THERMOPLASTIC FILM
    81.
    发明专利

    公开(公告)号:JPS57160612A

    公开(公告)日:1982-10-04

    申请号:JP4563881

    申请日:1981-03-30

    Abstract: PURPOSE:To manufacture film of good pinhole-proofness at low temperature and transparency, by mixing polyamide composed of caproamide as a main constituent and ethylene type ionomer of the specified value at the specified compounding ratio. CONSTITUTION:Polycaproamide obtained by melting epsilon-caprolactam, 60-95wt% and ethylene type ionomer, 5-40wt% (5-50% of carboxyl radical of the copolymer composed of alpha-olefin and alpha,beta unsaturated carboxylic acid is neutralized with zinc ion, ionized and it has a melt index larger than 7.0.) are mixed and pelletized after melting and milling. Then, a film is obtained by extrusion- forming of this pellet by an extruder having a T die. Biaxial stretch treatment is done if necessary.

    PRODUCTION OF POLYAMIDE
    82.
    发明专利

    公开(公告)号:JPS578224A

    公开(公告)日:1982-01-16

    申请号:JP8335380

    申请日:1980-06-19

    Abstract: PURPOSE:To obtain a higher polyamide excellent in flexibility, low-temperature impact resistance, etc., by feeding an aqueous solution containing a salt between adipic acid and a diamine selected from undecanediamine and dodecanediamine into a polymerization kettle and polymerizing the reaction mizture. CONSTITUTION:A higher polyamide having undecamethylene adipamide units and/or dodecamethylene adipamide units as the principal structural units is obtained by feeding an aqueous solution containing at least 50wt% equimolar salt between at least one diamine selected from the group consisting of undecanediamine and dodecanediamine and adipic acid into a polymerization kettle and solution-polymerizing the solution at 240-300 deg.C under elevated or atmospheric pressure. EFFECT:The above diamine/adipic acid salt has a high solubility in water, so that an operation such as concentration, is unnecessary to feed a high concentration aqueous solution of the salt into a polymerization kettle. Besides, the polyamide thus produced is excellent also in resistance to flex fatigue and dimensional stability.

    POLYAMIDE FILM
    83.
    发明专利

    公开(公告)号:JPS56151729A

    公开(公告)日:1981-11-24

    申请号:JP5532380

    申请日:1980-04-28

    Abstract: PURPOSE:To obtain the titled film having improved heat-sealing strength and transparency and good resistance to pinhole formation and heat, by using a caproamide component, a hexamethylene isophthalamide component, etc. as constituent components. CONSTITUTION:A copolyamide consisting of (A) 95-75wt% caproamide component, (B) 5-25wt% hexamethylene isophthalamide component and (C) 0- 20wt% hexamethylene terephthalamide components as main constituent components is melt formed into a film and if necessary drawn to give the aimed film having a transparence satisfying the formula H

    HEATTSENSITIVE ELEMENT
    84.
    发明专利

    公开(公告)号:JPS56104482A

    公开(公告)日:1981-08-20

    申请号:JP683780

    申请日:1980-01-25

    Abstract: PURPOSE:To improve the heat resistance, resin solubility and DC polarizing characteristics of the heat-sensitive element by employing polyesteramide containing specific substance as an essential ingredient. CONSTITUTION:A temperature is controlled by detecting the temperature change of a heater 2 as the variation in the impedance of the heat-sensitive element 3 by a signal line 4, and controlling a current to the heating line 2. The element 3 is formed of polyesteramide containing 5-95wt% of butylene telephthalate and/or butylene isophthalate unit and 5-95wt% of dececanoic amide and/or undecane amide unit as main ingredients.

    POLYAMIDE RESIN COMPOSITION
    85.
    发明专利

    公开(公告)号:JPS55149346A

    公开(公告)日:1980-11-20

    申请号:JP5755279

    申请日:1979-05-10

    Abstract: PURPOSE:To provide a polyamide resin compsn. which excels in rigidity and mold release characteristics and is suitable for the production of molded articles such as gear, bush, and connector, by a method wherein a higher aliph. bisamide cpd. is blended with poly-epsilon-caprolactam contg. gamma-type crystals. CONSTITUTION:(B) 0.005-1pts.wt. of a higher aliph. bisamide cpd. is blended with (A) 100pts.wt. of poly-epsilon-caprolactam with a gamma-type crystal content of at least 0.4 to obtain the desired polyamide resin compsn. The cpd. (A) is prepd., e.g., by immersing pellets of nylon 6 produced from epsilon-caprolactam or epsilon-aminocaproic acid, in an aq. soln. of Ba(OH)2 or BaO. Ba(OH)2 or BaO is used in an amount of 0.005-0.5wt%, pref. 0.05-0.2wt% based on the weight of nylon 6. Examples of (B) are cpd. of formula I or II, wherein R1 is 1-10C hydrocarbon gp.; R2, R3 are 10-30C hydrocarbon gp.; R4, R5 are H, 1-4C hydrocarbon gp., such as methylene bisstearylamide.

    PRODUCTION OF POLYAMIDE MONOFILAMENT

    公开(公告)号:JPS55137214A

    公开(公告)日:1980-10-25

    申请号:JP4461579

    申请日:1979-04-12

    Abstract: PURPOSE:An amide of higher fatty acid is added to a copolyamide consisting of caproamide, hexamethylene isophthalamide and others and they are melt spun to form said monofilaments with high mechanical strength and high transparency even in large deniers. CONSTITUTION:To a copolyamide consisting of (A) (a) 95-75wt% of caproamide ingredient, (b) 5-25wt% of hexamethylene isophthalamide ingredient and (c) 0- 20% of hexamethylene terephthalamide ingredient is added (B) 0.01-2% of at least one of amides, esters and metal salts of higher fatty acids or higher alcohols and they are melt spun. The transparency of the resulting monofilaments is controlled so as to satisfy the equation [T is transparency in %, d is the diameter of the monofilament in mm, ranging from 0.1-4mm.

    THERMALLSENSITIVE ELEMENT
    87.
    发明专利

    公开(公告)号:JPS5582478A

    公开(公告)日:1980-06-21

    申请号:JP15499178

    申请日:1978-12-18

    Abstract: PURPOSE:To obtain a material that can control temperature by capacity reactance components, by adding a specified quantity of one kind of soluble or acidic dyes belonging to an azine group indicated by a specified formula to polyamide, whose amide radical number per 100 carbon atomic number is not more than 14. CONSTITUTION:A thermal-sensitive element is prepared by adding and mixing 0.1-10wt% at least one kind of azine group oil soluble or acidic dyes displayed by a formula I to polyamide, whose amide radical number per 100 carbon atomic number is not more than 14 as shown in the diagram under not more than 4% a saturated water absorption coefficient. In the formula I, X indicates a hydrogen atom, an alkyl radical or an aryl radical, Y1-Y4 any of hydrogen atoms, methyl radicals, hydroxyl radicals, amino radicals or aromatic amino radicals and at least one of a radical except the hydrogen atom and n is integers of 1-3, and insulin 3B, 6B are preferable. Nylon 8, 10-12, etc. are used as the polyamide. Thus, a material that corrosiveness is a little and can control temperature by capacity reactance components can be obtained.

    RESIN COMPOSITION
    88.
    发明专利

    公开(公告)号:JPS5478750A

    公开(公告)日:1979-06-23

    申请号:JP14646477

    申请日:1977-12-06

    Abstract: PURPOSE:A resin composition suitable for continuous molding of packaging materials having improved stretchability, gas barrier properties, hot-water, oil, and impact resistance, consisting of a saponified ethylene-vinyl acetate copolymer and a specific copolyamide. CONSTITUTION:A resin composition consisting of (A) 60-95 wt. % of a saponified ethylene-vinyl acetate copolymer (preferably, an ethylene content of 10-45 wt.% and a saponification degree >=90 %) and (B) 5-40 wt. % of a copolyamide (e.g., nylon 6/6I, etc.) consisting of a) 50-95 wt. % of capramide unit and (b) 5-50 wt. % of an aromatic and/or an alicyclic unit. USE:packaging materials, e.g., films, sheets, tubes, plastic vessels, etc.

    IMPACTTRESISTANT RESIN COMPOSITION
    89.
    发明专利

    公开(公告)号:JPS5441955A

    公开(公告)日:1979-04-03

    申请号:JP10728277

    申请日:1977-09-08

    Abstract: PURPOSE:The titled composition having improved impact resistance particularly at low temperatures and low moisture absorption, without degrading the properties of polyamide resin, comprising a specific polyether-ester block copolymer and poly- epsilon-capramide resin having a specific molecular weight. CONSTITUTION:(A) 100 parts by wt. of a polyamide resin consisting substantially of poly-epsilon-capramide having a molecular weight of 10,000-20,000 is melt kneaded with (B) 10-80 parts by wt., preferably 15-60 parts by wt. of a polyether-ester block copolymer having an intrinsic viscosity of 0.5-4.0 and a polymerization degree of 8,000-several tens of thousands consisting of (a) one or two or more types of aromatic dicarboxylic acids, preferably terephthalic acid, (b) a short-chain diol consisting substantially of 1, 4-butanediol and/or 1, 6-hexanediol, and (c) a long-chain diol consisting substantially of poly (tetramethylene oxide) glycol having a amolecular weight of 600-3,000 at 230-260 deg.C.

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