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公开(公告)号：KR1020110011171A
公开(公告)日：2011-02-08
申请号：KR1020090068694
申请日：2009-07-28
Applicant: 한국광기술원
Abstract: PURPOSE: A wafer level light emitting diode package is provided to rapidly discharge heat which is generated from a lighting structure by including a heat dissipation layer which is thermally contacted with the lighting structure. CONSTITUTION: A lighting structure comprises a first type semiconductor layer(22) and a second type semiconductor layer. The first type semiconductor layer exposes the edge part of the upper side of a substrate. The second type semiconductor layer exposes a part of the upper side of the first type semiconductor layer. A first type electrode(31) is arranged on the first type semiconductor layer. The second type electrode is arranged on the second type semiconductor layer. A heat dissipation layer(44) has an upper side which has the same level as the upper side of the electrodes. An insulating layer has an upper side which is the same level as the upper side of the electrodes and the heat dissipation layer.
Abstract translation: 目的：提供一种晶片级发光二极管封装，通过包括与照明结构热接触的散热层来快速放出由照明结构产生的热量。 构成：照明结构包括第一类型半导体层（22）和第二类型半导体层。 第一类型半导体层暴露衬底的上侧的边缘部分。 第二类型半导体层暴露第一类型半导体层的上侧的一部分。 第一类型电极（31）布置在第一类型半导体层上。 第二类型电极设置在第二类型半导体层上。 散热层（44）具有与电极的上侧相同水平的上侧。 绝缘层具有与电极和散热层的上侧相同水平的上侧。
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公开(公告)号：KR1020100129847A
公开(公告)日：2010-12-10
申请号：KR1020090048410
申请日：2009-06-02
Applicant: 한국광기술원
CPC classification number: F21V14/02 , F21S2/005 , F21V19/001 , F21V19/02 , F21V29/74 , F21V29/83 , F21Y2115/10 , Y02B20/72
Abstract: PURPOSE: An LED module assembly and a lighting device thereof are provided to effectively dissipate heat which is generated in an LED by forming a uniform heat dissipation groove on a cover and a plurality of parallel heat dissipation pins on a heat dissipation plate. CONSTITUTION: An LED module assembly(10) comprises a connector(20) which interlinks LED modules. The LED module comprises a radiating part(13), which is formed in the rear side of a substrate(11), and a diffusion plate(15). The diffusion plate diffuses the light of the LED. The radiating part dissipates heat which is generated in the LED module. Heat dissipation performance is increased by forming a concavo-convex part in the side of the radiating part.
Abstract translation: 目的：提供一种LED模块组件及其照明装置，通过在盖板上形成均匀的散热槽，在散热板上形成多个平行的散热销，有效散发LED中产生的热量。 构成：LED模块组件（10）包括连接LED模块的连接器（20）。 LED模块包括形成在基板（11）的后侧的散热部（13）和扩散板（15）。 扩散板扩散LED的光。 辐射部分散发在LED模块中产生的热量。 通过在辐射部分的侧面形成凹凸部来增加散热性能。
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公开(公告)号：KR1020100121339A
公开(公告)日：2010-11-17
申请号：KR1020090040441
申请日：2009-05-08
Applicant: 한국광기술원
IPC: F21V17/10 , F21V29/507 , F21V31/00 , F21V5/04 , F21Y101/02
CPC classification number: F21V17/16 , F21V5/04 , F21V15/01 , F21V29/507 , F21V31/005 , F21Y2115/10 , Y10S362/80
Abstract: PURPOSE: An LED package lighting module is provided to effectively emit the heat while blocking the dust and the moisture from the outside by arranging the heat-proof, dust-proof, and water-proof configuration. CONSTITUTION: A plurality of LED units(402) is mounted on an LED package module(401). The LED package module comprises a stator(405) projected on the front surface of the insertion direction. A platform comprises a fixing unit and an insert guide groove combined with the stator of the LED package module.
Abstract translation: 目的：提供LED封装照明模块，通过布置防热，防尘，防水的结构，有效地发出热量，同时阻挡灰尘和外界的水分。 构成：多个LED单元（402）安装在LED封装模块（401）上。 LED封装模块包括突出在插入方向的前表面上的定子（405）。 平台包括固定单元和与LED封装模块的定子结合的插入件引导槽。
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公开(公告)号：KR1020100111527A
公开(公告)日：2010-10-15
申请号：KR1020090029999
申请日：2009-04-07
Applicant: 한국광기술원
IPC: A01G7/04 , F21V23/00 , F21V8/00 , F21Y105/00 , F21W131/40
CPC classification number: A01G7/045 , F21V23/003 , F21W2131/40 , F21Y2105/00 , G02B6/0001 , Y10S362/80
Abstract: PURPOSE: A multilayered light emitting diode illuminating apparatus for cultivating crops is provided to improve the spatial efficiency by three-dimensionally utilizing a two-dimensional space. CONSTITUTION: Crop(40) is arranged in a first crop board(50A). A first illuminating unit(10A) is arranged on the first crop board. A second crop board(50B) is arranged on the first illuminating unit, crop is arranged in the second crop board. A second illuminating unit is arranged on the second crop board. Each illuminating unit includes a plurality of light emitting diode units and a light transferring unit. A controlling unit(20) controls the light emitting diode units.
Abstract translation: 目的：提供一种用于栽培作物的多层发光二极管照明装置，以通过三维利用二维空间提高空间效率。 构成：裁剪（40）布置在第一裁剪板（50A）中。 第一照明单元（10A）布置在第一裁剪板上。 在第一照明单元上布置有第二裁剪板（50B），裁剪布置在第二裁剪板中。 第二照明单元布置在第二裁剪板上。 每个照明单元包括多个发光二极管单元和光传输单元。 控制单元（20）控制发光二极管单元。
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公开(公告)号：KR1020100069095A
公开(公告)日：2010-06-24
申请号：KR1020080127675
申请日：2008-12-16
Applicant: 한국광기술원
IPC: F21S2/00
Abstract: PURPOSE: A light emitting diode illuminating apparatus is provided to form a protective housing in an identical or similar shape to an incandescent lamp by arranging a driving circuit unit in an identical direction to the light emitting direction of the light emitting diode. CONSTITUTION: A light emitting unit(110) includes a circuit or polygonal shape of light emitting diode(111). A driving circuit unit(120) is protruded on the center of the light emitting unit. The driving circuit unit controls the drive of the light emitting unit. A socket unit(140) is connected with the driving circuit unit and is capable of being connected with external power source. A reflecting unit(130) disperses light from the light emitting diode to the outside.
Abstract translation: 目的：提供一种发光二极管照明装置，通过沿与发光二极管的发光方向相同的方向布置驱动电路单元，形成与白炽灯相同或相似形状的保护壳体。 构成：发光单元（110）包括电路或多边形形状的发光二极管（111）。 驱动电路单元（120）突出在发光单元的中心。 驱动电路单元控制发光单元的驱动。 插座单元（140）与驱动电路单元连接，能够与外部电源连接。 反射单元（130）将来自发光二极管的光分散到外部。
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Patent Agency Ranking
公开(公告)号：KR1020100064113A
公开(公告)日：2010-06-14
申请号：KR1020080122543
申请日：2008-12-04
Applicant: 한국광기술원
IPC: H01L33/50
Abstract: PURPOSE: A method for processing the surface of a silicate phosphor and a light emitting device are provided to improve reliability and efficiency of a phosphor by increasing a surface area while removing impurity by selectively etching the surface of the silicate phosphor. CONSTITUTION: A silicate phosphor is prepared(S10). The surface impurity of the silicate phosphor is removed(S12). A phosphor without impurities is thermally processed(S14). In a process of removing the impurities on the surface, the phosphor is immersed in a phosphor solution.
Abstract translation: 目的：提供一种处理硅酸盐荧光体和发光器件的表面的方法，以通过增加表面积同时通过选择性地蚀刻硅酸盐荧光体的表面去除杂质来提高荧光体的可靠性和效率。 构成：制备硅酸盐荧光体（S10）。 除去硅酸盐荧光体的表面杂质（S12）。 对不含杂质的荧光体进行热处理（S14）。 在去除表面上的杂质的过程中，将磷光体浸入磷光体溶液中。
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公开(公告)号：KR1020100035971A
公开(公告)日：2010-04-07
申请号：KR1020080095380
申请日：2008-09-29
Applicant: 한국광기술원
Inventor： 김재필
IPC: H01L33/52
CPC classification number: H01L2224/50
Abstract: PURPOSE: A light emitting diode package encapsulated by light transmitting substrate and a method for fabricating the same are provided to prevent a defect due to deformation of a sealing layer by sealing a light emitting diode using light transmitting substrate. CONSTITUTION: A light emitting diode chip(40) is arranged on a package substrate(11). An optical transmission substrate(60) seals the light emitting diode chip. Bonding pads(21, 22) are located on a surface of the package substrate. A heat sink(30) is arranged on the lower surface of the package substrate. A housing(12) having a cavity(12a) on the peripheral area of the package substrate is arranged.
Abstract translation: 目的：提供由透光基板封装的发光二极管封装及其制造方法，以通过使用透光基板密封发光二极管来防止密封层变形引起的缺陷。 构成：发光二极管芯片（40）布置在封装衬底（11）上。 光传输基板（60）密封发光二极管芯片。 接合焊盘（21,22）位于封装基板的表面上。 散热器（30）布置在封装衬底的下表面上。 布置有在封装基板的周边区域上具有空腔（12a）的壳体（12）。
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公开(公告)号：KR1020090131040A
公开(公告)日：2009-12-28
申请号：KR1020080056811
申请日：2008-06-17
Applicant: 한국광기술원
CPC classification number: H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: PURPOSE: A light emitting diode package having a dome type encapsulation layer and a method for fabricating the same are provided to protect a light emitting diode chip by forming a domed passivation layer high according to block of the dispersion of a sealed fluid. CONSTITUTION: In a device, a package substrate(11) includes a peripheral area that surrounds an element area and the element area. Bonding pads(21,22) are formed on the element area of the package substrate. A heat sink(30) is arranged at the bottom of the package substrate. Housing(12) having a cavity is arranged on the peripheral area of the package substrate. A concavo-convex region(50) is formed on the housing. The concavo-convex region includes a plurality of protrusions(51,52,53,54) which surrounds the element area. A light emitting diode chip(40) is arranged at one among bonding pads exposed within the cavity. The domed sealed layer(60) is formed by dotting fluid on the light emitting diode chip.
Abstract translation: 目的：提供一种具有圆顶型封装层的发光二极管封装及其制造方法，以通过根据密封流体的分散体的块形成顶部钝化层来保护发光二极管芯片。 构成：在装置中，封装基板（11）包括围绕元件区域和元件区域的外围区域。 接合焊盘（21,22）形成在封装衬底的元件区域上。 散热器（30）布置在封装衬底的底部。 具有空腔的壳体（12）布置在封装衬底的周边区域上。 在壳体上形成凹凸区域（50）。 凹凸区域包括围绕元件区域的多个突起（51,52,53,54）。 发光二极管芯片（40）布置在暴露在腔内的接合焊盘之中。 半导体密封层（60）通过在发光二极管芯片上点滴流体而形成。
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公开(公告)号：KR100908926B1
公开(公告)日：2009-07-23
申请号：KR1020070090013
申请日：2007-09-05
Applicant: 한국광기술원
IPC: H01L33/58
Abstract: A light-emitting diode package is provided to minimize the light loss by removing the air gap between the lens and the encapsulating material. A light-emitting diode package(200) comprises a lens(210) of the curvature shape comprised on the upper side of package; the first hole in which the encapsulating material is filled while being formed at the lower-part of package; the second hole which is formed in a symmetrical direction and through which the air is released. An optical pattern and a diffraction pattern are formed on the lens. The lens is fixed to the lens fixation part of the light-emitting diode package.
Abstract translation: 提供发光二极管封装以通过去除透镜和封装材料之间的气隙来最小化光损失。 发光二极管封装（200）包括包含在封装上侧的曲率形状的透镜（210） 第一孔，其中封装材料在形成于封装的下部处时被填充; 该第二孔沿对称方向形成并且空气通过该第二孔释放。 在透镜上形成光学图案和衍射图案。 镜头固定在发光二极管封装的镜头固定部分。
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公开(公告)号：KR100801193B1
公开(公告)日：2008-02-11
申请号：KR1020060059611
申请日：2006-06-29
Applicant: 한국광기술원
Abstract: 본 발명은 발광 다이오드 및 그 제조방법에 관한 것으로서, 2개 이상의 발광 다이오드 칩들이 수직으로 적층되고, 최상부의 발광 다이오드 칩은 투명한 기판 위에 형성된 칩인 것을 포함한다. 특히 발광 다이오드의 제조방법은 구체적으로는 회로기판 위에 리플렉터가 하부에 부착된 발광 다이오드 칩을 접속하고, 그 위에 상기 발광 다이오드 칩과 파장이 같거나 혹은 다른 발광 다이오드 칩을 하나 이상 직렬로 접속하며, 적층된 발광 다이오드 칩의 최상부 칩에 와이어 본딩한 후 적층된 발광 다이오드 칩을 보호하는 봉지층을 형성하는 단계를 포함한다.
본 발명에 따르면, 2개 이상의 발광 다이오드 칩이 상하로 적층됨으로써 발광 다이오드로부터 방출하는 빛의 세기가 증가하고, 다양한 파장의 빛이 용이하게 혼합될 뿐만 아니라 하나의 발광장치의 실장 면적이 줄어드는 장점이 있다.
발광 다이오드, 적층, 리플렉터, 파장, 봉지층
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