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    SMT enabled microwave package with waveguide interface
    81.
    发明公开
    SMT enabled microwave package with waveguide interface 审中-公开
    SMT-fähigesMikrowellenbauteil mit Wellenleiterschnittstelle

    公开(公告)号：EP1923950A1

    公开(公告)日：2008-05-21

    申请号：EP06425785.0

    申请日：2006-11-17

    Applicant: Siemens S.p.A.

    Inventor： Bonato, Paolo ,  Buoli, Carlo ,  Cifelli, Antonio ,  Fusaroli, Stefano ,  Morgia, Fabio ,  Negri, Luigi ,  Trombetta, Antonella ,  Turillo, Tommaso

    IPC: H01P5/107

    CPC classification number: H01P5/107 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K1/0272 ,  H05K2201/037 ,  H05K2201/096 ,  H05K2201/10666 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A microwave package for surface mount technology (SMT) integrates in its multilayer structure a waveguide interface comprising a microstrip to rectangular waveguide transition. The transition includes a patch at the end of a launching microstrip faced to a slot which is dug into a copper plate 0.5 mm thick, constituting the ground plane for the topmost microstrip layout and thermal sink for MMICs supported on it. The slot acts as an iris allowing propagation of fundamental TE 10 mode into a waveguide interface including a parallelepipedal cavity dug into the thickness of copper laminate under and around it starting from the bottom of the multilayer. The metallized cavity extends until the ground plane at the bottom with a cross-section preferably equally dimensioned as the external waveguide. The metallization of the cavity walls joins the ground plane at the bottom without breaking the continuity. Metallization of ground plane continues along the very narrow side walls determined by the thickness of multilayer. A metal lid is soldered along a metallized perimetrical frame on the upper layer. The lid is internally carved to obtain a cavity faced to the transition for reflecting back to the slot the power irradiated upwards. The ground plane on the bottom face includes the mouth of the internal waveguide tract, and the contacting beams for an external layout of the supporting PCB. The package is ready to be soldered to a PCB including in its turn a very short waveguide tract in its thickness between the mouth of the package and a metallic waveguide dug into the supporting mechanics (fig.10)

    Abstract translation: 用于表面贴装技术的微波封装（SMT）在其多层结构中集成了包括微带至矩形波导过渡的波导接口。 该转换包括在发射微带的末端处的贴片，该贴片面向0.5mm厚的铜板的槽，构成最上面的微带布局的接地平面以及支持MMIC的散热器。 狭缝充当虹膜，允许将基本TE 10模式传播到波导界面中，波导界面包括从多层的底部开始并在其周围的铜层压体的厚度中的平行六面体腔。 金属化空腔延伸到底部的接地平面，其横截面优选地与外部波导的尺寸相同。 空腔壁的金属化连接在底部的接地平面，而不破坏连续性。 接地面的金属化沿着由多层厚度确定的非常窄的侧壁继续。 金属盖沿着上层的金属化周边框架焊接。 内部雕刻盖子以获得面向过渡部的空腔，以向后反射到向上的功率反射。 底面上的接地面包括内部波导管的口，以及支撑PCB的外部布局的接触梁。 该封装已经准备好被焊接到PCB，其中包括一个非常短的波导管，其厚度在封装的口部和一个金属波导管被挖掘到支撑机构之间（图10）

    Circuit board with microelectronic elements assembled thereon and method for producing such circuit board
    82.
    发明公开
    Circuit board with microelectronic elements assembled thereon and method for producing such circuit board 审中-公开
    其上安装有微电子组件和方法的印刷电路板用于制造这样的印刷电路板

    公开(公告)号：EP1784063A1

    公开(公告)日：2007-05-09

    申请号：EP05300903.1

    申请日：2005-11-08

    Applicant: Alcatel Lucent

    Inventor： Peulevey, Nicolas ,  Aucourt, Jerome

    IPC: H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/02 ,  H01P5/107

    CPC classification number: H05K1/0237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H05K1/0272 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/043 ,  H05K2201/09981 ,  H05K2203/061 ,  H05K2203/063 ,  H01L2924/00014

    Abstract: Circuit board (1) and method of producing thereof, the circuit board having a cavity for microstrip to waveguide transition means (2) defined by a hollow space on the walls of which a protection layer (21) is provided. A microelectronic substrate (33) is placed upon an adhesive film (31) adhered onto a surface of the circuit board (1), the adhesive film being pre-cut in selected areas (32) thereof providing openings therethrough. A metal layer (5) is disposed on the resulting structure, wherein a selected part (51) of the metal layer (5) present on a surface of microelectronics substrate (33), facing the hollow space defined by the cavity for microstrip to waveguide transition means (2) is removed.

    Abstract translation: 及其生产的电路板（1）和方法，具有（2）的中空空间中设置保护层（21），其中在墙壁上限定为微带到波导转变装置A空腔电路板上。 一种微电子衬底（33）时的粘合剂膜粘附到所述电路板（1）的表面（31）放置，所述粘合剂膜被预切割成选定区域（32）穿过其设置开口那里。 的金属层（5）设置在所得到的结构，worin金属层（5）的选定部分（51）本（33）的微电子衬底的表面上，对着用于微带到波导由空腔限定的中空空间 过渡装置（2）被除去。

    A method of producing a lighting device, and a corresponding lighting device
    85.
    发明公开
    A method of producing a lighting device, and a corresponding lighting device 有权
    一种用于制造照明装置和相应的照明装置的方法

    公开(公告)号：EP2562470A2

    公开(公告)日：2013-02-27

    申请号：EP12180113.8

    申请日：2012-08-10

    Applicant: OSRAM GmbH ,  OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERICI

    Inventor： Katzler, Gerald ,  Scordino, Alessandro ,  Zanon, Franco

    IPC: F21S4/00 ,  F21V23/06 ,  H05K3/28 ,  H05K3/40 ,  H01R12/51 ,  F21Y101/02

    CPC classification number: F21S4/003 ,  F21S4/20 ,  F21V23/06 ,  F21Y2115/10 ,  H01R12/52 ,  H01R12/718 ,  H01R13/10 ,  H01R13/11 ,  H05K1/0293 ,  H05K1/189 ,  H05K3/284 ,  H05K3/403 ,  H05K2201/037 ,  H05K2201/10106 ,  H05K2201/1031 ,  H05K2203/0228 ,  H05K2203/1316 ,  Y02P70/611 ,  Y10T29/49002

    Abstract: A method for producing lighting devices, comprising at least one lighting module (20). The method comprises the stages of:
    - providing a plurality of lighting modules (20), wherein each lighting module comprises a first set of contacts placed at a first end of said lighting module (20) and a second set of contacts (204c, 204d) placed in corresponding positions at a second end of said lighting module (20);
    - connecting together a plurality of the lighting modules (20) for forming a series of lighting modules (20), wherein each lighting module (20a) is connected to the next lighting module (20b) by means of interconnecting elements (10) which connect the first set of contacts of each lighting module (20a) to the second set of contacts of the next lighting module (20b); and
    - cutting the series of lighting modules (20) in lighting devices comprising at least one lighting module (20), wherein the interconnecting elements (10) of the last lighting module of each lighting device are cut along their transverse axes. In particular, the interconnecting elements (10) comprise a base plate and a hollow portion in order to form female connectors when the interconnecting elements (10) are cut along their transverse axes.

    Abstract translation: 一种用于制造照明装置的方法，包括至少一个发光模块（20）。 该方法包括以下阶段： - 提供照明模块有多个（20），worin每个照明模块包括第一组在所述发光模块的第一端部（20）和第二组触点（204c的放置触点，204D ）摆在相应的位置，在所述发光模块的第二端部（20）; - 连接在一起的照明模块的多个（20），用于形成一系列的照明模块（20），worin每个照明模块（20A），借助于连接到下一个发光模块（20b）的相互连接的元件（10）连接的 第一组与第二组中的下一个发光模块的触点的每个照明模块（20A）的触头（20B）; 和 - 切割所述系列的发光模块（20）的照明装置，包括至少一个发光模块（20），每个worin照明装置的负载照明模块的互连元件（10）沿着它们的横向轴线被切割。 特别地，所述互连元件（10），以形成阴连接器包括一个底板和一个中空部。当互连元件（10）沿着它们的横轴切割。

    COMPOSANT MINIATURE HYPERFREQUENCES POUR MONTAGE EN SURFACE
    86.
    发明公开
    COMPOSANT MINIATURE HYPERFREQUENCES POUR MONTAGE EN SURFACE 审中-公开
    MINIATURMIKROWELLENKOMPONENTEFÜROBERFLÄCHENMONTAGE

    公开(公告)号：EP2430701A1

    公开(公告)日：2012-03-21

    申请号：EP10714320.8

    申请日：2010-04-22

    Applicant: United Monolithic Semiconductor S.A.S.

    Inventor： ALLEAUME, Pierre-Franck ,  TOUSSAIN, Claude

    IPC: H01P5/02 ,  H01P5/107 ,  H01L23/00 ,  H05K1/18

    CPC classification number: H01P5/028 ,  H01L23/047 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01P5/107 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/09072 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: The invention relates to a miniature microwave component, comprising: an MMIC microwave chip (100) encapsulated in an individual housing (222) for surface-mounting capable of operating at a frequency F0 much higher than 45 GHz; at least one contactless microwave access (124), by electromagnetic coupling, ensuring the transmission of coupling signals at a operating frequency F0. The component comprises a passive multilayer integrated circuit (220) having metallized layers and layers made of a dielectric material (140, 142, 144), a top surface (224), a metallized bottom surface (225), the metallized bottom surface comprising, on the side of the contactless microwave access (124), an opening (236) in the metallization through which electromagnetic waves can pass for coupling by the contactless microwave access and, between two layers of dielectric material, a metallized layer (146) having at least one electromagnetic coupling electric conductor (148) connected to the electronic components of the chip (100), said coupling electric conductor (148) being located next to the contactless microwave access (124) in order to ensure the transmission of microwave signals by electromagnetic coupling at the operating frequency F0. The invention can be used in automobile radars and high-bandwidth communications.

    Abstract translation: 微型组件包括封装在单个封装中的MMIC微波芯片，用于表面安装，能够以非常高于45GHz的频率F0工作; 和至少一个非接触微波端口，通过电磁耦合，确保工作频率F0的耦合信号的传输。 该组件包括具有金属化层和电介质材料层的无源多层集成电路，顶面，金属化底面，金属化底面包括在非接触式微波端口侧的金属化中的开口，用于通过 经由非接触微波端口的耦合电磁波和介于两层电介质材料之间的金属化层具有连接到芯片的电子元件的至少一个电磁耦合电导体，所述耦合电导体位于非接触式 微波端口，确保工作频率F0通过电磁耦合传输微波信号。

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