公开(公告)号：US20100222487A1

公开(公告)日：2010-09-02

申请号：US12063087

申请日：2007-03-08

Applicant: Yasuhisa Nishi ,  Hiroaki Yoshigai ,  Mitsuyoshi Iwasa

Inventor： Yasuhisa Nishi ,  Hiroaki Yoshigai ,  Mitsuyoshi Iwasa

IPC: C08K3/36 ,  C04B35/14 ,  C03B19/10

CPC classification number: C01B13/145 ,  C01B33/12 ,  C01B33/18 ,  C01B33/181 ,  C01P2004/34 ,  C01P2004/51 ,  C01P2004/61 ,  C04B20/002 ,  C04B26/02 ,  C04B26/26 ,  C04B38/009 ,  C08K7/24 ,  H05K1/024 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y02W30/94 ,  Y10T428/2982 ,  C04B18/146 ,  C04B20/1051 ,  C04B35/14 ,  C04B38/0045 ,  C04B14/30 ,  C04B20/008 ,  C08L21/00

Abstract: Inorganic hollow powder is provided having a high purity, an enhanced fineness and a high hollowness. Specifically, inorganic hollow powder is provided having an average particle diameter of 1 to 5 μm, the maximum particle diameter of 20 μm or less, a particle size distribution standard deviation of 3 μm or less, and an average hollowness of 35 to 70 vol %. The inorganic hollow powder is obtained, for instance, by supplying, via an inorganic feed material powder supply pipe at a discharge rate of 80 m/s or more, inorganic raw material powder having a specific surface area of 500 m2/g or more and an average particle diameter of 7 μm or less, into a flame formed by a burner comprising at least a triple pipe portion sequentially arranged with, in order from outside, a combustion supporting gas supply pipe, a combustible gas supply pipe and the inorganic feed material powder supply pipe. The present inorganic hollow powder is useful when blended in rubber and/or resin, for instance, for lowering the dielectric constant in multilayer printed boards, wiring covering materials, semiconductor encapsulating materials and the like.

Abstract translation: 提供了纯度高，细度高，空心度高的无机中空粉末。 具体地，提供平均粒径为1〜5μm，最大粒径为20μm以下，粒径分布标准偏差为3μm以下，平均中空为35〜70体积％的无机中空粉末， 。 无机中空粉末例如可以通过无机原料粉末供给管以80m / s以上的排出量供给比表面积为500m 2 / g以上的无机原料粉末， 平均粒径为7μm以下，由燃烧器形成的火焰构成，所述燃烧器至少包括从燃烧辅助气体供给管，可燃性气体供给管和无机供给材料的外部依次排列的三重管部 粉末供应管。 当混合在橡胶和/或树脂中时，本发明的无机中空粉末可用于降低多层印刷电路板，布线覆盖材料，半导体封装材料等中的介电常数。

公开(公告)号：US20060142424A1

公开(公告)日：2006-06-29

申请号：US11333940

申请日：2006-01-18

Applicant: Jayesh Shah ,  Paul Morganelli ,  David Peard

Inventor： Jayesh Shah ,  Paul Morganelli ,  David Peard

IPC: C08J9/32

CPC classification number: H01L21/563 ,  C08J9/32 ,  C08J2203/22 ,  C08J2207/02 ,  C08K3/04 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/73203 ,  H01L2224/83856 ,  H01L2924/01087 ,  H01L2924/01322 ,  H05K3/305 ,  H05K2201/0254 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/306 ,  Y02P70/613

Abstract: A thermoplastic or thermosetting B-stageable or pre-formed film underfill encapsulant composition that is used in the application of electronic components to substrates. The composition comprises a resin system comprising thermoplastic or thermally curable resin, an expandable microsphere, a solvent, and optionally a catalyst. Various other additives, such as adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant may be dried or B-staged to provide a coating on the substrate or component that is smooth and non-tacky. In an alternative embodiment, the underfill encapsulant is a pre-formed film. In both embodiments the expandable filler material expands upon the application of higher temperatures to form a closed-cell foam structure in the desired portion of the assembly.

Abstract translation: 用于将电子部件应用于基材的热塑性或热固性B阶或预成型薄膜底部填充密封剂组合物。 该组合物包括包含热塑性或热可固化树脂，可膨胀微球，溶剂和任选的催化剂的树脂体系。 还可以根据需要添加各种其它添加剂，例如粘合促进剂，流动添加剂和流变改性剂。 底部填充密封剂可以被干燥或分级以在基材或组分上提供光滑和非粘性的涂层。 在替代实施例中，底部填充密封剂是预成形膜。 在两个实施方案中，可膨胀填充材料在施加较高温度时膨胀以在组件的所需部分中形成闭孔泡沫结构。

公开(公告)号：US20050277753A1

公开(公告)日：2005-12-15

申请号：US11177362

申请日：2005-07-11

Applicant: Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

Inventor： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

IPC: C08J5/18 ,  C08F2/40 ,  C08F2/44 ,  C08F4/00 ,  C08F4/32 ,  C08F12/08 ,  C08F12/34 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  C08F291/00 ,  C08K5/01 ,  H01B3/44

CPC classification number: C08K5/01 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  C08L65/00 ,  C08F236/02

Abstract: According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

公开(公告)号：US06930140B2

公开(公告)日：2005-08-16

申请号：US10649950

申请日：2003-08-28

Applicant: Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

Inventor： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

IPC: C08J5/18 ,  C08F2/40 ,  C08F2/44 ,  C08F4/00 ,  C08F4/32 ,  C08F12/08 ,  C08F12/34 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  C08F291/00 ,  C08K5/01 ,  H01B3/44 ,  C08L9/00

CPC classification number: C08K5/01 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  C08L65/00 ,  C08F236/02

Abstract: According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

Abstract translation: 根据本发明，提供一种低介电损耗角正切树脂组合物，其含有重均分子量不大于1000的交联组分和多个苯乙烯基团并由式[1]表示，其中R为 可以具有取代基的烃骨架，R 1是氢，甲基或乙基，m是1-4的整数，n是2或更大的整数，并且还包含至少一个选自 从重均分子量不小于5,000的高分子量和填料，该树脂组合物可以得到具有良好柔软性，高拉伸强度和低介电常数和介电损耗角正切的固化产物。

公开(公告)号：US20050006442A1

公开(公告)日：2005-01-13

申请号：US10616617

申请日：2003-07-10

Applicant: Morris Stillabower

Inventor： Morris Stillabower

IPC: H05K3/34 ,  B23K31/02 ,  H01L23/48

CPC classification number: H05K3/3484 ,  H01L2224/16225 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0254 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32 or 42). The stand-off members (32 or 42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.

Abstract translation: 提供一种电子封装（10），其包括具有衬底（14）和电路（16）的电路板（12）和具有接触端子（24）的表面安装器件（22）。 在电路板（12）上形成安装垫（28）。 电子封装（10）还包括将表面安装器件（22）的接触端子（24）连接到电路板（12）上的安装焊盘（28）的焊接接头（30）。 焊接接头（30）包括可回流焊料和多个分离构件（32或42）。 分离构件（32或42）在电路板（12）和表面安装装置（22）之间提供在约0.01mm至0.10mm的范围内的间隔距离（H）。

公开(公告)号：US06835331B2

公开(公告)日：2004-12-28

申请号：US10196216

申请日：2002-07-17

Applicant: Hironao Fujiki ,  Motoo Fukushima

Inventor： Hironao Fujiki ,  Motoo Fukushima

IPC: H01B124

CPC classification number: H01B1/22 ,  C08G65/007 ,  C08G65/336 ,  C08G77/12 ,  C08G77/20 ,  C08G77/46 ,  C08K9/02 ,  C08L83/04 ,  H01B1/20 ,  H05K1/095 ,  H05K2201/0221 ,  H05K2201/0254 ,  H05K2203/159 ,  C08L83/00

Abstract: A conductive composition is obtained by dispersing conductive particles in a curable polymer. At least 50% by weight of the entire conductive particles are those conductive particles coated with a metal on their outermost layer surface and having a specific gravity which differs within ±1.5 from the specific gravity of the curable polymer. The composition remains stable during storage, experiences a minimal change with time of curability, and cures into a conductive rubber which experiences a minimal change with time of volume resistivity.

Abstract translation: 通过将导电颗粒分散在可固化聚合物中来获得导电组合物。 整个导电颗粒的至少50重量％是在其最外层表面上涂覆有金属的导电颗粒，其比重与可固化聚合物的比重不同在±1.5内。 该组合物在储存期间保持稳定，经受可固化性随时间的最小变化，并且固化成导电橡胶，其经历体积电阻率随时间的最小变化。

公开(公告)号：US20030107026A1

公开(公告)日：2003-06-12

申请号：US10196216

申请日：2002-07-17

Inventor： Hironao Fujiki ,  Motoo Fukushima

IPC: H01C001/00 ,  H01B001/00

CPC classification number: H01B1/22 ,  C08G65/007 ,  C08G65/336 ,  C08G77/12 ,  C08G77/20 ,  C08G77/46 ,  C08K9/02 ,  C08L83/04 ,  H01B1/20 ,  H05K1/095 ,  H05K2201/0221 ,  H05K2201/0254 ,  H05K2203/159 ,  C08L83/00

Abstract: A conductive composition is obtained by dispersing conductive particles in a curable polymer. At least 50% by weight of the entire conductive particles are those conductive particles coated with a metal on their outermost layer surface and having a specific gravity which differs within null1.5 from the specific gravity of the curable polymer. The composition remains stable during storage, experiences a minimal change with time of curability, and cures into a conductive rubber which experiences a minimal change with time of volume resistivity.

Abstract translation: 通过将导电颗粒分散在可固化聚合物中来获得导电组合物。 整个导电颗粒的至少50重量％是在其最外层表面上涂覆有金属的导电颗粒，其比重与可固化聚合物的比重不同在±1.5内。 该组合物在储存期间保持稳定，经受可固化性随时间的最小变化，并且固化成导电橡胶，其经历体积电阻率随时间的最小变化。

公开(公告)号：US5354611A

公开(公告)日：1994-10-11

申请号：US71345

申请日：1993-05-28

Applicant: David J. Arthur ,  Gwo S. Swei ,  Phong X. Nguyen

Inventor： David J. Arthur ,  Gwo S. Swei ,  Phong X. Nguyen

IPC: C08K7/28 ,  C08K9/04 ,  H05K1/03 ,  B32B18/00

CPC classification number: H05K1/0373 ,  C08K7/28 ,  C08K9/04 ,  H05K1/034 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0254 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2982 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: A composite material is disclosed. The material comprises a polymeric matrix and from about 20 volume percent to about 70 volume percent inorganic particles distributed throughout the matrix. Suitable inorganic particles include hollow inorganic microspheres and porous inorganic particles. The inorganic particles are coated with a surface coating. The composite material of the present invention exhibits a dielectric constant of less than about 2.5 and a thermal coefficient of expansion of less than about 70 ppm/.degree.C.

Abstract translation: 公开了一种复合材料。 该材料包括聚合物基质和分布在整个基质中的约20体积％至约70体积％的无机颗粒。 合适的无机颗粒包括中空无机微球和多孔无机颗粒。 无机颗粒用表面涂层涂覆。 本发明的复合材料的介电常数小于约2.5，热膨胀系数小于约70ppm /℃。

公开(公告)号：US5194459A

公开(公告)日：1993-03-16

申请号：US650335

申请日：1991-02-04

Applicant: Yoshiaki Sato ,  Sakuko Kaneda

Inventor： Yoshiaki Sato ,  Sakuko Kaneda

IPC: C08K7/22 ,  C08J9/32 ,  C08K7/00 ,  C08L27/12 ,  H01B3/44 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08J9/32 ,  H01B3/445 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/249971

Abstract: An insulating material formed from a network of hollow gas-filled microspheres embedded in a cured three-dimensional cross-linked polymer network of copolymerized unsaturated fluorinated monomers and acrylic monomers reacted in a fluorinated organic solvent.

公开(公告)号：US5098781A

公开(公告)日：1992-03-24

申请号：US635087

申请日：1990-12-28

Applicant: Michael G. Minnick ,  Rakesh Jain

Inventor： Michael G. Minnick ,  Rakesh Jain

IPC: B32B7/02 ,  B32B15/08 ,  C08G59/00 ,  C08K7/00 ,  C08K7/02 ,  C08K7/16 ,  C08K7/28 ,  C08L63/02 ,  C08L71/00 ,  C08L71/12 ,  C08L79/08 ,  H05K1/03

CPC classification number: H05K1/036 ,  B32B15/08 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10S428/901 ,  Y10T428/249971 ,  Y10T428/249972 ,  Y10T428/249974 ,  Y10T428/31522 ,  Y10T442/656

Abstract: The present invention is directed to a metal-clad electrical laminate which comprises a core of one or more of a polyetherimide thermoplastic, polyphenylene oxide thermoplastic, or a resinous-filled reinforced substrate. A pair of intermediate layers of hollow glass microsphere-filled polyphenylene oxide/epoxy is bound to either side of the core. Finally, a pair of metal foil layers are bound to the filled intermediate layers to produce the laminate of the present invention. The laminate desirably has a thickness of less than about 0.010 in., a dielectric constant of about 3 or less, and a HGM content in excess of about 10 wt-%. Additionally, the laminate has a softening point sufficiently high to avoid substantial distortion at processing temperatures of around 200.degree.-235.degree. C.