Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element using a nitride-based Group III-V compound semiconductor, which reduces the threshold current density without increasing the operation voltage practically. SOLUTION: A p-type clad layer of a GaN-based semiconductor laser is configured by two or more semiconductor layers having different band gaps from one another, and a part of an active layer side of the p-type clad layer is configured by a semiconductor layer having a band gap greater than that of the other parts. Specifically, in the GaN-based semiconductor laser with an AlGaN/GaN/GaInN SCH structure, a p-type AlGaN clad layer 10 is configured of: a p-type Al x1 Ga 1-x1 N layer 10a in contact with a p-type GaN optical waveguide layer 9; and a p-type Al x2 Ga 1-x2 N layer 10b on the p-type Al x1 Ga 1-x1 N layer 10a (here, 0≤x2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for growing oxy-chalcogenide based thin film excellent in mass productivity in which a p-type layer can be obtained and an oxy-chalcogenide based thin film can be grown uniformly over a large area. SOLUTION: Solution vaporization CVD is employed for growing an oxy-chalcogenide based thin film. For example, a Cu thin film 102 is formed on a substrate 101 such as a YSZ substrate or an MgO substrate and then an amorphous LaCuOS thin film 103 is grown by solution vaporization CVD. For example, La(EDMDD) 3 is employed as an La material, and Cu(EDMDD) 2 is employed as a Cu material. Growth temperature is set at 400°C or less. Thereafter, the amorphous LaCuOS thin film 103 is crystallized by reactive solid phase epitaxial growth method thus obtaining a crystalline LaCuOS thin film 104. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a light emitting diode of significantly high light emitting efficiency that can be manufactured by one-time epitaxial growth at a low cost, and a manufacturing method thereof. SOLUTION: In a recess 11a formed on one main surface of a sapphire substrate 11, growth in a lateral direction is performed from a GaN layer 12, after burying the recess 11a by making the GaN layer 12 grow after passing through a state of a triangular cross section shape with its bottom face as a base. A light emitting diode structure is formed on the GaN layer 12 by growing a GaN based semiconductor layer including an active layer on the GaN layer 12. By using the GaN based light emitting diode, a light emitting diode backlight, etc. is manufactured. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To make it possible to obtain such a light emitting device that is high in light emitting efficiency by forming a silicon-based light emitting layer having a quantum confined structure utilizing quantum effect. SOLUTION: The light emitting device 1 is provided with a silicon-based light emitting layer which is formed on a substrate and utilizes quantum effect. The silicon-based light emitting layer utilizing the quantum effect has a quantum confined structure. For example, the light emitting layer uses a silicon oxide thin film (oxide silicon layer 12) which contains silicon-based semiconductor particulate 11 having similar size to the de Broglie wavelength of electrons. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting element with large light emission strength, capable of obtaining emission light having a wavelength with a narrow half width at half maximum. SOLUTION: The light emitting element 10 has a light emission layer 20 formed on a substrate 11. The light emission layer has a structure formed by laminating a first material layer 21, a quantum well layer 24, and a second material layer 22. At least one layer out of the first material layer 21 and the second material layer 22 contains rare-earth element 23. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an optical coupling device optical coupling device capable of facilitating coupling of an optical waveguide, an optical fiber and an optical element and formed inexpensively with high productivity and high yield and also with high accuracy, and to provide its manufacturing method. SOLUTION: After the optical waveguide 2, in which an end face 5 is made an inclined reflecting face, is bonded and fixed to the base material of a support body 1, an abutting face 6 against a package substrate 11 is formed at a position away from the end face 5 by a prescribed distance 21. In the package substrate 11, an optical waveguide support face 12, a recessed part 13 and an abutting face 15 against the support body 1 are provided, the optical element 14 is fixed at a position away from the abutting face 15 by a prescribed distance 22. The optical coupling between the optical waveguide 2 and the optical element 14 is formed by making the principal face of the optical waveguide 2 in contact with the optical waveguide support face 12 to perform the positioning of the height direction, and then allowing to abut the abutting faces 6, 15 against each other to perform the positioning in the left-and-right direction. An abutting face of a depth direction is provided to facilitate all the positionings of three-dimensional directions by an abutting process by providing . COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To feed high temperature gas heated at desired temperature to the direction of the substrate to be vapor-deposited together with an evaporated vapor deposition material without providing a means for heating gas separately from a vapor deposition system. SOLUTION: Regarding the vapor deposition system 1, a vapor deposition source 12 and the substrate 51 to be vapor-deposited are oppositely provided inside a chamber 11. The vapor deposition source 12 is provided with: a crucible 13 for evaporating a vapor deposition material; a gas flow passage 14 for feeding gas 61 to the direction of the substrate to be vapor-deposited along the outer circumferential side of the crucible 13; and a heating source 15 for heating the gas flow passage 14. The gas flow passage 14 is composed of layered flow passages 141 as a plurality of layers where gas is made to flow from the lowest layer to the direction of the outermost layer, and an opening part 145 is formed on each layered flow passage 141 in such a manner that the gas flow goes to the direction of the substrate 51 to be vapor-deposited. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a film deposition system and a film deposition method where a film deposition rate and the thickness of a deposited film can be extremely satisfactorily controlled while holding the film deposition rate by vapor deposition. SOLUTION: The film deposition system 1 for depositing a vapor deposition film on a substrate W is provided with: a vapor deposition source 5 of generating raw material vapor Mg; substrate holding means 7 of holding the substrate W in a state where the substrate W can be oppositely arranged to the vapor deposition source 5; and a gas wall forming means 9 forming gas walls 11 in a state of surrounding the space (a) between the substrate holding means 7 and the vapor deposition source 5. The gas wall forming means 9 is composed of gas feed edges 9a arranged at the positions surrounding the vapor deposition source 5 and jetting gas G from the side of the vapor deposition source 5 toward the sides of the substrate holding means 7, and forms the gas walls 11 so as to freely make an inside diameter in accordance with the jetting angle of the gas G from the gas feed edges 9a. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve crystallinity and electrical conductivity, and to average the composition ratio or p-type impurity concentration within the crystal growth side. SOLUTION: A first layer 11, consisting of AlGaN mixed crystal with a thickness of about 1 to 100 nm, and a second layer 12, consisting of p-type GaN doped with Mg to a thickness of about 1 to 100 nm are alternately laminated in a plurality of laminations, respectively. Since the first layer 11 and the second layer 12, which have independent contents of aluminum and p-type impurity concentrations and are different from each other, are formed in separate processes, respectively, a proper p-type group III nitride compound semiconductor having the properties as p-type AlGaN mixed crystal, as whole, is obtained. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a polymeric optical waveguide which has a simple constitution and has a satisfactory clad mode suppression effect. SOLUTION: A polymeric optical waveguide 10 is a planar polymeric optical waveguide of which the wavelength of guided light is set to about 850 nm, and is provided with a lower clad layer 12, a band-shaped core layer 14 formed on the lower clad layer 12, and an upper clad layer 16 formed around the core layer 14 and on the lower clad layer 12. The lower clad layer 12 and the upper clad layer 16 are made of oxetane resin, wherein a specific block coloring matter is added and uniformly dispersed so as to be 1.0 wt%. The core layer 14 is made of oxetane resin of which the refractive index is 0.2 to 2.0% higher than those of the lower clad layer 12 and the upper clad layer 16. COPYRIGHT: (C)2004,JPO&NCIPI