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公开(公告)号：KR101322328B1
公开(公告)日：2013-10-28
申请号：KR1020110047891
申请日：2011-05-20
Applicant: 전자부품연구원
Abstract: 본 발명은 배향성을 갖는 열전도성 쉬트의 제조 장치 및 방법에 관한 것으로서, 본 발명에 따른 열전도성 쉬트의 제조 장치는 용매, 레진 및 절연성과 고열전도성 특성을 지닌 분말을 포함하여 컴포지트를 형성하는 전처리 개질부, 형성된 컴포지트를 캐리어 필름(Carrierfilm)이나 치구를 통하여 쉬트 형태로 성형하는 성형부, 그리고 쉬트 형태로 성형된 컴포지트에 배향성을 부여하기 위해 전기장 혹은 자기장을 인가하는 구조제어부를 포함하는 것을 특징으로 한다.
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公开(公告)号：KR101233668B1
公开(公告)日：2013-02-15
申请号：KR1020100133355
申请日：2010-12-23
Applicant: 전자부품연구원
Abstract: 반도체 패키지 기판용 수지조성물이 개시된다. 본 발명의 일 실시예에 따른 반도체 패키지 기판용 수지조성물은 하기 화학식 1로 표시되는 반복단위를 가지는 노볼락형 시아네이트 수지; 및 하기 화학식 2로 표시되는 반복단위를 가지는 플루오렌 골격의 에폭시 수지를 포함한다.
[화학식 1]
[화학식 2]-
公开(公告)号：KR1020120129556A
公开(公告)日：2012-11-28
申请号：KR1020110047891
申请日：2011-05-20
Applicant: 전자부품연구원
CPC classification number: B29C71/0072 , B29C71/0081 , B29D7/01 , B29K2995/0013 , B29L2007/00
Abstract: PURPOSE: An apparatus and a method for manufacturing heat conductive sheets with orientation property are provided to manufacture a high-radiant insulation sheet by applying conductive property to composite. CONSTITUTION: An apparatus for manufacturing heat conductive sheets with orientation property comprises a pre-treating and reforming unit(110), a molding unit(120), and a structure control unit(130). The pre-treating and reforming unit forms composite by using powder having heat insulation and high thermal conductive characteristics. The molding unit forms the composite into sheet shape. The structure control unit supplies electric field or magnetic field. [Reference numerals] (110) Pre-treating and reforming unit; (120) Molding unit; (130) Structure control unit; (140) Product unit; (AA) Base material; (BB) Raw material
Abstract translation: 目的：提供一种制造具有取向性的导热片的装置和方法，以通过将复合材料的导电性赋予高辐射绝缘片。 构成：用于制造具有取向性的导热片的装置包括预处理和重整单元（110），模制单元（120）和结构控制单元（130）。 预处理和重整单元通过使用具有隔热和高导热特性的粉末形成复合材料。 成型单元将复合材料形成为片状。 结构控制单元提供电场或磁场。 （附图标记）（110）预处理和重整单元; （120）成型单元; （130）结构控制单元; （140）产品单位; （AA）基材; （BB）原料
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公开(公告)号：KR101205837B1
公开(公告)日：2012-11-28
申请号：KR1020110046597
申请日：2011-05-18
Applicant: 전자부품연구원
Abstract: PURPOSE: An interlayer connection structure forming method of a multilayer non-sintering ceramic substrate is provided to manufacture a package module or an electronic component of multi structure using a non-sintering substrate by securing forming technology of an interlayer connection via, a via material, and a protective layer film material for interlayer connection. CONSTITUTION: A hardness substrate is prepared(S100). A first dielectric layer is formed by using an ink-jet printing method on the hardness substrate(S110). A first conductive via paste performs filling, drying, and hardening so that one or more vias are formed on the first dielectric layer(S120). A first conductive wire is formed by using conductive ink(S130). A second dielectric layer is formed by using an ink-jet printing method(S140). The first conductive via paste performs the filling, the drying, and the hardening so that one or more vias are formed on the second dielectric layer(S150). A second conductive wire is formed by using the conductive ink on the second dielectric layer. A protective layer bonding film is adhered to a top unit of a plurality of dielectric layers on the hardness substrate(S160). [Reference numerals] (AA) Start; (BB) Finish; (S100) A hardness substrate is prepared; (S110) A first dielectric layer is formed; (S120) A via is formed on the first dielectric layer; (S130) A conductive wire is formed on a first dielectric; (S140) A second dielectric layer is formed on the first dielectric layer; (S150) The via is formed on the second dielectric layer; (S160) A bonding film is attached to the top of the dielectric layers; (S170) The via is formed by filling, hardening, and drying via paste after forming the via on the bonding film; (S180) An electrode is formed on the bonding film with an inkjet print method
Abstract translation: 目的：提供一种多层非烧结陶瓷基板的层间连接结构形成方法，通过确保层间连接通孔的形成技术，通孔材料，制造使用非烧结基板的封装模块或多结构的电子部件， 以及用于层间连接的保护层膜材料。 构成：制备硬度基材（S100）。 通过在硬度基板上使用喷墨印刷法形成第一介电层（S110）。 第一导电通孔糊进行填充，干燥和硬化，使得在第一介电层上形成一个或多个通孔（S120）。 通过使用导电油墨形成第一导线（S130）。 通过使用喷墨打印方法形成第二介电层（S140）。 第一导电通孔糊进行填充，干燥和硬化，使得在第二介电层上形成一个或多个通孔（S150）。 通过在第二电介质层上使用导电油墨形成第二导线。 将保护层接合膜粘附到硬质基板上的多个电介质层的顶部单元（S160）。 （附图标记）（AA）开始; （BB）完成; （S100）制备硬度基板; （S110）形成第一电介质层; （S120）在第一电介质层上形成通孔; （S130）在第一电介质上形成导线; （S140）在第一电介质层上形成第二电介质层; （S150）通孔形成在第二电介质层上; （S160）在电介质层的顶部附着接合膜; （S170）通过在接合膜上形成通孔后，通过糊料进行填充，硬化和干燥而形成通孔; （S180）利用喷墨印刷法在接合膜上形成电极
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公开(公告)号：KR1020120021017A
公开(公告)日：2012-03-08
申请号：KR1020100085029
申请日：2010-08-31
Applicant: 전자부품연구원
IPC: C08G63/685 , C08G63/185 , C08L67/00 , C08J5/18
Abstract: PURPOSE: A polyester resin for semiconductor package substrate is provided to have low anisotropy, high solubility to polar organic solvent, and excellent thermal resistance. CONSTITUTION: A polyester resin comprises 20-50 mol% of -O-Ar1-CO- structure, 40-25 mol% of -OC-Ar2-CO-structure, and 40-25 mol% of -HN-Ar3-NH- structure. Ar1 is 2,6-naphthalene or 4,4'-biphenylene, Ar2 is in chemical formula 1, and Ar3 is one of chemical formula 1-3. A film for semiconductor package substrate is obtained by spreading the polyester resin on a supporting substrate.
Abstract translation: 目的：提供一种半导体封装基板用聚酯树脂，其各向异性低，对极性有机溶剂的溶解性高，耐热性优异。 构成：聚酯树脂包含20-50mol％的-O-Ar1-CO-结构，40-25mol％的-OC-Ar2-CO-结构和40-25mol％的-HN-Ar3-NH- 结构体。 Ar 1是2,6-萘或4,4'-亚联苯，Ar 2在化学式1中，Ar 3是化学式1-3之一。 通过将聚酯树脂铺展在支撑基材上，获得半导体封装基板用薄膜。
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Patent Agency Ranking
公开(公告)号：KR101088632B1
公开(公告)日：2011-12-01
申请号：KR1020090046291
申请日：2009-05-27
Applicant: 전자부품연구원
Abstract: 본 발명은 비아 페이스트 조성물에 관한 것으로, 본 발명에 따른 열전도성 재료 및 열경화성 수지로 이루어지는 비아 페이스트 조성물은, 상기 열전도성 재료로서, 평균 입자 직경이 100~300nm 범위인 은 분말과, 평균 입자 직경이 3~10㎛ 범위인 은(Ag) 코팅된 구리(Cu) 분말을 포함하고, 상기 열경화성 수지로서 에폭시 수지를 포함한다.
상기 에폭시 수지는 페놀 노볼락류 에폭시 또는 크레졸 노볼락류 에폭시 중 어느 하나를 포함하며, 상기 열전도성 재료의 함유량은 상기 비아 페이스트 조성물의 총중량의 70 내지 95중량%인 것이 바람직하다.
비아, 페이스트, 조성물, 은, 경화, 저온, 하이브리드-
公开(公告)号：KR101088631B1
公开(公告)日：2011-12-01
申请号：KR1020090046286
申请日：2009-05-27
Applicant: 전자부품연구원
Abstract: 본 발명은 도전성의 비아 페이스트 조성물에 관한 것으로, 본 발명에 따른 비아 페이스트 조성물은, 도전성 재료 및 열경화성 수지를 포함하고, 상기 도전성 재료는, 단일 또는 그 이상의 입자 분포를 가지는 은(Ag) 분말, 은(Ag) 코팅된 구리(Cu) 분말, 및 은 나노 입자 분산 용액을 포함하고, 상기 열경화성 수지는 에폭시 수지를 포함한다.
비아, 페이스트, 은, DMF, 경화, 저온, 하이브리드-
公开(公告)号：KR1020110011197A
公开(公告)日：2011-02-08
申请号：KR1020090068732
申请日：2009-07-28
Applicant: 전자부품연구원
IPC: H01B1/20 , H01L21/027
CPC classification number: H01C17/065 , G03F7/70216 , H01B1/20 , H01C10/305 , H01C17/06586 , H01C17/075
Abstract: PURPOSE: A paste composition for a polymer thick film resistor is provided to control the resin kinds and contents of a photosensitive polymer thick film resistor capable of the formation of minute fine patterns and to avoid unnecessary components without use of commercial photo solder resist resin. CONSTITUTION: A paste composition for a polymer thick film resistor comprises 30-85 weight% of acrylate oligomer, 7-25 weight% of acrylate monomer, 2-12 weight% of photoinitiator, 0.5-3 weight% of photo-sensitizer, 2-6 weight% of thermal initiator, 3-15 weight% of conductive filler, and 0.5-6 weight% dispersing agent. A method for manufacturing a thick film resistor comprises the steps of: preparing a first substrate(100) on which a conductive pattern(102) is formed; applying the paste on the first substrate to cover the conductive pattern; and drying, exposing, developing and curing the paste.
Abstract translation: 目的：提供一种用于聚合物厚膜电阻器的糊剂组合物，以控制能够形成微细精细图案的光敏聚合物厚膜电阻器的树脂种类和含量，并且避免不需要使用商业光阻焊树脂的部件。 构成：用于聚合物厚膜电阻器的糊剂组合物包含30-85重量％的丙烯酸酯低聚物，7-25重量％的丙烯酸酯单体，2-12重量％的光引发剂，0.5-3重量％的光敏剂，2- 6重量％的热引发剂，3-15重量％的导电填料和0.5-6重量％的分散剂。 一种制造厚膜电阻器的方法包括以下步骤：制备在其上形成导电图案（102）的第一衬底（100）; 将所述糊剂涂覆在所述第一基底上以覆盖所述导电图案; 并干燥，曝光，显影和固化糊状物。
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公开(公告)号：KR1020100012341A
公开(公告)日：2010-02-08
申请号：KR1020080073682
申请日：2008-07-28
Applicant: 전자부품연구원
IPC: H01C7/00
Abstract: PURPOSE: A curable paste for a thick film resistor is provide to improve solder heat resistance and a TCR(Temperature Coefficient of Resistance) of the thick film resistor including an inorganic additive. CONSTITUTION: A thick film resistor includes a substrate(100), a curable paste, and a protective film(130). The curable paste is coated on the substrate. The curable paste includes a curable resin, a conductive filler, and an inorganic additive. The inorganic additive of 10 to 50 wt% is added to the conductive filler of 100 w% and improves the solder heat-resistance and TCR and is one of SiO2, NiCr, and Si.
Abstract translation: 目的：提供一种用于厚膜电阻器的可固化糊料，以提高包括无机添加剂的厚膜电阻器的焊料耐热性和TCR（电阻温度系数）。 构成：厚膜电阻器包括基板（100），可固化浆料和保护膜（130）。 将可固化糊剂涂覆在基材上。 可固化糊剂包括可固化树脂，导电填料和无机添加剂。 将10〜50重量％的无机添加剂加入到100w％的导电填料中，提高焊料耐热性和TCR，并且是SiO 2，NiCr和Si中的一种。
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公开(公告)号：KR1020090088491A
公开(公告)日：2009-08-20
申请号：KR1020080013784
申请日：2008-02-15
Applicant: 전자부품연구원
CPC classification number: C04B35/10 , C04B35/63424 , C04B35/6365 , C04B2235/5436 , C04B2235/5445 , C04B2235/9607
Abstract: A non-shrinkage paste composition and a ceramic structure are provided to implement minute structure by sintering a desired specific part, and to perform a coating process with a general printing process conveniently. A ceramic structure(10) is comprised by applying a non-shrinkage paste composition(20) consisting of an inorganic compound and an organic compound of which sintering temperature is 1000‹C or greater on a specific region of the ceramic structure before a sintering process. The average granularity non-shrinkage paste composition is smaller than the average granularity of a ceramic material sued for the ceramic structure contacting with the -shrinkage paste composition. The difference of the average granularity of the ceramic material and the inorganic material is 0.01mum ~ 10.0mum.
Abstract translation: 提供非收缩糊组合物和陶瓷结构以通过烧结所需的特定部分实现微小结构，并且方便地进行通常的印刷方法的涂布工艺。 陶瓷结构（10）通过在烧结工序之前，在陶瓷结构的特定区域上施加由无机化合物和烧结温度为1000℃以上的有机化合物组成的非收缩性糊剂组合物（20） 。 平均粒度非收缩浆料组合物小于与收缩糊剂组合物接触的陶瓷结构起诉的陶瓷材料的平均粒度。 陶瓷材料和无机材料的平均粒度差为0.01μm〜10.0μm。
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