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公开(公告)号:AU2016263091A1
公开(公告)日:2017-11-02
申请号:AU2016263091
申请日:2016-05-13
Applicant: BUTTERFLY NETWORK INC
Inventor: SANCHEZ NEVADA J , RALSTON TYLER S
Abstract: An ultrasound apparatus comprising a plurality of ultrasonic transducers, a non-acoustic sensor, a memory circuitry to store control data for operating the ultrasound apparatus to perform an acquisition task, and a controller. The controller is configured to receive an indication to perform the acquisition task, receive non-acoustic data obtained by the non- acoustic sensor, and control, based on the control data and the non-acoustic data, the plurality of ultrasonic transducers to obtain acoustic data for the acquisition task.
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公开(公告)号:CA3018967A1
公开(公告)日:2017-10-05
申请号:CA3018967
申请日:2017-03-31
Applicant: BUTTERFLY NETWORK INC
Inventor: CHEN KAILIANG , RALSTON TYLER S , FIFE KEITH G
Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.
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公开(公告)号:CA3011341A1
公开(公告)日:2017-07-20
申请号:CA3011341
申请日:2016-10-21
Applicant: BUTTERFLY NETWORK INC
Inventor: RALSTON TYLER S
Abstract: Ultrasound signal processing circuitry and related apparatus and methods are described. Groups of signal samples corresponding to respective acquisitions performed by an ultrasound transducer array may be processed by being transformed to the Fourier domain and via the application of one or more weighting functions. The transformed groups of signals may be combined with one another in the Fourier domain to obtain a Fourier-compounded set of signals that may be used for image formation.
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公开(公告)号:CA3006064A1
公开(公告)日:2017-06-08
申请号:CA3006064
申请日:2016-12-01
Applicant: BUTTERFLY NETWORK INC
Inventor: CHEN KAILIANG , FIFE KEITH G , SANCHEZ NEVADA J , CASPER ANDREW J , RALSTON TYLER S
Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.
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公开(公告)号:AU2014235032A1
公开(公告)日:2015-10-01
申请号:AU2014235032
申请日:2014-03-13
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , FIFE KEITH G , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the "ultrasound- on- a-chip" solution disclosed herein.
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公开(公告)号:CA2903479A1
公开(公告)日:2014-09-25
申请号:CA2903479
申请日:2014-03-13
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , FIFE KEITH G , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the "ultrasound- on- a-chip" solution disclosed herein.
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87.
公开(公告)号:CA2905040C
公开(公告)日:2021-10-19
申请号:CA2905040
申请日:2014-03-13
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , FIFE KEITH G , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J
Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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公开(公告)号:CA2954916C
公开(公告)日:2021-01-05
申请号:CA2954916
申请日:2015-07-14
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , ALIE SUSAN A , FIFE KEITH G , SANCHEZ NEVADA J , RALSTON TYLER S
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities (306) in a substrate (302). Wafer bonding may also be used to bond the substrate (302) to another substrate (304), such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号:AU2018369882A1
公开(公告)日:2020-05-21
申请号:AU2018369882
申请日:2018-11-15
Applicant: BUTTERFLY NETWORK INC
Inventor: CHEN KAILIANG , SANCHEZ NEVADA J , ALIE SUSAN , RALSTON TYLER S , ROTHBERG JONATHAN M , FIFE KEITH G , LUTSKY JOSEPH
IPC: A61B8/14 , H01L23/535
Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application- specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
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公开(公告)号:AU2015289853B2
公开(公告)日:2020-04-23
申请号:AU2015289853
申请日:2015-07-14
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , ALIE SUSAN A , FIFE KEITH G , SANCHEZ NEVADA J , RALSTON TYLER S
IPC: B06B1/02
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities (306) in a substrate (302). Wafer bonding may also be used to bond the substrate (302) to another substrate (304), such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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