公开(公告)号：EP2498283B1

公开(公告)日：2018-05-16

申请号：EP12154199.9

申请日：2012-02-07

Applicant: SEMIKRON Elektronik GmbH & Co. KG

Inventor： Dr. Besendörfer, Kurt-Georg ,  Erdner, Nadja

IPC: H01L21/48 ,  H01L23/373

CPC classification number: H01L21/4867 ,  H01L23/3735 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L25/072 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/27505 ,  H01L2224/32225 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/1301 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

公开(公告)号：EP3138124A4

公开(公告)日：2018-03-07

申请号：EP15785531

申请日：2015-04-29

Applicant: MICRON TECHNOLOGY INC

Inventor： NG HONG WAN ,  YE SENG KIM

IPC: H01L23/12 ,  H01L21/98 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/1205 ,  H01L2924/143 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15174 ,  H01L2924/15182 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Stacked semiconductor die assemblies with support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a plurality of support members also attached to the package substrate. The plurality of support members can include a first support member and a second support member disposed at opposite sides of the first semiconductor die, and a second semiconductor die can be coupled to the support members such that at least a portion of the second semiconductor die is over the first semiconductor die.

公开(公告)号：EP3086361A2

公开(公告)日：2016-10-26

申请号：EP16161902.8

申请日：2016-03-23

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： Schäfer, Michael ,  Schmitt, Wolfgang ,  Hinrich, Andreas ,  Barrera-Marin, Isabel

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/373 ,  H01L23/495 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L21/683

CPC classification number: H01L24/83 ,  H01L21/6836 ,  H01L23/3735 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68368 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27418 ,  H01L2224/27848 ,  H01L2224/29007 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/75272 ,  H01L2224/75745 ,  H01L2224/83001 ,  H01L2224/83007 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/95 ,  H01L2224/97 ,  H05K3/303 ,  H05K3/32 ,  H05K3/34 ,  H05K2203/1131 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/00012 ,  H01L2224/83

Abstract: Verfahren zum Herstellen einer Substratanordnung (10, 10') zur Verbindung mit einem Elektronikbauteil (50; 51), umfassend die Schritte:
- Bereitstellen eines Substrates (20), insbesondere eines DCB-Substrats, eines PCB-Substrats oder eines Leadframes, mit einer ersten Seite (22) und einer zweiten Seite (23),
- abschnittsweises Aufbringen eines Vorfixiermittels (30) auf die erste Seite (22) des Substrates (20).
Die Erfindung betrifft auch eine entsprechende Substratanordnung (10, 10') sowie ein entsprechendes Verfahren zum Verbinden eines Elektronikbauteils (50, 51) mit der Substratanordnung (10, 10').
Durch die erfindungsgemäßen Maßnahmen wird beim Transport vom Ort des Bestückens der Substratanordnung (10, 10') mit dem Elektronikbauteil (50, 51') zum Ort des Verbindens eine ausreichende Transportfestigkeit erzeugt.
Das Vorfixiermittel (30) kann auch alternativ oder zusätzlich auf die erste Seite (52) des Elektronikbauteils (50, 51) abschnittsweise aufgebracht werden.
Auf die Substratanordnung (10, 10') und/oder auf das Elektronikbauteil (50, 51) kann vor dem Aufbringen des Vorfixiermittels (30) ein Kontaktierungsmaterial (25) aufgebracht werden. Das Vorfixiermittel (30) kann zumindest abschnittsweise seitlich des Kontaktierungsmaterials (25) aufgebracht werden, derart, dass das Vorfixiermittel (30) dicker als das Kontaktierungsmaterial (25) ist.
Nach dem Verbinden kann auf der ersten Seite (22) des Substrates (20) und/oder auf der dem Substrat (20) zugewandten ersten Seite (52) des Elektronikbauteils (50, 51) abschnittsweise ein Rest (31) des Vorfixiermittels (30) ausgebildet sein.

Abstract translation: 提供衬底（20），特别是DCB衬底，PCB基板或引线框，具有 - ：，包括以下步骤;制造基板组件（10，10“），用于连接到一个电子元件（51 50）的方法 第一侧（22）和第二侧（23）， - 在所述衬底（20）的第一侧（22）施加分批Vorfixiermittels（30）。 本发明还涉及一种相应的基板组件（10,10“）和用于与所述基板组件（10，10连接的电子部件（50，51）的相应的方法”）。 从Bestückens的基板组件的地方（10，10“）在运输过程中与电子元件（50，51”），以接合的地方，本发明的措施，产生足够的运输中的稳定性。 所述Vorfixiermittel（30）也可以替代地或附加到在被施加部分中的电子元件（50，51）的第一侧（52）。 至基板组件（10，10“）和/或在电子部件（50，51）之前，将所述Vorfixiermittels（30）的接合材料（25）被应用。 所述Vorfixiermittel（30）能够至少部分地接合材料（25）的侧部施加，使得Vorfixiermittel（30）比所述接触材料（25）更厚。 接合之后，在所述基板（20）和所述第一侧（22）的残基（31）/或在Vorfixiermittels的部分面向所述电子元件的所述第一侧（52）（50，51）的基板（20）（30）上 来形成。

公开(公告)号：EP2717301A1

公开(公告)日：2014-04-09

申请号：EP12792349.8

申请日：2012-05-29

Applicant: Sumitomo Bakelite Co., Ltd.

Inventor： KANAMORI Naoya ,  HARADA Takahiro ,  AOKI Chiaki ,  MURAYAMA Ryuichi

IPC: H01L21/52 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60

CPC classification number: H01L23/49513 ,  C09J7/35 ,  C09J11/04 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00 ,  H01L2924/00012

Abstract: According to the present invention, a semiconductor device having superior electrical conductivity is provided. The semiconductor device (10) of the present invention is provided with a base material (2), a semiconductor element (3), and an adhesive layer (1) that adheres the base material and the semiconductor element while interposed there between. In the adhesive layer (1) of the semiconductor device (10), a metal particle and an insulating particle are dispersed, and the metal particle has flaked shape or ellipsoidal/spherical shape. As the content percentage by volume of the metal particle in the adhesive layer is a and the content percentage by volume of the insulating particles in the adhesive layer is b, the content percentage (a+b) by volume of fillers in the adhesive layer is 0.20 or more and 0.50 or less and the content percentage a/(a+b) by volume of the metal particles in the fillers is 0.03 or more and 0.70 or less.

Abstract translation: 根据本发明，提供了一种具有优良导电性的半导体器件。 本发明的半导体装置（10）具备基材（2），半导体元件（3）以及夹着该基材和半导体元件而粘接的粘接层（1）。 在半导体器件（10）的粘合层（1）中，金属颗粒和绝缘颗粒分散，并且金属颗粒具有片状或椭圆/球形。 当粘合剂层中金属颗粒的体积含量百分比为a且粘合剂层中绝缘颗粒的体积百分含量为b时，粘合剂层中填料体积百分比（a + b）为 0.20以上且0.50以下，填料中的金属粒子的体积百分比a /（a + b）为0.03以上且0.70以下。

公开(公告)号：EP2447304B1

公开(公告)日：2013-11-20

申请号：EP11008017.3

申请日：2011-10-04

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Kazunori, Kondo ,  Michihiro, Sugo ,  Hideto, Kato

IPC: C08G77/52 ,  C09J183/14

CPC classification number: H01L23/293 ,  C08G77/14 ,  C08G77/52 ,  C08L63/00 ,  C08L83/14 ,  C09J163/00 ,  C09J183/14 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/3164 ,  H01L23/556 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/8113 ,  H01L2224/81193 ,  H01L2224/8313 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15788 ,  H05K3/305 ,  H05K2201/10674 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/00014

Abstract: An object is to provide a semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and to provide an adhesive sheet using this adhesive composition. There is provided an adhesive composition comprising: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R 1 to R 4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of 1 and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0

公开(公告)号：EP2390903A4

公开(公告)日：2012-10-17

申请号：EP10733350

申请日：2010-01-20

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  OGAWA SATORU ,  NIWA MIKI

IPC: H01L21/58 ,  H01L21/60 ,  H01L33/40 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022

CPC classification number: H01L33/44 ,  H01L23/08 ,  H01L23/293 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/2712 ,  H01L2224/2745 ,  H01L2224/275 ,  H01L2224/29023 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83207 ,  H01L2224/83439 ,  H01L2224/83487 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2224/83896 ,  H01L2224/83907 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0541 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/201 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01S5/0226 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2224/05599

公开(公告)号：EP2390903A1

公开(公告)日：2011-11-30

申请号：EP10733350.2

申请日：2010-01-20

Applicant: Nichia Corporation

Inventor： KURAMOTO, Masafumi ,  OGAWA, Satoru ,  NIWA, Miki

IPC: H01L21/52 ,  H01L33/62

CPC classification number: H01L33/44 ,  H01L23/08 ,  H01L23/293 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/2712 ,  H01L2224/2745 ,  H01L2224/275 ,  H01L2224/29023 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83207 ,  H01L2224/83439 ,  H01L2224/83487 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2224/83896 ,  H01L2224/83907 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0541 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/201 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01S5/0226 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2224/05599

Abstract: An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. A method for producing a semiconductor device in which silver or silver oxide provided on a surface of a base and silver or silver oxide provided on a surface of a semiconductor element are bonded, includes the steps of arranging a semiconductor element on a base such that silver or silver oxide provided on a surface of the semiconductor element is in contact with silver or silver oxide provided on a surface of the base, temporarily bonding the semiconductor element and the base by applying a pressure or an ultrasonic vibration to the semiconductor element or the base, and permanently bonding the semiconductor element and the base by applying heat having a temperature of 150 to 900°C to the semiconductor device and the base.

Abstract translation: 本发明的一个目的是提供一种用于生产具有低电阻的导电性构件的方法，所述导电构件是用一种低成本的稳定的导电材料组合物并不含有获得，在粘接剂。 一种用于制造在其中的银或提供提供了一种半导体元件的一个表面上接合基座和银或氧化银的表面上的氧化银的半导体装置，方法包括：在基本搜索做银排列的半导体元件的步骤 或设置在半导体元件的表面上的氧化银与银或氧化银接触的方式设置的基体的表面上，所述半导体元件和通过施加压力或超声波振动将半导体元件或基极的基极临时粘结 和永久地结合所述半导体元件和通过施加具有温度150〜900℃的半导体装置和基底热基底。

公开(公告)号：EP0982385B1

公开(公告)日：2004-01-28

申请号：EP98919557.3

申请日：1998-05-11

Applicant: FUJITSU LIMITED

Inventor： DATE, Hiroaki Fujitsu Limited 1-1, Kamikodanaka ,  MOTOYAMA, Yuko Fujitsu Limited ,  TOKUHIRA, Hidesi Fujitsu Limited ,  USUI, Makoto Fujitsu Limited ,  IMAIZUMI, Nobuhiro Fujitsu Limited

IPC: C09J163/00 ,  C09J4/02 ,  C09J5/04 ,  C09J5/06 ,  H01B1/20 ,  H01L21/52

CPC classification number: H01L24/28 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29373 ,  H01L2224/29386 ,  H01L2224/2949 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83097 ,  H01L2224/83099 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/386 ,  Y10T156/1011 ,  Y10T156/1018 ,  Y10T156/1026 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A two-part adhesive, characterized by being essentially composed of an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and being separated into agent (A) containing one or two components selected from among an acrylic monomer, a peroxide and a reducing agent and agent (B) containing the other components that have not been selected for agent (A). This adhesive can constantly give a highly reliable bonding which is free from heat stress and excellent in heat resistance.

公开(公告)号：EP0982385A1

公开(公告)日：2000-03-01

申请号：EP98919557.3

申请日：1998-05-11

Applicant: FUJITSU LIMITED

Inventor： DATE, Hiroaki Fujitsu Limited 1-1, Kamikodanaka ,  MOTOYAMA, Yuko Fujitsu Limited ,  TOKUHIRA, Hidesi Fujitsu Limited ,  USUI, Makoto Fujitsu Limited ,  IMAIZUMI, Nobuhiro Fujitsu Limited

IPC: C09J163/00 ,  C09J4/02 ,  C09J5/04 ,  C09J5/06 ,  H01B1/20 ,  H01L21/52

CPC classification number: H01L24/28 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29373 ,  H01L2224/29386 ,  H01L2224/2949 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83097 ,  H01L2224/83099 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/386 ,  Y10T156/1011 ,  Y10T156/1018 ,  Y10T156/1026 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.

Abstract translation: 本发明的特征在于包括选自组分，丙烯酸类单体，过氧化物，还原剂，环氧树脂前体和固化剂的A试剂的双组分粘合剂，并且含有至少一种或两种丙烯酸类单体 ，过氧化物和还原剂，以及含有在A剂中未选择的所有剩余组分的B剂。 通过使用该粘合剂，能够以良好的耐热性和良好的可靠性稳定地获得不受热应力的结合。

公开(公告)号：JP2018129518A

公开(公告)日：2018-08-16

申请号：JP2018037437

申请日：2018-03-02

Applicant: ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー

Inventor： ミヒャエル シェーファー ,  ウォルフガング シュミット ,  アンドレアス ハインリック ,  マリア イサベル バレラ−マリン

IPC: H01L21/52 ,  H05K3/34 ,  H05K3/32

CPC classification number: H01L23/49513 ,  H01L21/6836 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68368 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27418 ,  H01L2224/27848 ,  H01L2224/29007 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/75272 ,  H01L2224/75745 ,  H01L2224/83001 ,  H01L2224/83007 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/95 ,  H01L2224/97 ,  H05K3/303 ,  H05K2203/1131 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/00012 ,  H01L2224/83

Abstract: 【課題】電子部品が装着された場所から燒結される位置に搬送されている間、搬送のロバスト性が充分な基板構造を提供する。 【解決手段】基板構造10’を製造する方法であって、電子部品と結合するために、第1の面22および第2の面23を有する基板21、21’、特にDCB基板もしくはPCB基板またはリードフレームを準備するステップと、基板21の第1の面22のいくつかの部分上へ初期固着剤30を塗布するステップとを含む。 【選択図】図5