公开(公告)号：US20090153007A1

公开(公告)日：2009-06-18

申请号：US12212986

申请日：2008-09-18

Applicant: WEN-JANG JIANG

Inventor： WEN-JANG JIANG

IPC: H01J7/24 ,  H01J9/00

CPC classification number: H05K1/0203 ,  H01L33/645 ,  H01L35/30 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  H05K1/145 ,  H05K2201/10106 ,  H05K2201/10219 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light source module includes a light source and an thermoelectric cooler. The thermoelectric cooler includes a first base board, a second base board and a number of thermoelectric cooling units. The first base board includes a first surface and an opposing second surface. The second base board includes a top surface and a bottom surface. The light source is defined on the first surface of the first base board. The thermoelectric cooling units are disposed between the first surface of the first base board and the top surface of the second base board, and are configured for transferring heat generated from the light source from the first base board to the second base board.

Abstract translation: 光源模块包括光源和热电冷却器。 热电冷却器包括第一基板，第二基板和多个热电冷却单元。 第一基板包括第一表面和相对的第二表面。 第二基板包括顶表面和底表面。 光源被限定在第一基板的第一表面上。 热电冷却单元设置在第一基板的第一表面和第二基板的顶表面之间，并且被配置为将从光源产生的热量从第一基板传递到第二基板。

公开(公告)号：US20090032080A1

公开(公告)日：2009-02-05

申请号：US12195538

申请日：2008-08-21

Applicant: Yasuhiro Kawauchi ,  Takanori Nakamura

Inventor： Yasuhiro Kawauchi ,  Takanori Nakamura

IPC: H01L35/02 ,  H01L21/00

CPC classification number: H01L35/32 ,  H01L35/34 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/10219

Abstract: A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.

Abstract translation: 小型高性能热电转换模块包括具有多个绝缘层，p型热电半导体和通过用于制造多层电路板的技术形成的n型热电半导体的层压体，特别是形成通孔导体的技术 。 p型热电半导体和n型热电半导体的对通过p-n连接导体串联电连接以限定热电转换元件对。 热电转换元件对通过例如串联布线导体串联连接。 热电半导体各自具有多个热电元件的峰值温度彼此不同的部分。 这些部分沿层叠体的层叠方向分布。

公开(公告)号：US06327149B1

公开(公告)日：2001-12-04

申请号：US09655558

申请日：2000-09-06

Applicant: Lakhi Nandlal Goenka

Inventor： Lakhi Nandlal Goenka

IPC: H05K720

CPC classification number: H05K1/0209 ,  H01L23/38 ,  H01L2924/0002 ,  H05K2201/0361 ,  H05K2201/09781 ,  H05K2201/10219 ,  Y10T428/252 ,  H01L2924/00

Abstract: A multi-layer circuit board with a thermoelectric or “Peltier” cooler and a method forming a multi-layer circuit board with a thermoelectric or “Peltier” cooler is disclosed. The circuit board includes a thermoelectric cooler which is integrally formed within the circuit board and which is effective to efficiently absorb and dissipate heat from the circuit board.

Abstract translation: 公开了一种具有热电或“珀尔帖”冷却器的多层电路板，以及形成具有热电或“珀尔帖”冷却器的多层电路板的方法。 电路板包括一体形成在电路板内的热电冷却器，其有效地有效地吸收和散发来自电路板的热量。

公开(公告)号：US20230393516A1

公开(公告)日：2023-12-07

申请号：US18250100

申请日：2021-11-10

Applicant: Kenichi WATANABE

Inventor： Kenichi WATANABE

IPC: G03G15/00 ,  H05K1/02 ,  H10N10/13 ,  H10N10/82

CPC classification number: G03G15/80 ,  H05K1/0203 ,  H10N10/13 ,  H10N10/82 ,  H05K2201/10219

Abstract: To provide a control board for efficiently generating electric energy in a power generating device from heat generated from an electronic device. A control board includes a board including a first heat dissipating pad; an electronic device including a second heat dissipating pad to dissipate heat; a power generating device including a Peltier device which converts heat energy generated from the electronic device into electric energy, wherein the power generating device is sandwiched between the first heat dissipating pad and the second heat dissipating pad; and a power supply circuit configured to reuse the electric energy.

公开(公告)号：US11700886B2

公开(公告)日：2023-07-18

申请号：US16759439

申请日：2018-10-26

Applicant: KT&G CORPORATION

Inventor： Tae Hun Kim ,  Hun Il Lim ,  Jong Sun Park

IPC: A24F15/01 ,  A24F40/46 ,  A24B15/167 ,  A24F40/42 ,  A24F40/90 ,  A24F40/20 ,  A24F40/30 ,  A24D3/17 ,  A24D1/20 ,  A24F40/60 ,  F21V3/00 ,  F21V5/00 ,  G02B19/00 ,  H05B3/54 ,  A24F40/485 ,  A24F40/10 ,  A24F40/44 ,  A24F40/40 ,  A24F40/57 ,  A24F40/65 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  A24F40/50 ,  A24F40/95 ,  A24F40/51 ,  F21Y115/10

CPC classification number: A24F40/42 ,  A24B15/167 ,  A24D1/20 ,  A24D3/17 ,  A24F15/01 ,  A24F40/10 ,  A24F40/20 ,  A24F40/30 ,  A24F40/40 ,  A24F40/44 ,  A24F40/46 ,  A24F40/485 ,  A24F40/50 ,  A24F40/57 ,  A24F40/60 ,  A24F40/65 ,  A24F40/90 ,  A24F40/95 ,  F21V3/00 ,  F21V5/00 ,  G02B19/0009 ,  G02B19/0061 ,  H05B3/54 ,  H05K1/0203 ,  H05K1/0277 ,  H05K1/148 ,  H05K1/181 ,  A24F40/51 ,  F21Y2115/10 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/10219

Abstract: Provided is a heater assembly for aerosol generating devices, the heater assembly including a thermally conductive element that has a cylindrical shape and includes an accommodation space for accommodating a cigarette, a flexible heater that surrounds at least a portion of an outer surface of the thermally conductive element, and an adhesion member that surrounds the flexible heater such that the flexible heater closely adheres to the thermally conductive element.

公开(公告)号：US09974180B2

公开(公告)日：2018-05-15

申请号：US14801686

申请日：2015-07-16

Applicant: Apple Inc.

Inventor： Shayan Malek ,  David A. Pakula ,  Gregory N. Stephens ,  Sawyer I. Cohen ,  Scott A. Myers ,  Tyler B. Cater ,  Eric W. Bates

IPC: G06F1/16 ,  H05K1/18

CPC classification number: H05K1/181 ,  G06F1/1658 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10598 ,  Y02P70/611

Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff. The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.

公开(公告)号：US20180123014A1

公开(公告)日：2018-05-03

申请号：US15566784

申请日：2016-04-22

Applicant: Robert Bosch GmbH

Inventor： Tobias Zoller ,  Ricardo Ehrenpfordt ,  Holger Rank ,  Frederik Ante

IPC: H01L35/32 ,  H01L35/06 ,  H01L35/10 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/06 ,  H01L35/10 ,  H01L35/34 ,  H01L2224/48091 ,  H05K1/0271 ,  H05K1/0277 ,  H05K2201/09063 ,  H05K2201/10219 ,  H05K2203/049 ,  H05K2203/308 ,  H01L2924/00014

Abstract: A thermoelectric device includes a printed circuit board, a component which is arranged on the printed circuit board, a cover which covers the printed circuit board, a thermoelectric generator, and a spring unit. The thermoelectric generator is thermally connected to the printed circuit board or metal paths on the printed circuit board and to the cover in order to generate an electric supply voltage for the component from the temperature difference between the printed circuit board and the cover. The spring unit elastically holds the thermoelectric generator between the printed circuit board and the cover.

公开(公告)号：US09913405B2

公开(公告)日：2018-03-06

申请号：US14668017

申请日：2015-03-25

Applicant: International Business Machines Corporation

Inventor： Jeffrey P. Gambino ,  Richard S. Graf ,  Sudeep Mandal ,  David J. Russell

IPC: H01L21/00 ,  H05K7/20 ,  H01L35/34 ,  H01L23/15 ,  H01L23/38 ,  H05K1/03 ,  H01L23/13 ,  H01L23/00

CPC classification number: H05K7/2039 ,  H01L23/13 ,  H01L23/15 ,  H01L23/38 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L35/34 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/0306 ,  H05K2201/10219 ,  H05K2201/10378 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate.

公开(公告)号：US09883598B2

公开(公告)日：2018-01-30

申请号：US15289950

申请日：2016-10-10

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Ming-Hao Wu ,  Cheng-Po Yu

IPC: H01L35/30 ,  H05K3/46 ,  H05K1/18 ,  H05K1/02 ,  G06F1/20 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H01L23/12

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

公开(公告)号：US20170257975A1

公开(公告)日：2017-09-07

申请号：US15601256

申请日：2017-05-22

Applicant: Honeywell International Inc.

Inventor： Peter Charles Strickland ,  Sergiy Borysenko ,  Bradley Jessup

IPC: H05K7/20 ,  H05K3/06 ,  H05K1/02

CPC classification number: H05K7/20 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/06 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10219 ,  Y10T29/49156 ,  Y10T29/49361

Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.