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    Electronic control apparatus
    72.
    发明授权
    Electronic control apparatus 有权
    电子控制装置

    公开(公告)号：US08363420B2

    公开(公告)日：2013-01-29

    申请号：US11755074

    申请日：2007-05-30

    Applicant: Tsutomu Tominaga ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

    Inventor： Tsutomu Tominaga ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

    IPC: H01R9/00

    CPC classification number: H05K7/20509 ,  H05K3/308 ,  H05K3/32 ,  H05K3/328 ,  H05K7/20854 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2201/10962

    Abstract: The apparatus includes a housing, a heat sink arranged in the housing, semiconductor switching elements mounted on the heat sink and having terminals, a circuit board arranged in opposition to the heat sink and having an electronic circuit formed thereon including a control circuit for controlling the semiconductor switching elements, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other. The individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, so that they are bonded to the individual terminals.

    Abstract translation: 该装置包括壳体，布置在壳体中的散热器，安装在散热器上并具有端子的半导体开关元件，布置成与散热器相对的电路板，并且具有形成在其上的电子电路，包括控制电路， 半导体开关元件和将电路板和半导体开关元件彼此电连接的多个导电板。 各个导电板沿着半导体开关元件的各个端子引出的引出方向布置，从而它们被结合到各个端子。

    Protective structure for a circuit board and method for fabricating the same
    73.
    发明授权
    Protective structure for a circuit board and method for fabricating the same 失效
    电路板的保护结构及其制造方法

    公开(公告)号：US08101873B2

    公开(公告)日：2012-01-24

    申请号：US12406710

    申请日：2009-03-18

    Applicant: Keiichiro Bungo

    Inventor： Keiichiro Bungo

    IPC: H01L23/28

    CPC classification number: H05K3/284 ,  H05K5/064 ,  H05K2201/105 ,  H05K2203/1316 ,  Y10T29/49826

    Abstract: In a protective structure for a circuit board (1) that includes a casing (3) for receiving the circuit board, the casing is provided with a recess (11) for receiving a large component part protruding from the circuit board therein, and potting material (6) is filled in a space defined between the large component part and a surrounding wall of the recess. Typically, the potting material is filled in a gap between the large component part and the surrounding wall of the recess without substantially extending out of the recess. Because the large component part is not only supported by the circuit board but also by the casing via the cured potting material, the stress acting on a connection part that connects the large component part to the circuit board is minimized, and this enhances the mechanical integrity of the circuit board assembly. Because the use of the potting material is limited to the recess, the required amount of the potting material can be minimized, and this means a lower material cost and a reduced weight. Reducing the amount of the potting material means a shorter period of time required for curing it, and this improves the production efficiency of the circuit board assembly. If the protection of the component parts from intrusion of moisture is desired, protective coating may be additionally applied to the circuit board.

    Abstract translation: 在包括用于接收电路板的壳体（3）的电路板（1）的保护结构中，壳体设置有用于容纳从其中的电路板突出的大部件的凹部（11），以及灌封材料 （6）填充在大部件与凹部的周围壁之间的空间中。 通常，灌封材料填充在大部件和凹部的周围壁之间的间隙中，而基本上不延伸出凹部。 由于大部件不仅由电路板支撑，而且通过固化灌封材料由壳体支撑，所以作用在连接大部件与电路板的连接部分上的应力最小化，从而提高机械完整性 的电路板组件。 因为灌封材料的使用被限制在凹槽中，所以灌封材料的所需量可以最小化，这意味着较低的材料成本和减轻的重量。 减少灌封材料的量意味着固化所需的较短时间，这提高了电路板组件的生产效率。 如果需要保护组件免受潮湿侵入，则可以向电路板额外施加保护涂层。

    Remanufacture of electronic assemblies
    74.
    发明授权
    Remanufacture of electronic assemblies 有权
    电子组件再制造

    公开(公告)号：US08096033B2

    公开(公告)日：2012-01-17

    申请号：US11935211

    申请日：2007-11-05

    Applicant: Paul C Gottshall ,  Ulises Ramirez Wleschuver

    Inventor： Paul C Gottshall ,  Ulises Ramirez Wleschuver

    IPC: B23P19/04 ,  B23P6/00

    CPC classification number: H05K5/0047 ,  H05K3/225 ,  H05K3/306 ,  H05K2201/105 ,  H05K2203/162 ,  H05K2203/176 ,  Y10T29/49005 ,  Y10T29/49169 ,  Y10T29/49721 ,  Y10T29/4973 ,  Y10T29/5313 ,  Y10T29/53274

    Abstract: A method for remanufacturing an electronic assembly allows the assembly to be disassembled, tested and reassembled despite certain components being permanently affixed to a housing of the assembly. The electronic assembly includes a circuit assembly within the housing. During remanufacture, a first portion of the housing is removed to expose a first side of the circuit assembly and a second portion of the housing is removed to expose a second side of the circuit assembly. When removing the second portion of the housing, one of the components of the circuit assembly may also be removed. During remanufacture a connector assembly including a replacement component substantially similar to the removed component, and including one or more pins connected to the replacement component and situated to mate with one or more empty sockets of the circuit assembly is used to facilitate testing of the assembly.

    Abstract translation: 一种用于再制造电子组件的方法允许组装被拆卸，测试和重新组装，尽管某些组件被永久地固定到组件的壳体上。 电子组件包括壳体内的电路组件。 在再制造期间，除去壳体的第一部分以露出电路组件的第一侧，并移除壳体的第二部分以露出电路组件的第二侧。 当移除壳体的第二部分时，电路组件的一个部件也可以被移除。 在再制造期间，连接器组件包括基本上类似于去除的部件的替换部件，并且包括连接到替换部件并且被定位成与电路组件的一个或多个空插座配合的一个或多个销，以便于组件的测试。

    Fluid pressure control device
    75.
    发明申请
    Fluid pressure control device 审中-公开
    流体压力控制装置

    公开(公告)号：US20080121292A1

    公开(公告)日：2008-05-29

    申请号：US11984602

    申请日：2007-11-20

    Applicant: Matsuhisa Tsuruta

    Inventor： Matsuhisa Tsuruta

    IPC: E03B11/00

    CPC classification number: B60T8/3675 ,  B60T17/04 ,  B60T17/22 ,  H05K3/306 ,  H05K7/1417 ,  H05K2201/1003 ,  H05K2201/10424 ,  H05K2201/105 ,  H05K2203/167 ,  Y10T137/86228

    Abstract: A fluid pressure control device has a configuration in which board-holding units and of a resin case are inserted and fitted to mounting holes of a board to fix the board. The board-holding units have a connector side board-holding unit provided at a position on a connector housing side with respect to a connection portion, and a solenoid side board-holding unit provided at a position on a solenoid housing side with respect to the connection portion.

    Abstract translation: 流体压力控制装置具有将板保持单元和树脂壳体插入并安装到板的安装孔以固定板的构造。 板保持单元具有连接器侧板保持单元，其设置在相对于连接部分的连接器壳体侧的位置处，以及螺线管侧板保持单元，设置在螺线管壳体侧的相对于 连接部分。

    Hall IC type current sensor of vehicle-mounted power converter
    76.
    发明授权
    Hall IC type current sensor of vehicle-mounted power converter 有权
    霍尔IC型车载电源转换器电流传感器

    公开(公告)号：US07323860B2

    公开(公告)日：2008-01-29

    申请号：US11623524

    申请日：2007-01-16

    Applicant: Naohito Kaneda

    Inventor： Naohito Kaneda

    IPC: G01R33/02

    CPC classification number: G01R15/202 ,  H05K1/18 ,  H05K2201/10151 ,  H05K2201/10363 ,  H05K2201/105

    Abstract: In a Hall IC type current sensor of a vehicle-mounted power converter which includes a bus bar which supplies electricity to a vehicle-mounted power converter, a Hall IC which detects a current supplied to the bus bar, and a control board on which a control circuit which controls the vehicle-mounted power converter in response to an output of the Hall IC is mounted, the current sensor further includes a Hall IC holder which holds the Hall IC and is also fixed to the bus bar, and a through hole which is formed in the control board and which allows a lead terminal of the Hall IC to pass therethrough, and the lead terminal which passes through the through hole is connected with the control circuit by solder bonding.

    Abstract translation: 在车载电力转换器的霍尔IC型电流传感器中，其包括向车载电力转换器供电的母线，检测供给母线的电流的霍尔IC，以及控制板， 安装响应于霍尔IC的输出来控制车载电力转换器的控制电路，电流传感器还包括保持霍尔IC并固定到汇流条的霍尔IC保持器，以及通孔， 形成在控制板上，并且允许霍尔IC的引线端子通过，并且通过通孔的引线端子通过焊接连接与控制电路连接。

    HALL IC TYPE CURRENT SENSOR OF VEHICLE-MOUNTED POWER CONVERTER
    77.
    发明申请
    HALL IC TYPE CURRENT SENSOR OF VEHICLE-MOUNTED POWER CONVERTER 有权
    霍尔IC型电流传感器车辆安装电源转换器

    公开(公告)号：US20070120552A1

    公开(公告)日：2007-05-31

    申请号：US11623524

    申请日：2007-01-16

    Applicant: Naohito KANEDA

    Inventor： Naohito KANEDA

    IPC: G01R15/18

    CPC classification number: G01R15/202 ,  H05K1/18 ,  H05K2201/10151 ,  H05K2201/10363 ,  H05K2201/105

    Abstract: In a Hall IC type current sensor of a vehicle-mounted power converter which includes a bus bar which supplies electricity to a vehicle-mounted power converter, a Hall IC which detects a current supplied to the bus bar, and a control board on which a control circuit which controls the vehicle-mounted power converter in response to an output of the Hall IC is mounted, the current sensor further includes a Hall IC holder which holds the Hall IC and is also fixed to the bus bar, and a through hole which is formed in the control board and which allows a lead terminal of the Hall IC to pass therethrough, and the lead terminal which passes through the through hole is connected with the control circuit by solder bonding.

    Abstract translation: 在车载电力转换器的霍尔IC型电流传感器中，其包括向车载电力转换器供电的母线，检测供给母线的电流的霍尔IC，以及控制板， 安装响应于霍尔IC的输出来控制车载电力转换器的控制电路，电流传感器还包括保持霍尔IC并固定到汇流条的霍尔IC保持器，以及通孔， 形成在控制板上，并且允许霍尔IC的引线端子通过，并且通过通孔的引线端子通过焊接连接与控制电路连接。

    Bushing for use between a control knob and a housing
    78.
    发明授权
    Bushing for use between a control knob and a housing 失效
    套管用于控制旋钮和外壳之间

    公开(公告)号：US4495547A

    公开(公告)日：1985-01-22

    申请号：US365917

    申请日：1982-04-06

    Applicant: Paul H. Stoverock

    Inventor： Paul H. Stoverock

    IPC: H01C10/14 ,  H01H3/08 ,  H05K1/18 ,  H01F15/02

    CPC classification number: H05K1/18 ,  H01C10/14 ,  H01H3/08 ,  H05K2201/10022 ,  H05K2201/10196 ,  H05K2201/105 ,  Y10T74/20762

    Abstract: A bushing is disclosed for protecting a printed circuit board mounted potentiometer or the like from transverse and axial loads which are applied to the potentiometer during adjustment thereof. The potentiometer or other control device has a control shaft which protrudes through a panel opening and which has a knob mounted on the distal end thereof. The bushing fits over the control shaft between the panel and the knob such that axial and radial forces applied to the knob are transmitted to the panel by the bushing. These forces are therefore absorbed by the panel rather than the attachments between the printed circuit board and the potentiometer.

    Abstract translation: 公开了一种用于保护印刷电路板安装的电位器等的横向和轴向载荷的衬套，该横向和轴向负载在其调节期间施加到电位器。 电位器或其他控制装置具有通过面板开口突出并具有安装在其远端上的旋钮的控制轴。 套管装配在面板和旋钮之间的控制轴上，使得施加到旋钮的轴向和径向力通过衬套传递到面板。 因此，这些力被面板吸收，而不是印刷电路板和电位计之间的附件。

    ELECTRONIC DEVICE
    79.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230189480A1

    公开(公告)日：2023-06-15

    申请号：US17925933

    申请日：2021-05-14

    Applicant: FANUC CORPORATION

    Inventor： Wataru KUROKI ,  Shinichi HORIKOSHI

    IPC: H05K7/20 ,  H05K1/18 ,  H05K1/02

    CPC classification number: H05K7/2039 ,  H05K1/18 ,  H05K1/0203 ,  H05K2201/105

    Abstract: In an electronic device, a stay is fixed to a surface of a heatsink on the side of a substrate or to a side surface of the heatsink, and is also fixed to the substrate. A contact portion of the stay which is in contact with the heatsink is in contact with the heatsink by mating therewith. The electron device is further provided with a fastening member for fixing the contact potion to the heatsink in detachable manner.

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