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公开(公告)号：JP2018506855A
公开(公告)日：2018-03-08
申请号：JP2017541957
申请日：2016-02-01
Inventor： カーリン ベアート , シュテファン ミュラー , トーマス シュミット , ベアンハート シューフ , フリーダー ヴィットマン
CPC classification number: H05K1/181 , H05K1/0204 , H05K1/11 , H05K3/0061 , H05K3/321 , H05K3/341 , H05K7/205 , H05K2201/066 , H05K2201/09745 , H05K2201/10227 , H05K2201/10545 , H05K2201/1056 , H05K2203/049
Abstract: 本発明は、2つの対向する平面側(1.2,1.3)と複数の電子部品(2)とを備えたプリント回路基板(1)と、ベースプレート(3)とを含んでいる、電子コンポーネント(E)に関している。本発明によれば、複数の電子部品(2)のうちの所定の数の電子部品(2)は、プリント回路基板(1)の裏平面側(1.2)に、および複数の電子部品(2)のうちのさらなる数の電子部品(2)は、プリント回路基板(1)の表平面側(1.3)にそれぞれ固定され、かつ当該プリント回路基板と導電的に接続されており、ベースプレート(3)は、プリント回路基板(1)の裏平面側(1.2)に配置された複数の電子部品(2)を収容するための少なくとも1つの第1の凹部(3.1)を有していることが想定される。さらに本発明は、そのような電子コンポーネント(E)を製造するための方法に関している。
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公开(公告)号：JP2017107628A
公开(公告)日：2017-06-15
申请号：JP2015242585
申请日：2015-12-11
Applicant: 日東電工株式会社
CPC classification number: H05K1/05 , G11B5/4826 , G11B5/4853 , H05K1/11 , H05K3/4007 , H05K3/44 , G11B5/484 , H05K2201/10227
Abstract: 【課題】接続端子を、スライダの端子に対して確実に接続させることのできる回路付サスペンション基板、および、回路付サスペンション基板の製造方法を提供すること。 【解決手段】 回路付サスペンション基板1は、金属支持基板8と、金属支持基板8の上に配置されるベース絶縁層9と、ベース絶縁層9の上に配置され、スライダ4と電気的に接続されるヘッド側端子58を備える導体層10とを備え、ベース絶縁層9は、厚み方向に投影したときに、少なくともヘッド側端子58と重なる端子領域62と、端子領域62と重ならず、かつ、端子領域62の周辺の周辺領域63とを有し、端子領域62の厚みは、周辺領域63の厚みよりも厚い。 【選択図】図3
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公开(公告)号：US12052823B2
公开(公告)日：2024-07-30
申请号：US17864562
申请日：2022-07-14
Inventor： Chia-Kang Wu , Kun-Yang Cheng
IPC: H05K1/14
CPC classification number: H05K1/14 , H05K2201/09063 , H05K2201/10227 , H05K2201/2027
Abstract: A guiding device includes a first telescopic member, a second telescopic member, and an elastic member. The first telescopic member includes a main body with a sliding cavity. The second telescopic member includes a connecting portion and a guiding portion connected to the connecting portion. The guiding portion is slidably inserted into the sliding cavity. Opposite ends of the elastic member are respectively connected to the connecting portion and the main body. The elastic member pushes the main body in a direction away from the connecting portion. The disclosure also provides a mainboard connection structure having the above guiding device.
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公开(公告)号：US20180027657A1
公开(公告)日：2018-01-25
申请号：US15491921
申请日：2017-04-19
Applicant: MACOM Technology Solutions Holdings, Inc.
Inventor： Jessica Aldrich , Paul Hogan
CPC classification number: H05K1/181 , H05K1/11 , H05K3/301 , H05K3/32 , H05K2201/1003 , H05K2201/10227 , H05K2201/10265 , H05K2201/10484
Abstract: A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.
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公开(公告)号：US09860982B1
公开(公告)日：2018-01-02
申请号：US15442699
申请日：2017-02-26
Applicant: XSENSOR Technology Corporation
Inventor： Ian Main , Timothy Carl Gorjanc
CPC classification number: H05K1/09 , H05K1/028 , H05K1/038 , H05K1/05 , H05K3/32 , H05K3/328 , H05K3/4644 , H05K2201/0129 , H05K2201/0137 , H05K2201/10227 , H05K2203/11
Abstract: A process makes electrical connections between electrical wires and flexible conductive elements, such as conductive fabrics. The process makes strong electrical connections that are mechanically flexible and can simultaneously create multiple electrical connections. The process involves creating an assembly that includes at least a TPE layer, an electrical wire, an insulating layer, and a flexible conductive element, and applying heat and pressure to the assembly. For example, a conductive fabric is disposed on an insulating layer, a wire is positioned onto a surface of the insulating layer, and a TPE layer is disposed over the wire and overlaps the conductive fabric element. When applying the heat and pressure, the wire melts through the insulating layer to make electrical contact with the conductive fabric element, and the TPE layer conforms to an exterior of the wire and bonds to the insulating layer.
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Patent Agency Ranking
公开(公告)号：US20170339790A1
公开(公告)日：2017-11-23
申请号：US15674273
申请日：2017-08-10
Applicant: Conti Temic microelectronic GmbH
Inventor： Frieder Wittmann , Karin Beart , Stefan Müller , Thomas Schmidt , Bernhard Schuch
CPC classification number: H05K1/181 , H05K1/0204 , H05K1/11 , H05K3/0061 , H05K3/321 , H05K3/341 , H05K7/205 , H05K2201/066 , H05K2201/09745 , H05K2201/10227 , H05K2201/10545 , H05K2201/1056 , H05K2203/049
Abstract: The disclosure relates to an electronic component that includes a printed circuit board with two opposite flat sides and a plurality of electronic components, and a base plate. A number of the electronic components are each fixed on and electrically conductively connected to a rear flat side of the printed circuit board and a further number of the electronic components are each fixed on and electrically conductively connected to a front flat side of the printed circuit board. The base plate has at least one first cutout for receiving electronic components that are arranged on the rear flat side of the printed circuit board. The disclosure also relates to a method for producing an electronic component of this kind.
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公开(公告)号：US09474153B2
公开(公告)日：2016-10-18
申请号：US14885405
申请日：2015-10-16
Applicant: International Business Machines Corporation
Inventor： Ai Kiar Ang , Michael Lauri
IPC: H01L23/02 , H05K1/11 , H05K1/18 , H05K3/32 , H05K3/34 , H05K1/14 , H01L23/495 , H01L25/10 , H01L25/00
CPC classification number: H05K1/11 , H01L21/4839 , H01L23/49537 , H01L23/49555 , H01L23/49565 , H01L23/49575 , H01L25/105 , H01L25/50 , H01L2225/1029 , H01L2924/181 , H05K1/0313 , H05K1/144 , H05K1/18 , H05K1/181 , H05K3/328 , H05K3/341 , H05K3/3421 , H05K3/3426 , H05K2201/10015 , H05K2201/10227 , H05K2201/10515 , H05K2201/1053 , H05K2201/10962 , Y02P70/613 , H01L2924/00012
Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
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公开(公告)号：US20160284310A1
公开(公告)日：2016-09-29
申请号：US15078268
申请日：2016-03-23
Applicant: FANUC Corporation
Inventor： Hiroshi OKITA , Tohru NISHI
CPC classification number: G09G5/005 , G06F1/16 , G06F1/1601 , G09G5/006 , G09G5/363 , G09G2320/08 , G09G2370/042 , H05K1/02 , H05K1/144 , H05K1/147 , H05K2201/10128 , H05K2201/10227
Abstract: Disclosed is a display unit provided with a display control printed circuit board with a circuit configured to generate a display signal for display by a display panel and a fixing metal plate for securing the display control printed circuit board. The display control printed circuit board is provided with identification information reading means for reading identification information of the display panel, a memory stored with set values for generating display signals corresponding to the sizes of a plurality of display panels, and a display controller configured to generate the display signals. The fixing metal plate comprises one or more members electrically connected to the display control printed circuit board and configured to transmit the identification information of the display unit to the display control printed circuit board. The identification information reading means reads a set value for the display panel from the memory, based on the identification information of the display panel derived from the one or more electrically connected members, and sets the set values in the display controller configured to generate the display signals.
Abstract translation: 公开了一种具有显示控制印刷电路板的显示单元，电路被配置为产生用于显示面板显示的显示信号和用于固定显示控制印刷电路板的固定金属板。 显示控制印刷电路板设置有用于读取显示面板的识别信息的识别信息读取装置，存储有用于生成对应于多个显示面板的尺寸的显示信号的设定值的存储器和被配置为产生 显示信号。 固定金属板包括电连接到显示控制印刷电路板的一个或多个构件，并被配置为将显示单元的识别信息传送到显示控制印刷电路板。 识别信息读取装置基于从一个或多个电气连接的构件导出的显示面板的识别信息，从存储器读取显示面板的设定值，并且将配置为生成显示的显示控制器中的设定值 信号。
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公开(公告)号：US09392691B2
公开(公告)日：2016-07-12
申请号：US14332776
申请日：2014-07-16
Applicant: International Business Machines Corporation
Inventor： Ai Kiar Ang , Michael Lauri
CPC classification number: H05K1/11 , H01L21/4839 , H01L23/49537 , H01L23/49555 , H01L23/49565 , H01L23/49575 , H01L25/105 , H01L25/50 , H01L2225/1029 , H01L2924/181 , H05K1/0313 , H05K1/144 , H05K1/18 , H05K1/181 , H05K3/328 , H05K3/341 , H05K3/3421 , H05K3/3426 , H05K2201/10015 , H05K2201/10227 , H05K2201/10515 , H05K2201/1053 , H05K2201/10962 , Y02P70/613 , H01L2924/00012
Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
Abstract translation: 一种方法包括形成具有两个或更多个电子部件的多层电子器件，每个电子部件包括引线框，每个电子部件的引线框架使用非焊接金属接合工艺物理地接合在一起以形成接头，并且 接头位于焊接连接区域的外侧。
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公开(公告)号：US20160044785A1
公开(公告)日：2016-02-11
申请号：US14885405
申请日：2015-10-16
Applicant: International Business Machines Corporation
Inventor： Ai Kiar Ang , Michael Lauri
CPC classification number: H05K1/11 , H01L21/4839 , H01L23/49537 , H01L23/49555 , H01L23/49565 , H01L23/49575 , H01L25/105 , H01L25/50 , H01L2225/1029 , H01L2924/181 , H05K1/0313 , H05K1/144 , H05K1/18 , H05K1/181 , H05K3/328 , H05K3/341 , H05K3/3421 , H05K3/3426 , H05K2201/10015 , H05K2201/10227 , H05K2201/10515 , H05K2201/1053 , H05K2201/10962 , Y02P70/613 , H01L2924/00012
Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
Abstract translation: 一种方法包括形成具有两个或多个电子部件的多层电子器件，每个电子部件包括引线框，每个电子部件的引线框架使用非焊接金属接合工艺物理地接合在一起以形成接头，并且 接头位于焊接连接区域的外侧。
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