公开(公告)号：WO2012047071A3

公开(公告)日：2012-08-23

申请号：PCT/KR2011007473

申请日：2011-10-10

Applicant: KOREA ADVANCED INST SCI & TECH ,  LEE KEON JAE ,  PARK KWI IL ,  KOO MIN ,  HWANG GEON TAE

Inventor： LEE KEON JAE ,  PARK KWI IL ,  KOO MIN ,  HWANG GEON TAE

IPC: H02N2/18 ,  H01L41/312

CPC classification number: H02N2/186 ,  B81B2201/032 ,  B81C1/00357 ,  B81C2201/0194 ,  H01L41/312

Abstract: Provided are a method for manufacturing a flexible nanogenerator and a flexible nanogenerator manufactured thereby. The method for manufacturing the flexible nanogenerator of the present invention includes the steps of: laminating a piezoelectric element layer having a piezoelectric material layer on a sacrificial substrate; crystallizing the piezoelectric element layer by thermally processing the piezoelectric element layer at a high temperature; separating unit piezoelectric elements from the sacrificial substrate by removing the sacrificial substrate; and transferring the separated unit piezoelectric elements onto a flexible substrate. The method for manufacturing the flexible nanogenerator and the flexible nanogenerator manufactured thereby of the present invention can continuously produce electric power from the movement of a human body and the like by producing electric power according to the bending of the substrate.

公开(公告)号：WO2011046986A3

公开(公告)日：2011-08-11

申请号：PCT/US2010052403

申请日：2010-10-12

Applicant: MASSACHUSETTS INST TECHNOLOGY ,  BULOVIC VLADIMIR ,  PACKARD CORINNE E ,  WOOD VANESSA C

Inventor： BULOVIC VLADIMIR ,  PACKARD CORINNE E ,  WOOD VANESSA C

IPC: G01L1/14 ,  B81C1/00

CPC classification number: G01L1/146 ,  B81B2201/0264 ,  B81B2201/042 ,  B81B2203/0127 ,  B81C1/0046 ,  B81C2201/0194

Abstract: The disclosure is generally directed to fabrication steps, and operation principles for microelectromechanical (MEMS) transducers. In one embodiment, the disclosure relates to a texture morphing device. The texture morphing device includes: a plurality of supports arranged on a substrate to support a deformable mirror, an ITO layer; and a Distributed Bragg Reflector (DBR ) layer. A pair of adjacent supports form a cavity with the ITO layer and the deformable mirror. When the height of the cavity changes responsive to an external pressure, the internal reflection within the cavity is changed. The change in the height of the cavity causes the exterior texture to morph. Similar principles are disclosed for constructing sensor and actuators.

Abstract translation: 本公开一般涉及制造步骤以及微机电（MEMS）换能器的操作原理。 在一个实施例中，本公开涉及纹理变形装置。 纹理变形装置包括：布置在基板上以支撑可变形反射镜的多个支撑件，ITO层; 和分布式布拉格反射器（DBR）层。 一对相邻的支撑件形成具有ITO层和可变形反射镜的空腔。 当空腔的高度响应于外部压力而变化时，空腔内的内部反射被改变。 空腔的高度变化导致外部纹理变形。 公开了用于构造传感器和致动器的类似原理。

公开(公告)号：WO2009000969A1

公开(公告)日：2008-12-31

申请号：PCT/FI2008/050383

申请日：2008-06-23

Applicant: CANATU OY ,  BROWN, David P. ,  OLLIKAINEN, Andrei ,  KAUPPINEN, Esko I. ,  NASIBULIN, Albert G. ,  HEIKKONEN, Jussi

Inventor： BROWN, David P. ,  OLLIKAINEN, Andrei ,  KAUPPINEN, Esko I. ,  NASIBULIN, Albert G. ,  HEIKKONEN, Jussi

IPC: B82B3/00 ,  H01L51/50 ,  B32B9/00 ,  C08J5/18

CPC classification number: B81C1/00357 ,  B81C1/00373 ,  B81C1/00476 ,  B81C1/00492 ,  B81C2201/0187 ,  B81C2201/0188 ,  B81C2201/0194 ,  C01B32/15 ,  C01B32/168 ,  C01P2004/13 ,  C01P2004/16 ,  C04B14/026 ,  C04B30/02 ,  C04B2111/00844 ,  C04B2111/00853 ,  Y10T428/24802

Abstract: A method for the production of a fibrous network- substrate component. The method comprises the steps of providing a network of fibrous material (1) on a preliminary substrate (2) by filtering high aspect ratio molecular structures (HARM-structures) from gas flow, placing the network of fibrous material (1) on the preliminary substrate (2) in proximity to a secondary substrate (3), applying a force to the network of fibrous material (1) to preferably attract the network of fibrous material (1) from the preliminary substrate (2) to the secondary substrate (3) in order to transfer the network of fibrous material (1) from the preliminary substrate (2) to the secondary substrate (3), and removing the preliminary substrate (2) from the network of fibrous material (1).

Abstract translation: 一种生产纤维网状基材组分的方法。 该方法包括以下步骤：通过从气流中过滤高纵横比分子结构（HARM结构），将纤维材料网（1）放置在预备的基底（2）上，从而在预备基底（2）上提供纤维材料网（1） 在第二基底（3）附近的衬底（2），向纤维材料（1）的网络施加力以优选地将纤维材料（1）的网络从预备衬底（2）吸引到次级衬底（3） ）以将纤维材料（1）的网络从预备衬底（2）转移到第二衬底（3），并从纤维材料（1）的网络去除预备衬底（2）。

公开(公告)号：KR101380002B1

公开(公告)日：2014-04-02

申请号：KR1020137013880

申请日：2011-11-18

Applicant: 다나카 기킨조쿠 고교 가부시키가이샤

Inventor： 오가시와도시노리 ,  구리타마사아키 ,  니시모리다카시 ,  가네히라유키오

IPC: H01L21/60 ,  H01L21/28

CPC classification number: H01L21/4885 ,  B22F7/08 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/322 ,  B23K2201/40 ,  B81C1/00095 ,  B81C1/00373 ,  B81C2201/0188 ,  B81C2201/0194 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/03003 ,  H01L2224/031 ,  H01L2224/0312 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/0508 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/0567 ,  H01L2224/05671 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/05678 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/1317 ,  H01L2224/13171 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13178 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/94 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/11

Abstract: 본 발명은 기판과, 상기 기판 상에 형성된 하나 이상의 금속 배선 소재와, 상기 기판과 상기 금속 배선 소재 사이에 형성된 하지 금속막(underlying metal film)으로 이루어지며, 상기 금속 배선 소재를 피전사물에 전사시키기 위한 전사용 기판으로서, 상기 금속 배선 소재는, 순도 99.9 중량% 이상, 평균 입자경 0.01 ㎛~1.0 ㎛인 금 분말 등을 소결하여 이루어지는 성형체이며, 상기 하지 금속막은, 금 등의 금속 또는 합금 등으로 이루어지는 전사용 기판이다. 이 전사용 기판은, 피전사물의 가열온도를 80~300℃로 하더라도 금속 배선 소재를 피전사물에 전사할 수 있다.

公开(公告)号：KR1020130086055A

公开(公告)日：2013-07-30

申请号：KR1020137013880

申请日：2011-11-18

Applicant: 다나카 기킨조쿠 고교 가부시키가이샤

Inventor： 오가시와도시노리 ,  구리타마사아키 ,  니시모리다카시 ,  가네히라유키오

IPC: H01L21/60 ,  H01L21/28

CPC classification number: H01L21/4885 ,  B22F7/08 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/322 ,  B23K2201/40 ,  B81C1/00095 ,  B81C1/00373 ,  B81C2201/0188 ,  B81C2201/0194 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/03003 ,  H01L2224/031 ,  H01L2224/0312 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/0508 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/0567 ,  H01L2224/05671 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/05678 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/1317 ,  H01L2224/13171 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13178 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/94 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/11

Abstract: The present invention provides a transfer substrate for transferring a metal wiring material to a transfer-receiving object, the transfer substrate comprising a substrate, at least one metal wiring material formed on the substrate and an underlying metal film formed between the substrate and the metal wiring material, wherein the metal wiring material is a molded article prepared by sintering, e.g., gold powder having a purity of 99.9% by weight or more and an average particle size of 0.01 µm to 1.0 µm and the underlying metal film is composed of a metal such as gold or an alloy. The transfer substrate is capable of transferring a metal wiring material to the transfer-receiving object even at a temperature for heating the transfer-receiving object of 80 to 300°C.

公开(公告)号：KR1020170086483A

公开(公告)日：2017-07-26

申请号：KR1020177011711

申请日：2015-11-09

Applicant: 트로닉스 마이크로시스템즈

Inventor： 골렉,조엘

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81B3/0051 ,  B81C1/00182 ,  B81C1/00333 ,  B81C2201/0194 ,  B81C2203/051 ,  G01L9/0042

Abstract: 전기기계장치는두 개의고형층(10, 30)의사이에절연층(31)이개재되어있는형태로형성되는적층체, 그리고기설정된깊이의홈(4)의위에현수되어있는기설정된두께의마이크로기계구조체(60, 61)를포함하며, 홈(4)과마이크로기계구조체(60, 61)가적층체의상기두 개의고형층(10, 30) 중하나(10)를형성하며, 절연층(31)이홈(4)의바닥을형성한다.

Abstract translation: 该机电装置包括形成在其上的两个固体层（10,30）伪绝缘层（31）的堆叠，以及通过堆叠预定厚度的微结构 机械结构60和61以及凹槽4和微机械结构60和61形成层压体10和绝缘层31的两个固体层10和30中的一个 ）形成凹槽（4）的底部。

公开(公告)号：KR1020140140053A

公开(公告)日：2014-12-08

申请号：KR1020147027309

申请日：2013-02-26

Applicant: 솔렉셀, 인크.

Inventor： 요네하라,타카오 ,  라나,비렌드라,브이. ,  수터,션 ,  모슬레히,메드다드,엠. ,  타미마니,서브라마니안

IPC: H01L21/301 ,  H01L21/268 ,  B23K26/00

CPC classification number: H01L21/7813 ,  B23K26/0006 ,  B23K26/0054 ,  B23K26/0057 ,  B23K26/0093 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0869 ,  B23K26/244 ,  B23K26/702 ,  B23K2201/40 ,  B23K2203/52 ,  B42D25/00 ,  B81C1/0038 ,  B81C1/0088 ,  B81C2201/0192 ,  B81C2201/0194 ,  H01L21/268 ,  H01L21/304 ,  H01L21/76254 ,  H01L21/76259 ,  H01L25/0657 ,  H01L31/022441 ,  H01L31/0682 ,  H01L31/1892 ,  H01L33/0079 ,  H01L33/0095 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/1461 ,  Y02E10/547 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: 방법 및 시스템은 레이저 조사를 이용하여 두꺼운 도너 웨이퍼에서, 광학, 광전, 전자, 마이크로 전자 기계 시스템 (MEMS)을 포함하는 결정질 반도체 물질, 또는 광전자 장치의 원하는 두께의 층을 분할 및 분리를 위해 제공된다(Methods and systems are provided for the split and separation of a layer of desired thickness of crystalline semiconductor material containing optical, photovoltaic, electronic, micro-electro-mechanical system (MEMS), or optoelectronic devices, from a thicker donor wafer using laser irradiation).

Abstract translation: 提供的方法和系统用于使用激光照射从较厚的施主晶片分离和分离含有光学，光电，电子，微电子机械系统（MEMS）或光电子器件的期望厚度的结晶半导体材料的层。

公开(公告)号：US11970391B2

公开(公告)日：2024-04-30

申请号：US17618198

申请日：2019-12-13

Applicant: Shenzhen Institutes of Advanced Technology

Inventor： Tianzhun Wu ,  Zhaoling Huang ,  Qi Zeng

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00166 ,  B81B3/0072 ,  B81B2201/06 ,  B81B2203/0172 ,  B81B2203/04 ,  B81C2201/0114 ,  B81C2201/0185 ,  B81C2201/0187 ,  B81C2201/0194

Abstract: A method for preparing a flexible electrode is provided. The method comprises sequentially forming a flexible base layer and an intermediate conductive layer on a carrier plate; treating an elastomeric template having an electrode pattern with an acid, followed by transferring and printing the electrode pattern onto the intermediate conductive layer to form an electrode inducing layer; forming a titanium dioxide-polydopamine composite layer in a gap of the electrode inducing layer; forming a platinum electrode layer on the titanium dioxide-polydopamine composite layer; removing the carrier plate. The invention solves the problems of slow formation of a polydopamine film and slow formation of a platinum electrode layer. A flexible electrode is further provided.

公开(公告)号：US11845653B2

公开(公告)日：2023-12-19

申请号：US17440175

申请日：2020-04-01

Applicant: Meridian Innovation Pte Ltd

Inventor： Wan Chia Ang ,  Piotr Kropelnicki ,  Ilker Ender Ocak

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81B2201/0207 ,  B81B2207/012 ,  B81C2201/0194 ,  B81C2203/0714 ,  B81C2203/0721 ,  B81C2203/0735 ,  B81C2203/0771 ,  B81C2203/0792

Abstract: A complementary metal oxide semiconductor (CMOS) device integrated with micro-electro-mechanical system (MEMS) components in a MEMS region is disclosed. The MEMS components, for example, are infrared (IR) thermosensors. The MEMS sensors are integrated on the CMOS device heterogeneously. For example, a CMOS wafer with CMOS devices and interconnections as well as partially processed MEMS modules is bonded with a MEMS wafer with MEMS structures, post CMOS compatibility issues are alleviated. Post integration process to complete the devices includes forming contacts for interconnecting the sensors to the CMOS components as well as encapsulating the devices with a cap wafer using wafer-level vacuum packaging.

公开(公告)号：US11679975B2

公开(公告)日：2023-06-20

申请号：US17629210

申请日：2020-07-23

Applicant: VERMON SA

Inventor： Claire Bantignies ,  Guillaume Férin

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00095 ,  B81B7/0006 ,  B81B2201/0271 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2201/0194 ,  B81C2203/0792

Abstract: A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a first carrier substrate with a first surface of the acoustic components positioned adjacent to the first carrier substrate. ASIC components are also secured at predetermined locations on the first carrier substrate with a first surface of the ASIC components positioned adjacent to the first carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The first carrier substrate is removed to expose the first surface of the acoustic components and the first surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.