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    81.
    发明专利
    未知

    公开(公告)号：DE68903181T2

    公开(公告)日：1993-03-25

    申请号：DE68903181

    申请日：1989-03-13

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  IIYAMA KATSUAKI ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

    IPC: C08L79/08

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: y

    THERMOSETTING RESIN FORMING COMPOSITION AND PROCESS FOR PREPARING SAME
    82.
    发明专利
    THERMOSETTING RESIN FORMING COMPOSITION AND PROCESS FOR PREPARING SAME 未知

    公开(公告)号：CA2028312A1

    公开(公告)日：1991-10-12

    申请号：CA2028312

    申请日：1990-10-23

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  TAMAI SHOJI ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/12 ,  C08G69/26

    Abstract: Disclosed is a composition for forming a thermosetting resin having excellent impact resistance and toughness. The composition comprises a bismaleimide compound represented by formula (I): wherein R is a hydrogen atom or methyl, and an amine compound represented by formula (II): wherein X is a radical selected from the group of divalent hydrocarbons having from 1 to 10 carbon atoms, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl, oxo, O-, or by formula (III)): wherein n is an integer of 0 to 50. Also disclosed is a process for preparing the composition.

    PROCESS FOR PREPARING POLYIMIDE AND COMPOSITE MATERIAL THEREOF
    83.
    发明专利
    PROCESS FOR PREPARING POLYIMIDE AND COMPOSITE MATERIAL THEREOF 未知

    公开(公告)号：AU609898B2

    公开(公告)日：1991-05-09

    申请号：AU2471588

    申请日：1988-11-04

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO ,  KOBA TOMOHITO ,  NAKAKURA TOSHIYUKI ,  SAKAI HIDEO ,  MASUDA MISAO ,  KISHI SATORU ,  MARUKO CHIAKI

    IPC: C08G73/10 ,  C08L79/08

    Abstract: This invention relates to a method for preparing polyimide having good heat-stability and excellent flowability in a molten state. The polymide is prepared by reacting aromatic diamines such as 4,4 min -bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3 min ,4,4 min -benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and monoamines such as n-hexylamine, cyclohexylamine, aniline, 4-aminobenzophenone. The molar ratio of tetracarboxylic dianhydride : aromatic diamine : monoamine is 1:(0.9 to 1.0):(0.001 to 1.0). Another invention relates to polyimide composite materials which are excellent in mechanical strengths and processability. The materials contain the polyimide above prepared and fibrous reinforcing materials such as yarn, roving, tow, fabrics, mats and felts of glass fiber, carbon fibers or aromatic polyamide fibers.

    POLYIMIDE RESIN COMPOSITION
    85.
    发明专利
    POLYIMIDE RESIN COMPOSITION 未知

    公开(公告)号：AU597494B2

    公开(公告)日：1990-05-31

    申请号：AU1736388

    申请日：1988-06-03

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO ,  IIYAMA KATSUAKI

    IPC: C08L79/08

    Abstract: Resin composition composed of 99.9 to 50 % by weight of a polyimide having a repeating unit of the formula as defined below and 0.1 to 50 % by weight of an aromatic polyamideimide are improved in heat resistance and mechanical strength and have the inherent properties of polyimide; where X indicates a direct bond or is -S- or and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.

    POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE OF POLYIMIDE
    86.
    发明专利
    POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE OF POLYIMIDE 未知

    公开(公告)号：CA1268592A

    公开(公告)日：1990-05-01

    申请号：CA515976

    申请日：1986-08-14

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  SONOBE YOSHIHO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  OHKOSHI KOUJI ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/10 ,  C09J179/08 ,  C09J3/16

    Abstract: Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; (I) (II) (where Y is a divalent radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-allphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). Typical examples of polyimide and polyamic acid include where Y is thio radical and R is or (III) (IV), Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV. The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride. Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

    PROCESS FOR PREPARING POLYMIMIDES
    88.
    发明专利
    PROCESS FOR PREPARING POLYMIMIDES 未知

    公开(公告)号：AU3073489A

    公开(公告)日：1989-11-23

    申请号：AU3073489

    申请日：1989-02-24

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/10 ,  C08G73/14

    Abstract: A process for preparing a polyimide by reaction of a diamine and a tetracarboxylic dianhydride to obtain a polyamide acid and subjecting the polyamide acid to conversion into a polyimide thermally or chemically. The reaction in the process is carried out in the presence of at least one dicarboxylic anhydride selected from the group consisting of aliphatic dicarboxylic anhydrides and aromatic dicarboxylic anhydrides, and the amount of the tetracarboxylic dianhydride is in the range of from 0.9 to 1.0 mole per mole of the diamine and the amount of the dicarboxylic anhydride is in the range of from 0.001 to 1.0 mole per mole of the diamine. The resultant polyimides exhibit good thermal stability at high temperatures and good forming processability even at low temperatures.

    PROCESS FOR PREPARING POLYIMIDE AND COMPOSITE MATERIAL THEREOF
    90.
    发明专利
    PROCESS FOR PREPARING POLYIMIDE AND COMPOSITE MATERIAL THEREOF 未知

    公开(公告)号：AU2471588A

    公开(公告)日：1989-05-11

    申请号：AU2471588

    申请日：1988-11-04

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO ,  KOBA TOMOHITO ,  NAKAKURA TOSHIYUKI ,  SAKAI HIDEO ,  MASUDA MISAO ,  KISHI SATORU ,  MARUKO CHIAKI

    IPC: C08G73/10 ,  C08L79/08

    Abstract: This invention relates to a method for preparing polyimide having good heat-stability and excellent flowability in a molten state. The polymide is prepared by reacting aromatic diamines such as 4,4 min -bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3 min ,4,4 min -benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and monoamines such as n-hexylamine, cyclohexylamine, aniline, 4-aminobenzophenone. The molar ratio of tetracarboxylic dianhydride : aromatic diamine : monoamine is 1:(0.9 to 1.0):(0.001 to 1.0). Another invention relates to polyimide composite materials which are excellent in mechanical strengths and processability. The materials contain the polyimide above prepared and fibrous reinforcing materials such as yarn, roving, tow, fabrics, mats and felts of glass fiber, carbon fibers or aromatic polyamide fibers.

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