetween. A first electrode layer (14) substantially coextensive with the first surface is formed of a first metal material of a type adapted to be soldered to a printed circuit substrate. A second electrode layer (16) formed at the second major surface includes a structure forming or defining a weld plate (18). The metal weld plate (18) has a thermal mass and thickness (t w ) capable of withstanding resistance to micro-spot welding of a strap interconnect without significant resultant damage to the device. The device (10) is preferably surface mounted to a printed circuit board assembly forming a battery protection circuit connected to a battery/cell by battery strap interconnects, wherein one of the battery strap interconnects is micro spot welded to the weld plate of the device.

    Abstract translation: 表面安装电路保护装置（10）包括具有第一和第二主表面的层状PTC电阻元件（12）和它们之间的厚度（t）。 与第一表面基本共同延伸的第一电极层（14）由适于焊接到印刷电路基板的第一金属材料形成。 形成在第二主表面处的第二电极层（16）包括形成或限定焊接板（18）的结构。 金属焊接板（18）的热质量和厚度（t w）能够耐受带状互连的微点焊接，而不会对器件造成显着的损坏。 优选地，所述装置（10）被表面安装到印刷电路板组件，所述印刷电路板组件形成通过电池带互连连接到电池/电池的电池保护电路，其中所述电池带互连件中的一个被微点焊接到所述装置的焊接板。

    Mounting of electronic components on substrates
    73.
    发明公开
    Mounting of electronic components on substrates 失效
    蒙太奇电极Bauteile auf基板。

    公开(公告)号：EP0508305A2

    公开(公告)日：1992-10-14

    申请号：EP92105662.8

    申请日：1992-04-02

    Applicant: MOLEX INCORPORATED

    Inventor： Ponn, Timothy R.

    IPC: H05K3/00

    CPC classification number: H05K1/189 ,  H01R13/719 ,  H05K1/182 ,  H05K3/326 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49153

    Abstract: A method for mounting electronic components, such as capacitor, to a flat flexible insulating substrate (16) having conductive material thereon. In one form of the invention, an electronic component (14) is attached to a given area of the substrate with one conductive side (14b) of the electronic component in electrical connection with the conductive material on the substrate. A slot (20) is formed in the substrate substantially about the electronic component but less than 360° thereabout to define a tongue (22a), including the electronic component, and an integral hinge portion (24) of the substrate. The tongue is bent about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith into a desired position for connection of an opposite conductive side of the electronic component to an appropriate terminal. In another form of the invention, a closed or 360 ° slot (56) is formed in the substrate (50). One conductive (46) side of the electronic component (14) is in electrical connection with the conductive material on the substrate (58) within the closed slot, and the other conductive side (14) of the electronic component is in electrical connection with the conductive material on the substrate outside the closed slot. A terminal (62) is electrically connected to the conductive material on the substrate inside the closed slot.

    Abstract translation: 一种用于将诸如电容器的电子部件安装到其上具有导电材料的扁平柔性绝缘基板（16）上的方法。 在本发明的一种形式中，电子部件（14）被附接到基板的给定区域，其中电子部件的一个导电侧（14b）与基板上的导电材料电连接。 基板上基本上围绕电子部件形成狭槽（20），但在其周围小于360度，以限定包括电子部件的舌部（22a）和基板的整体铰链部分（24）。 舌部围绕整体铰链部分弯曲，以将舌片移出基板的平面，从而将其中的电子部件移动到期望的位置，以将电子部件的相对的导电侧连接到适当的端子。 在本发明的另一种形式中，在衬底（50）中形成一个封闭的或360°的槽（56）。 电子部件（14）的一个导电（46）侧与闭合槽内的基板（58）上的导电材料电连接，并且电子部件的另一导电侧（14）与 封闭槽外的基板上的导电材料。 端子（62）电连接到封闭槽内的基板上的导电材料。

    일체형 용접 플레이트를 갖는 표면 마운트가능한 ＰＰＴＣ장치
    76.
    发明授权
    일체형 용접 플레이트를 갖는 표면 마운트가능한 ＰＰＴＣ장치 有权
    带整体焊接板的表面安装PPTC器件

    公开(公告)号：KR101256658B1

    公开(公告)日：2013-04-19

    申请号：KR1020050020916

    申请日：2005-03-14

    Applicant: 티이 커넥티비티 코포레이션

    Inventor： 챈들러,대니얼에이. ,  갤러,매튜피.

    IPC: H01M2/34 ,  H01M10/48

    CPC classification number: H01C1/1406 ,  H01C1/144 ,  H01C7/02 ,  H05K3/328 ,  H05K2201/10492 ,  H05K2201/10643

    Abstract: 표면 마운트 회로 보호 장치 (10)는 제1 및 제2 주표면 및 이들 사이의 두께를 갖는 층상 PTC 저항 요소(12)를 포함한다. 제1 주표면과 실질적으로 함께 연장되는 제1 전극층은 인쇄 회로 기판에 납땜되기에 적합한 제1 금속 물질로 형성된다. 제2 주표면에 형성된 제2 전극 층은 용접 플레이트(18)을 형성하거나 정의하는 구조를 포함한다. 금속 용접 플레이트는 장치에 대하여 결과적으로 현저한 손상을 일으키지 않고 스트랩 인터커넥트(34)의 저항 마이크로 스팟용접을 견딜 수 있는 열 질량 및 두께를 갖는다. 상기 장치는 바람직하게는 배터리 스트랩 인터커넥트에 의해 배터리/전지에 연결된 배터리 보호 회로를 형성하는 인쇄 회로 기판 어셈블리 (20)에 표면 마운트되며, 이때, 배터리 스트랩 인터커넥트 중 하나가 장치의 용접 플레이트에 마이크로 스팟용접되는 것이 바람직하다.
    스팟 용접, 표면 마운트, 스트랩 인터커넥트

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