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    EUTECTIC BONDING WITH ALGe
    81.
    发明申请
    EUTECTIC BONDING WITH ALGe 审中-公开

    公开(公告)号：US20200048078A1

    公开(公告)日：2020-02-13

    申请号：US16655127

    申请日：2019-10-16

    Applicant: Kionix, Inc.

    Inventor： Martin Heller ,  Toma Fujita

    IPC: B81C1/00 ,  B32B15/04 ,  B32B15/20 ,  H01L23/02 ,  B81B7/00

    Abstract: A MEMS device formed in a first semiconductor substrate is sealed using a second semiconductor substrate. To achieve this, an Aluminum Germanium structure is formed above the first substrate, and a polysilicon layer is formed above the second substrate. The first substrate is covered with the second substrate so as to cause the polysilicon layer to contact the Aluminum Germanium structure. Thereafter, eutectic bonding is performed between the first and second substrates so as to cause the Aluminum Germanium structure to melt and form an AlGeSi sealant thereby to seal the MEMS device. Optionally, the Germanium Aluminum structure includes, in part, a layer of Germanium overlaying a layer of Aluminum.

    Phase-based Measurement and control of a Gyroscope
    82.
    发明申请
    Phase-based Measurement and control of a Gyroscope 审中-公开
    陀螺仪的相位测量和控制

    公开(公告)号：US20160334213A1

    公开(公告)日：2016-11-17

    申请号：US14710991

    申请日：2015-05-13

    Applicant: Kionix, Inc

    Inventor： Jonah DeWall

    IPC: G01C19/5684

    CPC classification number: G01C19/5684 ,  G01C19/5712 ,  G01C19/5776

    Abstract: A gyroscope includes a resonator, a transducer, and a comparator. The comparator is designed to receive an input signal from the transducer and compare the input signal with a reference signal to produce an output signal. Rising and falling edge transitions of the output signal are substantially synchronized with a motion of the resonator along a sense-axis of the transducer.

    Abstract translation: 陀螺仪包括谐振器，换能器和比较器。 比较器被设计为从换能器接收输入信号并将输入信号与参考信号进行比较以产生输出信号。 输出信号的上升沿和下降沿跃迁基本上与谐振器沿换能器的感测轴的运动同步。

    Systems and Methods for Calibrating an Accelerometer
    83.
    发明申请
    Systems and Methods for Calibrating an Accelerometer 审中-公开
    用于校准加速度计的系统和方法

    公开(公告)号：US20140278191A1

    公开(公告)日：2014-09-18

    申请号：US13834310

    申请日：2013-03-15

    Applicant: KIONIX, INC.

    Inventor： Erik ANDERSON

    IPC: G01P21/00

    CPC classification number: G01P21/00

    Abstract: A method for calibrating an accelerometer of an electronic device to reduce an error of the accelerometer includes estimating a gravity vector using the accelerometer and a magnetic field vector using a magnetometer at a plurality of times. The method also includes calculating a characteristic that is a function of an angle between the estimated gravity vector and the estimated magnetic field at each of the plurality of times. Additionally, the method includes calculating a figure of merit over the plurality of times that is a function of the characteristic. The method includes dynamically adjusting a calibration parameter of the accelerometer during ordinary use of the electronic device such that the figure of merit is minimized. Adjusting the calibration parameter reduces the error of the accelerometer. A system can include a accelerometer, a magnetometer, a processor, and a memory having instructions to execute the calibration method on the processor.

    Abstract translation: 用于校准电子设备的加速度计以减少加速度计的误差的方法包括使用加速度计估计重力矢量和使用磁力计多次的磁场矢量。 该方法还包括在多次中计算作为估计重力矢量与估计磁场之间的角度的函数的特性。 另外，该方法包括计算作为特征的函数的多次的品质因数。 该方法包括在电子设备的普通使用期间动态调整加速度计的校准参数，使得品质因数最小化。 调整校准参数会降低加速度计的误差。 系统可以包括加速度计，磁力计，处理器和具有在处理器上执行校准方法的指令的存储器。

    Methods of fabricating microelectromechanical and microfluidic devices
    84.
    发明申请
    Methods of fabricating microelectromechanical and microfluidic devices 有权

    公开(公告)号：US20020113034A1

    公开(公告)日：2002-08-22

    申请号：US10004463

    申请日：2001-11-02

    Applicant: Kionix, Inc.

    Inventor： James E. Moon ,  Timothy J. Davis ,  Gregory J. Galvin ,  Kevin A. Shaw ,  Paul C. Waldrop ,  Sharlene A. Wilson

    IPC: C23F001/00

    CPC classification number: B05B5/00 ,  H01J49/0018 ,  H01J49/167 ,  Y10S438/942

    Abstract: Three fundamental and three derived aspects of the present invention are disclosed. The three fundamental aspects each disclose a process sequence that may be integrated in a full process. The first aspect, designated as nulllatent maskingnull, defines a mask in a persistent material like silicon oxide that is held abeyant after definition while intervening processing operations are performed. The latent oxide pattern is then used to mask an etch. The second aspect, designated as nullsimultaneous multi-level etching (SMILE)null, provides a process sequence wherein a first pattern may be given an advanced start relative to a second pattern in etching into an underlying material, such that the first pattern may be etched deeper, shallower, or to the same depth as the second pattern. The third aspect, designated as nulldelayed LOCOSnull, provides a means of defining a contact hole pattern at one stage of a process, then using the defined pattern at a later stage to open the contact holes. The fourth aspect provides a process sequence that incorporates all three fundamental aspects to fabricate an integrated liquid chromatography (LC)/electrospray ionization (ESI) device. The fifth aspect provides a process sequence that incorporates two of the fundamental aspects to fabricate an ESI device. The sixth aspect provides a process sequence that incorporates two of the fundamental aspects to fabricate an LC device. The process improvements described provide increased manufacturing yield and design latitude in comparison to previously disclosed methods of fabrication.

    ELECTRICAL CONNECTION TO A MICRO ELECTRO-MECHANICAL SYSTEM
    86.
    发明申请
    ELECTRICAL CONNECTION TO A MICRO ELECTRO-MECHANICAL SYSTEM 审中-公开

    公开(公告)号：US20200216310A1

    公开(公告)日：2020-07-09

    申请号：US16243671

    申请日：2019-01-09

    Applicant: Kionix, Inc.

    Inventor： Andrew Hocking ,  Sangtae Park ,  Scott Miller

    IPC: B81C1/00 ,  B81B7/00 ,  H01L21/768

    Abstract: A MEMS device includes, in part, first and second conductive semiconductor substrates, an insulating material disposed between the semiconductor substrates, a cavity formed in the second semiconductor substrate, and at least first and second drive masses each of which includes a multitude of beams etched from the first semiconductor substrate and is adapted to move in the cavity in response to an applied force. At least a first portion of the first substrate is adapted to move in response to the applied force and causes the at least first and second drive mass to be in electrical communication with the first substrate. The device may further include, in part, a coupling spring disposed between and in electrical communication with the first and second drive masses. The coupling spring is adapted to provide electrical communication between a second portion of the first substrate and the first and second drive masses.

    COMPOSITE SPRING FOR ROBUST PIEZOELECTRIC SENSING
    87.
    发明申请
    COMPOSITE SPRING FOR ROBUST PIEZOELECTRIC SENSING 审中-公开

    公开(公告)号：US20190322522A1

    公开(公告)日：2019-10-24

    申请号：US16392224

    申请日：2019-04-23

    Applicant: Kionix, Inc.

    Inventor： Andrew Hocking ,  Martin Heller ,  Wenting Gu

    IPC: B81B3/00 ,  H01L41/113 ,  H01L41/187 ,  B81C1/00

    Abstract: A micro-electromechanical system (MEMS) device comprises a fixed portion and a proofmass suspended by at least one composite beam. The composite beam is cantilevered relative to the fixed portion and extends between a first end that is integrally formed with the fixed portion and a second distal end. The composite beam comprises an insulator having a top surface and at least two side surfaces; a conductor extending away from the fixed portion and surrounding at least a portion of the insulator; and a second conductor positioned adjacent to the top surface of the conductor and extending parallel with the insulator away from the fixed portion. The second conductor is separated from the first conductor to provide a low parasitic conductance of the composite beam.

    Capacitance-based pressure sensor including pressure vessel(s)
    88.
    发明授权
    Capacitance-based pressure sensor including pressure vessel(s) 有权
    电容式压力传感器，包括压力容器

    公开(公告)号：US09347846B2

    公开(公告)日：2016-05-24

    申请号：US14224535

    申请日：2014-03-25

    Applicant: Kionix, Inc.

    Inventor： Scott G. Adams

    IPC: G01L9/00 ,  H01G5/40 ,  H01G13/00 ,  G01L13/02

    CPC classification number: G01L9/0073 ,  G01L9/0086 ,  G01L9/0095 ,  G01L13/021 ,  G01L13/028 ,  H01G5/40 ,  H01G13/00 ,  Y10T29/43

    Abstract: Techniques are described herein that perform capacitance-based pressure sensing using pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. The void has a shape that is configured to change based on a change of pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel. The pressure vessel may be formed in the shape of an enclosed loop (e.g., along a path that is perpendicular to the cross section), resulting in a looped pressure vessel. For instance, an end of the pressure vessel may be connected to another end of the pressure vessel to form the enclosed loop.

    Abstract translation: 本文描述了使用压力容器进行基于电容的压力感测的技术。 压力容器是具有限定空隙的横截面的物体。 该空隙具有基于空腔中的空腔压力的变化而变化的形状，其中压力容器的至少一部分悬浮在其中并且压力容器内的容器压力。 压力容器可以形成为封闭环的形状（例如，沿着垂直于横截面的路径），导致环形压力容器。 例如，压力容器的一端可以连接到压力容器的另一端以形成封闭环。

    PRESSURE SENSOR INCLUDING DEFORMABLE PRESSURE VESSEL(S)
    89.
    发明申请
    PRESSURE SENSOR INCLUDING DEFORMABLE PRESSURE VESSEL(S) 有权
    压力传感器，包括可变压力容器（S）

    公开(公告)号：US20160061679A1

    公开(公告)日：2016-03-03

    申请号：US14474059

    申请日：2014-08-29

    Applicant: Kionix, Inc.

    Inventor： Scott G. Adams ,  Charles W. Blackmer ,  Kristin J. Lynch

    IPC: G01L9/00

    CPC classification number: G01L9/003 ,  B81B3/0072 ,  B81B2201/0264 ,  B81C1/00 ,  B81C1/00666 ,  B81C2201/0167 ,  G01L9/0027 ,  G01L9/0055 ,  G01L9/0073 ,  G01L9/008 ,  G01L9/0082 ,  G01L13/00 ,  G01L13/02 ,  G01P15/006 ,  G01P15/08 ,  H01L21/00

    Abstract: Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.

    Abstract translation: 本文描述了使用包括可变形压力容器的压力传感器进行压力感测的技术。 压力容器是具有限定空隙的横截面的物体。 可变形压力容器是具有至少一个弯曲部分的压力容器，该弯曲部分构造成基于空腔中的腔体压力之间的压力差而在结构上变形（例如弯曲，剪切，细长等），其中至少一个 压力容器的一部分被悬浮并且在压力容器中存在容器压力。

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